R9A09G055MA3GBG#ACC
| Part Description |
ARM® Cortex®-A53 Microprocessor IC RZ/V2MA 2 Core, 64-Bit 996MHz 841-FBGA (15x15) |
|---|---|
| Quantity | 1,272 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G055 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | N/A | Ethernet | GbE (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 841-FBGA | RAM Controllers | LPDDR4 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 996MHz | ||
| Supplier Device Package | 841-FBGA (15×15) | USB | USB 3.1 (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A09G055MA3GBG#ACC – IC MPU RZ/V2MA 996MHz 841-FBGA
The R9A09G055MA3GBG#ACC is an ARM® Cortex®-A53 based microprocessor (RZ/V2MA) featuring dual 64-bit cores running at 996 MHz in an 841-FBGA (15×15) surface-mount package. Designed for embedded and industrial applications, it combines processing performance with a broad set of integrated interfaces and security functions.
This device targets systems that require on-chip display and camera connectivity, wired and high-speed USB connectivity, LPDDR4 memory support, and hardware cryptographic functions while meeting industrial operating conditions and RoHS compliance.
Key Features
- Core Dual ARM® Cortex®-A53 64-bit processor cores operating at 996 MHz, suitable for general embedded compute tasks.
- Multimedia DSP NEON™ SIMD multimedia co-processor for media and signal processing acceleration.
- Memory Integrated LPDDR4 memory controller for modern high-bandwidth memory interfaces.
- Display and Camera Multiple display interface controllers including DisplayPort (DP), HDMI and LCD, plus a CSI camera interface for imaging applications.
- Connectivity Built-in Gigabit Ethernet (1) and one USB 3.1 port for networked and high-speed peripheral connectivity.
- Security Hardware security features including AES, ARC4, RSA, SHA-224, SHA-256 and a True Random Number Generator (TRNG).
- Package & Mounting 841-FBGA (15×15) supplier device package with surface-mount mounting type.
- Qualification & Environmental Industrial qualification and RoHS compliant; rated for operation from -40°C to 125°C.
Typical Applications
- Industrial Control Processors for industrial controllers and automation equipment where industrial qualification and wide temperature range are required.
- Multimedia Devices Embedded media players and appliances that use NEON™ SIMD and integrated display outputs (DP, HDMI, LCD).
- Edge Networking Networked edge devices leveraging Gigabit Ethernet and USB 3.1 connectivity for data transfer and peripheral support.
- Vision and Imaging Camera-enabled systems and machine vision designs that utilize the CSI interface and on-chip processing.
- Human-Machine Interfaces (HMI) Operator panels and display-driven interfaces requiring integrated display controllers and responsive application processing.
Unique Advantages
- Balanced dual-core performance: Two 64-bit Cortex-A53 cores at 996 MHz provide a practical balance of compute headroom for embedded workloads.
- Integrated multimedia and imaging I/O: DP, HDMI, LCD and CSI interfaces reduce external component requirements for display and camera subsystems.
- Comprehensive on-chip security: AES, ARC4, RSA, SHA-224/256 and TRNG hardware blocks support secure booting and data protection strategies.
- Modern memory support: LPDDR4 controller enables connection to high-bandwidth, low-latency memory suitable for multimedia and data buffering.
- Industrial readiness: Industrial qualification and -40°C to 125°C operating range address designs deployed in demanding environments.
- Compact surface-mount package: 841-FBGA (15×15) package offers a space-efficient footprint for compact system designs.
Why Choose R9A09G055MA3GBG#ACC?
The R9A09G055MA3GBG#ACC positions itself as a highly integrated processor option for embedded and industrial systems that require a combination of general-purpose compute, multimedia capability, camera support, wired networking and robust on-chip security. Its dual ARM® Cortex®-A53 cores at 996 MHz and LPDDR4 memory controller provide practical performance for application and interface workloads.
With industrial qualification, a wide operating temperature range and RoHS compliance, this part is suited for designs where environmental resilience and manufacturability matter. The integrated I/O set helps simplify system design by reducing external components for display, camera and connectivity subsystems.
Request a quote or submit an inquiry to receive pricing and availability information for R9A09G055MA3GBG#ACC. Our team can provide lead-time details and support for your procurement and design planning.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016