R9A09G057H46GBG#BC0
| Part Description |
RZ/V2H CA55 QUAD GPU SECURE 19MM |
|---|---|
| Quantity | 119 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H46GBG#BC0 – RZ/V2H CA55 QUAD GPU SECURE 19MM
The R9A09G057H46GBG#BC0 is a microprocessor IC designed for industrial embedded applications. It is built around an ARM® Cortex®-A53 core architecture and provides a 2-core, 64-bit processor operating at up to 1.8 GHz.
Its feature set targets industrial systems requiring integrated memory support, modern display and I/O interfaces, and on-chip security primitives for encrypted and authenticated operation. The device is supplied in an 841-FBGA (15×15) package and is qualified for industrial temperature operation.
Key Features
- Core & Performance Dual ARM® Cortex®-A53 64-bit cores running at up to 1.8 GHz, providing compute capability for control and application tasks.
- Security Subsystem On-chip security features including AES, ARC4, RSA, SHA-224, SHA-256 and a TRNG to support encrypted storage, secure boot and cryptographic operations.
- Memory Support LPDDR4 memory controller support for high-bandwidth system memory suitable for multimedia and data buffering.
- Display and Multimedia Interfaces Integrated display controllers supporting DP, HDMI and LCD outputs to enable advanced HMI and visualization designs.
- Connectivity Integrated GbE (1) Ethernet and USB 3.1 (1) host/device I/O for high-speed networking and peripheral connectivity.
- Package & Mounting 841-FBGA (15×15) supplier device package in a surface-mount form factor for compact board-level integration.
- Industrial Qualification & Temperature Range Qualified for industrial use with an operating temperature range of −40°C to 125°C.
- Regulatory Compliance RoHS-compliant material status to support restricted-substance requirements.
Typical Applications
- Industrial Control Systems — Dual-core Cortex-A53 processing and industrial qualification make the device suitable for embedded controllers and machine interfaces that require secure operation across wide temperatures.
- Human–Machine Interfaces (HMI) — DP, HDMI and LCD display controllers enable rich operator displays and graphical interfaces for industrial panels and kiosks.
- Secure Embedded Devices — Built-in AES, RSA, SHA and TRNG support local cryptographic functions for device authentication, secure storage and encrypted communications.
- Networked Edge Equipment — GbE and USB 3.1 connectivity provide the I/O required for network-attached instrumentation and data acquisition devices.
Unique Advantages
- Integrated Security Primitives: AES, ARC4, RSA, SHA-224, SHA-256 and TRNG provide a foundation for implementing device-level cryptography without external accelerators.
- Modern Display Support: DP, HDMI and LCD controllers simplify integration of high-resolution operator displays and video outputs.
- High-Speed I/O: USB 3.1 and Gigabit Ethernet deliver the throughput needed for peripherals and network connectivity in industrial systems.
- Industrial-Grade Operation: Specified operation from −40°C to 125°C and industrial qualification support deployment in harsh environments.
- Compact Surface-Mount Package: 841-FBGA (15×15) package enables space-efficient board designs while providing a high pin count for system integration.
- LPDDR4 Memory Interface: High-bandwidth memory support for multimedia buffering and data-intensive tasks.
Why Choose R9A09G057H46GBG#BC0?
The R9A09G057H46GBG#BC0 combines a dual ARM® Cortex®-A53 64-bit processor at 1.8 GHz with a broad set of interfaces and on-chip security features to serve industrial embedded designs that require performance, connectivity and secure operation. Its LPDDR4 support and display controllers make it suitable for applications demanding multimedia and human interface capabilities.
With industrial temperature qualification, an 841-FBGA surface-mount package and RoHS compliance, this device is positioned for robust, long-term deployment in industrial and networked embedded systems where integration and reliability are priorities.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016