R9A09G057H41GBG#BC0
| Part Description |
RZ/V2H CA55 QUAD 19MM FULL |
|---|---|
| Quantity | 432 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H41GBG#BC0 – RZ/V2H CA55 QUAD 19MM FULL
The R9A09G057H41GBG#BC0 is a microprocessor IC for embedded applications built around an ARM® Cortex®-A53 core architecture. It operates up to 1.8 GHz and implements a 64-bit, dual-core configuration to support compute and multimedia workloads.
Designed and qualified for industrial use, the device integrates LPDDR4 memory controller support, multimedia acceleration via NEON™ SIMD, a suite of display interfaces and modern connectivity (USB 3.1, Gigabit Ethernet), along with hardware security primitives to address deployment requirements in industrial embedded systems.
Key Features
- Core ARM® Cortex®-A53 64-bit processor, dual-core configuration with clocking up to 1.8 GHz for general-purpose and multimedia processing.
- Memory Integrated LPDDR4 memory controller support to enable high-bandwidth system memory configurations.
- Multimedia and DSP NEON™ SIMD multimedia co-processor and DSP capabilities for accelerated signal and media processing tasks.
- Display Interfaces Support for DisplayPort (DP), HDMI and LCD controllers to drive modern visual and HMI displays.
- Connectivity Single Gigabit Ethernet (GbE) interface and one USB 3.1 port for high-speed wired networking and peripheral connectivity.
- Security On-chip security features including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG) for cryptographic functions.
- Package & Mounting 841-ball FBGA package (15 × 15 mm) designed for surface-mount assembly.
- Operating Range & Qualification Industrial qualification with an operating temperature range of −40 °C to 125 °C and RoHS compliance for regulated environments.
Typical Applications
- Industrial Control & Automation Industrial-qualified temperature range and networking support make the device suitable for controllers, gateways and embedded supervisory systems.
- Human–Machine Interfaces (HMI) DP/HDMI/LCD display controllers combined with multimedia acceleration support responsive graphical interfaces and visualization panels.
- Edge Multimedia Processing NEON SIMD and DSP capabilities enable local media processing, encoding/decoding or image pre-processing at the network edge.
- Networked Embedded Devices Gigabit Ethernet and USB 3.1 provide the connectivity needed for industrial networking nodes, data acquisition systems and communication gateways.
Unique Advantages
- Balanced compute and multimedia Dual 64‑bit Cortex‑A53 cores with NEON SIMD deliver a combination of general-purpose processing and media acceleration in a single device.
- Integrated display and I/O Multiple display controllers plus USB 3.1 and GbE reduce external component count for HMI and edge systems.
- Industrial-ready operating range Rated from −40 °C to 125 °C to support deployment in demanding industrial environments.
- Built-in security primitives Hardware AES, RSA, SHA and TRNG support on-chip cryptographic functions to simplify secure system design.
- Compact surface-mount package 841-ball FBGA (15 × 15 mm) provides a high-pin-count, space-efficient form factor for compact embedded boards.
- RoHS compliant Conforms to RoHS environmental requirements for regulated manufacturing and distribution.
Why Choose R9A09G057H41GBG#BC0?
The R9A09G057H41GBG#BC0 positions itself as an industrial-grade embedded microprocessor offering a practical blend of compute performance, multimedia acceleration and integrated I/O. Its Cortex‑A53-based dual-core 64‑bit architecture at up to 1.8 GHz, combined with LPDDR4 support and multiple display and connectivity interfaces, makes it well suited to HMI, edge multimedia and networked industrial applications.
With on-chip security features and an extended operating temperature range, this device supports robust, secure deployments in industrial environments while minimizing external components and simplifying board-level design.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the R9A09G057H41GBG#BC0 microprocessor.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016