R9A09G057H46GBG#AC0
| Part Description |
RZ/V2H CA55 QUAD GPU SECURE 19MM |
|---|---|
| Quantity | 327 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H46GBG#AC0 – RZ/V2H CA55 QUAD GPU SECURE 19MM
The R9A09G057H46GBG#AC0 is a microprocessor IC designed for embedded systems, based on an ARM® Cortex®-A53 core architecture. It delivers up to 1.8 GHz processing performance in a 64-bit, 2-core configuration with integrated multimedia acceleration and NEON™ SIMD support.
Built for industrial environments, this device combines display and high-speed connectivity interfaces with on-chip security engines and LPDDR4 memory controller support, offering a compact, robust building block for secure, high-performance embedded designs.
Key Features
- Core & Performance — ARM® Cortex®-A53 64-bit processor architecture running at up to 1.8 GHz in a 2-core configuration for general-purpose embedded compute.
- Co-processors & Multimedia — Multimedia co-processor with NEON™ SIMD support to accelerate signal and media processing workloads.
- Memory — Integrated LPDDR4 memory controller support to enable high-bandwidth system memory configurations.
- Display Interfaces — On-chip display interface controllers including DisplayPort (DP), HDMI and LCD outputs for advanced HMI and video applications.
- Connectivity — Built-in GbE (1) and USB 3.1 (1) interfaces to support high-speed networking and peripheral connectivity.
- Security — Hardware security features including AES, ARC4, RSA, SHA-224, SHA-256 and a TRNG for cryptographic operations and secure key generation.
- Package & Mounting — Supplied in an 841-FBGA (15×15) package designed for surface-mount assembly.
- Operating Range & Qualification — Industrial-qualified device rated for operation from -40°C to 125°C.
Typical Applications
- Industrial HMI and Displays — Use DP, HDMI and LCD controllers to drive high-resolution operator interfaces and visual dashboards in industrial environments.
- Secure Edge Gateways — Combine GbE and USB 3.1 connectivity with on-chip cryptographic engines to implement secure data aggregation and transfer at the edge.
- Multimedia Embedded Systems — Leverage NEON™ SIMD and multimedia co-processing for video processing, streaming and display-centric embedded appliances.
- Rugged Embedded Controllers — Industrial temperature rating and robust packaging make this part suitable for embedded controllers operating across wide temperature ranges.
Unique Advantages
- Balanced CPU Performance: Dual 64-bit Cortex-A53 cores at up to 1.8 GHz provide a solid mix of performance and efficiency for embedded workloads.
- Integrated Multimedia and Display Support: Native DP, HDMI and LCD controllers simplify designs that require rich visual output without adding external display bridge ICs.
- High-speed I/O: GbE and USB 3.1 interfaces enable fast data movement to and from the device for networking and peripheral connectivity.
- Comprehensive Hardware Security: On-chip AES, RSA, SHA-224/SHA-256, ARC4 and TRNG support secure boot, encryption and runtime protection strategies.
- Industrial-grade Reliability: Qualification for industrial use and an operating range of -40°C to 125°C support deployment in harsh environments.
- Compact, Surface-mount Package: The 841-FBGA (15×15) package allows high-density PCB integration for space-constrained embedded systems.
Why Choose R9A09G057H46GBG#AC0?
R9A09G057H46GBG#AC0 is positioned for embedded designers who need a compact, industrial-grade microprocessor with multimedia capabilities, secure hardware features and modern I/O. Its combination of ARM® Cortex®-A53 processing, LPDDR4 memory support, display interfaces and cryptographic engines makes it suitable for applications that demand both compute and secure connectivity.
Selecting this part supports robust, long-term embedded designs where temperature tolerance, integrated interfaces and on-chip security reduce system complexity and component count while meeting industrial operating requirements.
Request a quote or submit a purchase inquiry for R9A09G057H46GBG#AC0 to initiate availability and pricing details tailored to your project requirements.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016