R9A08G045S17GBG#BC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 528 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.1GHz | ||
| Supplier Device Package | 361-LFBGA (13×13) | USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S17GBG#BC0 – ARM® Cortex®-A55 Microprocessor IC, 1 Core 64‑Bit 1.1 GHz
The R9A08G045S17GBG#BC0 is a Renesas RZ/G3S series system-on-chip featuring a single ARM® Cortex®-A55 64‑bit core running at 1.1 GHz with an ARM® Cortex®-M33 coprocessor. It integrates high-speed memory controllers and multiple I/O interfaces to support embedded and industrial designs that require processing, connectivity, and hardware security.
Qualified for industrial use and offered in a 361‑LFBGA (13×13) package with an operating range of −40 °C to 85 °C, this device targets applications that need secure, compact, and connected processing in rugged environments.
Key Features
- Core & Architecture Single ARM® Cortex®-A55 64‑bit application core at 1.1 GHz with an ARM® Cortex®-M33 coprocessor for control and real-time tasks.
- Memory Integrated controllers for DDR4 and LPDDR4 memory to support modern high-bandwidth system designs.
- Connectivity Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 OTG interfaces provide wired networking and peripheral connectivity.
- Security Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot, and a True Random Number Generator (TRNG) for secure system design.
- Package & Mounting 361‑LFBGA (13×13) package, surface-mount construction suitable for compact board designs.
- Operating Range & Qualification Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
- Graphics No graphics acceleration; suited to compute, control, and communications-focused embedded applications.
- System Support DMA and additional interfaces on-chip to facilitate efficient data movement and peripheral integration.
- Compliance RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- Industrial Automation Control and communication nodes that require industrial temperature operation, secure boot, and wired networking.
- Embedded Networking Equipment Gateways, protocol bridges or edge appliances leveraging dual Gigabit Ethernet and USB OTG connectivity.
- Secure IoT Edge Devices Secure data collection and processing at the edge using on-chip security primitives like AES, RSA, TrustZone, and TRNG.
- Control and Monitoring Systems Single-core 64‑bit processing with an M33 coprocessor for mixed application and real-time control tasks.
Unique Advantages
- Hardware Security Building Blocks: AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG enable secure system architectures and protected boot chains.
- Industrial Temperature Qualification: Rated for −40 °C to 85 °C to support deployments in harsh or temperature-variable environments.
- Integrated High-Speed Connectivity: Dual Gigabit Ethernet and dual USB 2.0 OTG reduce external interface components and simplify board design.
- Flexible Memory Support: DDR4 and LPDDR4 controller support allows designers to choose memory types that match bandwidth and power targets.
- Compact Surface-Mount Package: 361‑LFBGA (13×13) package provides a small footprint for space-constrained embedded systems.
- Renesas RZ/G3S Series: Part of the RZ/G3S family from Renesas, suitable for embedded applications requiring integrated processing and security.
Why Choose R9A08G045S17GBG#BC0?
This Renesas RZ/G3S SoC combines a single ARM® Cortex®-A55 64‑bit core and an ARM® Cortex®-M33 coprocessor with integrated memory controllers and robust hardware security features, offering a balanced platform for secure, connected embedded designs. Its industrial qualification and extended temperature range make it well suited to control, networking, and edge-processing applications where reliability and security are required.
Designed for engineers and procurement teams building industrial or embedded systems, the R9A08G045S17GBG#BC0 provides compact packaging, standard high-speed interfaces, and security primitives that simplify system architecture and help reduce BOM complexity while leveraging Renesas as the manufacturer.
Request a quote or submit your project requirements to receive pricing and availability details for the R9A08G045S17GBG#BC0. Our team will provide a tailored procurement response based on your application needs.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016