R9A09G057H44GBG#AC0

RZ/V2H CA55 QUAD ISP&GPU 19MM BU
Part Description

RZ/V2H CA55 QUAD ISP&GPU 19MM BU

Quantity 4 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A09G057
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A53Device Package841-FBGA (15x15)
Display & Interface ControllersDP, HDMI, LCDECCN5A002AEthernetGbE (1)
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width2 Core, 64-BitOperating Temperature-40 °C – 125 °CPackage / Case841-FBGA
QualificationIndustrialRAM ControllersLPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.8 GHzUSBUSB 3.1 (1)
Voltage – I/O1.8 V – 3.3 V

Overview of R9A09G057H44GBG#AC0 – RZ/V2H CA55 QUAD ISP&GPU 19MM BU

The R9A09G057H44GBG#AC0 is a microprocessor IC based on ARM® Cortex®-A53 architecture. It combines a 2-core, 64-bit application processor running up to 1.8 GHz with multimedia extensions and a suite of peripheral interfaces targeted at embedded and industrial designs.

With LPDDR4 memory support, multiple display controllers and integrated security engines, this device is positioned for industrial-grade embedded applications that require performance, connectivity and on-chip security across a wide operating temperature range.

Key Features

  • Core & Performance  ARM® Cortex®-A53 cores (2-core, 64-bit) running at up to 1.8 GHz, delivering balanced compute performance for embedded workloads.
  • Multimedia & SIMD  Multimedia co‑processor support with NEON™ SIMD for accelerated media processing and signal handling.
  • Memory  LPDDR4 memory controller support for high-bandwidth system memory.
  • Display Controllers  Integrated controllers for DisplayPort (DP), HDMI and LCD interfaces to support graphics and display outputs.
  • Connectivity  On-chip networking and host interfaces including one Gigabit Ethernet (GbE) port and one USB 3.1 port for high-speed I/O connectivity.
  • Security  Hardware security features including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG) for cryptographic functions and secure operation.
  • Industrial Qualification & Temperature Range  Qualified for industrial applications with an operating temperature range of −40 °C to 125 °C.
  • Package & Mounting  Supplied in an 841-FBGA (15 × 15 mm) package for surface-mount assembly.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Automation  Use in control and monitoring systems where industrial qualification and wide temperature operation are required.
  • Human–Machine Interfaces (HMI)  Drive displays and user interfaces using the integrated DP, HDMI and LCD controllers coupled with multimedia processing.
  • Imaging & Vision  Leverage multimedia processing and the ISP/GPU designation in the product name for embedded vision and image-handling tasks.

Unique Advantages

  • Balanced compute and multimedia capability: 2× ARM® Cortex®-A53 cores with NEON™ SIMD provide a mix of general-purpose and media-accelerated processing.
  • Integrated display and I/O set: Native DP, HDMI, LCD, GbE and USB 3.1 reduce external component count and simplify system integration.
  • On-chip security engines: AES, ARC4, RSA, SHA-224, SHA-256 and TRNG support secure communications and data protection without additional hardware.
  • Industrial-ready thermal range: Rated from −40 °C to 125 °C for reliable operation in harsh environments.
  • Compact BGA package: 841-FBGA (15 × 15 mm) enables a dense board layout while supporting surface-mount assembly processes.

Why Choose R9A09G057H44GBG#AC0?

The R9A09G057H44GBG#AC0 positions itself as a versatile embedded microprocessor with a validated industrial temperature range, integrated multimedia support and a comprehensive set of security primitives. Its combination of Cortex‑A53 processing, LPDDR4 memory interface and display/connectivity controllers makes it suitable for designs that require on-chip multimedia capability and robust connectivity.

This part is well suited to engineering teams building industrial HMI, imaging/vision modules or other embedded systems that demand secure operation across extended temperatures, compact packaging and straightforward integration of display and high-speed I/O.

Request a quote or submit an inquiry to get pricing and availability details for the R9A09G057H44GBG#AC0. Our team can help with lead times and volume options to support your design schedule.

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