R9A09G011GBG#BCV

IC MPU RZ/V 996MHZ 841FBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC RZ/V 2 Core, 64-Bit 996MHz 841-FBGA (15x15)

Quantity 1,281 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A09G011
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A53Device Package841-FBGA (15x15)
Display & Interface ControllersDP, HDMI, LCDECCNN/AEthernetGbE (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case841-FBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, RSA, SHA-224, SHA-256, TRNG
Speed996MHzSupplier Device Package841-FBGA (15×15)USBUSB 3.1 (1)
Voltage – I/O1.8V, 3.3V

Overview of R9A09G011GBG#BCV – ARM Cortex‑A53 2‑Core 996 MHz MPU, 841‑FBGA

The R9A09G011GBG#BCV from Renesas is an ARM® Cortex®‑A53 microprocessor IC configured as a 2‑core, 64‑bit MPU running at 996 MHz in an 841‑ball FBGA (15×15) package. Targeted for embedded and industrial systems, it combines compute performance with multimedia and security features to support display, connectivity and edge processing tasks.

Key Features

  • Core — Dual ARM® Cortex®‑A53 cores, 64‑bit architecture, operating at up to 996 MHz for multi‑threaded embedded workloads.
  • Memory — LPDDR4 memory controller support to enable high‑bandwidth system memory for multimedia and data processing.
  • Display & Graphics — Integrated graphics acceleration with display interface controllers for DisplayPort (DP), HDMI and LCD panels to drive rich user interfaces.
  • Connectivity — On‑board Gigabit Ethernet (1) and a USB 3.1 port (1) for high‑speed wired networking and peripheral connectivity; additional CSI interface for camera input.
  • Security — Hardware security features including AES, ARC4, RSA, SHA‑224, SHA‑256 and a True Random Number Generator (TRNG) for cryptographic operations and secure boot/builds.
  • Package & Mounting — 841‑FBGA (15×15) supplier device package, designed for surface‑mount assembly in space‑constrained designs.
  • Industrial Temperature Range — Rated for operation from −40°C to 125°C and qualified for industrial use, suitable for harsh ambient environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Industrial Control & Automation — Deterministic embedded compute and connectivity for control systems operating across −40°C to 125°C environments.
  • Human‑Machine Interfaces (HMI) — Drive high‑resolution displays via DP, HDMI or LCD interfaces with onboard graphics acceleration for responsive UIs.
  • Multimedia Edge Devices — Process video input via CSI and accelerate media workloads with NEON™ SIMD and graphics capabilities.
  • Networked Embedded Systems — Integrate Gigabit Ethernet and USB 3.1 connectivity for high‑throughput data transfer and peripheral support.

Unique Advantages

  • Balanced Multi‑core Performance: Dual Cortex‑A53 cores at 996 MHz provide a balance of compute throughput and power efficiency for embedded workloads.
  • Integrated Multimedia Support: Display controllers (DP, HDMI, LCD), CSI input and graphics acceleration reduce external component requirements for video and UI designs.
  • Robust Security Primitives: On‑chip AES, RSA, SHA families and TRNG support secure communication, authentication and cryptographic operations.
  • Industrial‑Grade Operation: Industrial qualification and −40°C to 125°C operating range enable deployment in demanding ambient conditions.
  • Compact Surface‑Mount Package: 841‑FBGA (15×15) package optimizes PCB area for space‑constrained embedded assemblies.

Why Choose R9A09G011GBG#BCV?

The R9A09G011GBG#BCV delivers a practical combination of dual Cortex‑A53 compute, multimedia I/O and hardware security in an industrially qualified package. Its LPDDR4 memory support, display interfaces and high‑speed connectivity make it suitable for embedded systems that require integrated media handling, secure communications and reliable operation across a wide temperature range.

This MPU is well suited to engineering teams building industrial HMI, multimedia edge devices and networked embedded platforms that benefit from reduced BOM complexity, onboard security primitives and a compact FBGA footprint.

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