R9A09G011GBG#ACC

IC MPU RZ/V 996MHZ 841FBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC RZ/V 2 Core, 64-Bit 996MHz 841-FBGA (15x15)

Quantity 1,691 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A09G011
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A53Device Package841-FBGA (15x15)
Display & Interface ControllersDP, HDMI, LCDECCN3A991A2EthernetGbE (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case841-FBGARAM ControllersLPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARC4, RSA, SHA-224, SHA-256, TRNG
Speed996MHzSupplier Device Package841-FBGA (15×15)USBUSB 3.1 (1)
Voltage – I/O1.8V, 3.3V

Overview of R9A09G011GBG#ACC – ARM Cortex-A53 2-Core 996MHz MPU

The R9A09G011GBG#ACC is an ARM® Cortex®-A53 microprocessor IC featuring two 64-bit cores running at 996 MHz in an 841‑FBGA (15×15) package. Designed and qualified for industrial use, this MPU integrates multimedia co-processing, memory controllers, and a broad set of high-speed interfaces for embedded systems that require secure, connected compute and display/camera capabilities.

Key Features

  • Core & Performance  Dual ARM® Cortex®-A53 64-bit cores at 996 MHz provide deterministic processing performance for embedded applications.
  • Multimedia & SIMD  Integrated multimedia co-processor and NEON™ SIMD support enable efficient data-parallel and signal-processing workloads.
  • Memory  LPDDR4 memory controller support for modern, high-bandwidth memory configurations.
  • Display & Camera  Display interface controllers include DP, HDMI and LCD outputs; additional CSI interface supports camera input integration.
  • Connectivity  Built-in Gigabit Ethernet (1) and USB 3.1 (1) deliver high-speed wired networking and peripheral connectivity.
  • Security  Hardware security features include AES, ARC4, RSA, SHA-224, SHA-256 and a TRNG for cryptographic and entropy needs.
  • Package & Mounting  Supplied in an 841‑FBGA (15×15) package for surface-mount assembly.
  • Qualification & Temperature Range  Industrial qualification with an operating temperature range of -40 °C to 125 °C for deployment in harsh environments.
  • Graphics Acceleration  No dedicated graphics acceleration is included; system-level graphics behavior should be designed accordingly.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Compute and communication functions in industrial automation systems that require industrial temperature qualification and wired networking.
  • Human-Machine Interfaces  Display-driven user interfaces using HDMI, DP or LCD outputs paired with LPDDR4 memory for responsive operation.
  • Smart Cameras & Vision  Camera interfacing via CSI combined with NEON SIMD and multimedia co-processing for embedded image and signal processing tasks.
  • Connected Edge Devices  Edge appliances and gateways needing Gigabit Ethernet and USB 3.1 for high-speed data transfer and peripheral support.

Unique Advantages

  • 64-bit Dual-Core Performance: Two ARM® Cortex®-A53 cores at 996 MHz provide balanced multi-threaded processing for embedded workloads.
  • Integrated Multimedia Support: Multimedia co-processor and NEON SIMD enable efficient handling of media and signal-processing tasks without external accelerators.
  • Comprehensive I/O Suite: DP, HDMI, LCD and CSI display/camera interfaces plus GbE and USB 3.1 simplify system integration for connected, multimedia-enabled devices.
  • Robust Industrial Ratings: Industrial qualification and an operating range of -40 °C to 125 °C support reliable operation in demanding environments.
  • Hardware Security Primitives: On-chip AES, ARC4, RSA, SHA-224/256 and TRNG provide built-in cryptographic capabilities for secure applications.
  • Compact Surface-Mount Package: 841‑FBGA (15×15) packaging supports high-density PCB designs while enabling surface-mount assembly.

Why Choose R9A09G011GBG#ACC?

The R9A09G011GBG#ACC positions itself as a performance-oriented, industrially qualified MPU that consolidates compute, multimedia processing, secure cryptography and multiple high-speed interfaces in a compact 841‑FBGA package. Its dual 64-bit Cortex‑A53 cores, LPDDR4 memory controller and hardware security features make it suitable for embedded systems that require secure connectivity, display/camera integration and reliable operation across a wide temperature range.

This part is aimed at designers of industrial and embedded systems who need integrated multimedia and connectivity capabilities with industrial-grade temperature and qualification characteristics, enabling long-term deployments that demand robustness and on-chip security primitives.

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