R9A08G045S35GBG#BC0

SOC RZ/G3S 13BGA SECURE 1+2CPU(F
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 1,723 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.1GHz
Supplier Device Package361-LFBGA (13×13)USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S35GBG#BC0 – ARM Cortex‑A55 1.1 GHz 1‑Core SoC (361‑LFBGA)

The R9A08G045S35GBG#BC0 is a Renesas RZ/G3S system-on-chip featuring a single ARM® Cortex®‑A55 application core running at up to 1.1 GHz with an ARM® Cortex®‑M33 coprocessor. It integrates high‑performance processing, hardware security primitives and multiple high‑speed interfaces to address embedded and industrial applications that require secure, connected compute.

With DDR4/LPDDR4 memory controller support, dual Gigabit Ethernet ports, USB 2.0 OTG and hardware security features including AES, RSA and Secure Boot, this device is designed to simplify system integration while meeting industrial temperature and qualification requirements.

Key Features

  • Core and Processing Single ARM® Cortex®‑A55 64‑bit application core at up to 1.1 GHz, paired with an ARM® Cortex®‑M33 coprocessor for auxiliary or real‑time tasks.
  • Memory Integrated controllers for DDR4 and LPDDR4 memories to support system and application memory needs.
  • Connectivity Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 OTG controllers provide high‑throughput wired networking and USB device/host capability.
  • Security Built‑in security features including AES, ARM TrustZone (TZ), Hash, RSA, Secure Boot and a True Random Number Generator (TRNG) for secure system deployment and cryptographic operations.
  • System Interfaces DMA support for efficient data movement between peripherals and memory, simplifying high‑performance I/O designs.
  • Package and Temperature 361‑LFBGA package (13 × 13 mm) and industrial operating temperature range of −40 °C to 85 °C to meet demanding environmental requirements.
  • Qualification Industrial qualification for use in industrial embedded systems and related applications.

Typical Applications

  • Industrial Control and Automation — Industrial qualification and wide operating temperature support embedded control, monitoring and gateway functions in factory and process environments.
  • Secure Edge Devices — On‑chip AES, RSA, Secure Boot and TRNG enable secure boot and cryptographic protection for edge computing platforms.
  • Networked Embedded Systems — Dual Gigabit Ethernet and USB 2.0 OTG support networked appliances, routers, and communication gateways requiring robust wired connectivity.
  • Embedded Human‑Machine Interfaces — Single‑core application processing with coprocessor offload supports responsive UI control and real‑time peripheral management.

Unique Advantages

  • Balanced Compute and Real‑Time Offload: Combination of an ARM® Cortex®‑A55 application core and Cortex®‑M33 coprocessor lets designers separate application and real‑time tasks without added components.
  • Integrated Security Primitives: AES, RSA, Hash, ARM TrustZone, Secure Boot and TRNG reduce the need for external security ICs and simplify secure system design.
  • Dual Gigabit Ethernet: Two 10/100/1000 Mbps ports provide robust wired networking options for industrial and networked embedded applications.
  • Flexible Memory Support: DDR4 and LPDDR4 controllers accommodate a range of performance and power tradeoffs for system memory.
  • Industrial‑Grade Operation: Industrial qualification and −40 °C to 85 °C operating range support deployment in harsh environments.
  • Compact Package: 361‑LFBGA (13 × 13 mm) enables a compact board footprint for space‑constrained embedded designs.

Why Choose R9A08G045S35GBG#BC0?

The R9A08G045S35GBG#BC0 positions itself as a secure, integration‑focused SoC for embedded and industrial designs that need a mix of application compute, real‑time coprocessing and robust connectivity. Its combination of an ARM® Cortex®‑A55 core, Cortex®‑M33 coprocessor, memory controller options and hardware security features streamlines system architecture and reduces component count.

Designed for industrial operation and supplied in a compact 361‑LFBGA package, it is well suited to customers developing networked edge devices, secure appliances and control systems that require long‑term reliability and proven silicon from Renesas.

Request a quote or submit an inquiry to get pricing and availability for R9A08G045S35GBG#BC0 and discuss volume, lead times or integration support.

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