R9A09G055MA3GBG#BCC

The R9A09G055MA3GBG#BCC is an ARM® Cortex®‑A53 based microprocessor from the RZ/V2MA family, featuring a dual 64‑bit core configuration running at 996 MHz in an 841‑FBGA (15×15) package. Built for embedded applications, it integrates high‑performance compute, multimedia DSP support, multiple display and I/O interfaces, and hardware security primitives.

Qualified for industrial use and specified for operation from -40 °C to 125 °C, this device targets embedded systems that require sustained processing performance, display connectivity, and secure system features in demanding thermal environments.

Key Features

• Processor Cores  Dual ARM® Cortex®‑A53 64‑bit cores, operating at up to 996 MHz to deliver multi‑threaded application performance for embedded workloads.
• Multimedia and SIMD  Integrated multimedia co‑processor support with NEON™ SIMD acceleration for optimized media and signal processing tasks.
• Memory Support  LPDDR4 memory controller for modern low‑power, high‑bandwidth DRAM interfaces.
• Display Interfaces  Native controllers for DisplayPort (DP), HDMI, and LCD, enabling a range of display connectivity options.
• High‑Speed I/O  Single Gigabit Ethernet port and one USB 3.1 port provide high‑throughput network and peripheral connectivity.
• Additional Camera Interface  CSI interface for camera and image sensor integration in vision or imaging applications.
• Hardware Security  On‑chip security primitives including AES, ARC4, RSA, SHA‑224, SHA‑256 and a true random number generator (TRNG) to support secure boot and cryptographic functions.
• Industrial Qualification & Temperature Range  Specified for industrial qualification with an operating temperature range of -40 °C to 125 °C.
• Package & Mounting  841‑FBGA (15×15) package in surface‑mount form factor for compact, board‑level integration.

Typical Applications

• Industrial Embedded Systems  Industrial controllers and monitoring platforms benefiting from the device’s industrial temperature rating, dual‑core processing, and secure features.
• Human‑Machine Interfaces (HMIs)  HMI designs that require display connectivity (HDMI, DP, LCD) and responsive UI performance driven by the Cortex‑A53 cores and NEON acceleration.
• Networked Devices  Embedded network appliances and IoT gateways leveraging the integrated Gigabit Ethernet and USB 3.1 connectivity.

Unique Advantages

• Balanced Performance and Efficiency: Dual Cortex‑A53 64‑bit cores at 996 MHz provide a practical balance of compute capacity and power characteristics for embedded workloads.
• Integrated Display and Camera Support: Built‑in DP, HDMI, LCD and CSI interfaces reduce external component count for systems requiring rich multimedia and imaging capabilities.
• Robust Security Primitives: On‑chip AES, RSA, SHA‑224/256 and TRNG support enable hardware‑centric cryptographic functions to secure data and boot processes.
• Industrial Temperature Range: Operation from -40 °C to 125 °C suits deployments in harsh or wide‑temperature environments.
• Modern Memory Interface: LPDDR4 controller support allows use of contemporary low‑power, high‑bandwidth DRAM for responsive system performance.
• Compact Surface‑Mount Packaging: 841‑FBGA (15×15) facilitates high‑density board designs while supporting reliable surface‑mount assembly.

Why Choose R9A09G055MA3GBG#BCC?

The R9A09G055MA3GBG#BCC positions itself as a capable embedded microprocessor that combines dual‑core ARM® Cortex®‑A53 compute, multimedia SIMD support, comprehensive display and I/O connectivity, and hardware security features within an industrial‑rated package. It is suited for designs that require a mix of application processing, secure operation, and multiple peripheral interfaces in a compact surface‑mount form factor.

For development teams and procurement focused on embedded, industrial applications, this device offers a clear set of verifiable attributes—performance, memory interface, display and network I/O, and a broad security feature set—enabling robust, scalable product designs based on the RZ/V2MA series.

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