R9A08G045S17GBG#BC0

SOC RZ/G3S 14BGA SECURE 1+1CPU(F
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 528 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.1GHz
Supplier Device Package361-LFBGA (13×13)USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S17GBG#BC0 – ARM® Cortex®-A55 Microprocessor IC, 1 Core 64‑Bit 1.1 GHz

The R9A08G045S17GBG#BC0 is a Renesas RZ/G3S series system-on-chip featuring a single ARM® Cortex®-A55 64‑bit core running at 1.1 GHz with an ARM® Cortex®-M33 coprocessor. It integrates high-speed memory controllers and multiple I/O interfaces to support embedded and industrial designs that require processing, connectivity, and hardware security.

Qualified for industrial use and offered in a 361‑LFBGA (13×13) package with an operating range of −40 °C to 85 °C, this device targets applications that need secure, compact, and connected processing in rugged environments.

Key Features

  • Core & Architecture  Single ARM® Cortex®-A55 64‑bit application core at 1.1 GHz with an ARM® Cortex®-M33 coprocessor for control and real-time tasks.
  • Memory  Integrated controllers for DDR4 and LPDDR4 memory to support modern high-bandwidth system designs.
  • Connectivity  Dual Gigabit Ethernet ports (10/100/1000 Mbps) and two USB 2.0 OTG interfaces provide wired networking and peripheral connectivity.
  • Security  Hardware security features including AES, ARM TrustZone, Hash, RSA, Secure Boot, and a True Random Number Generator (TRNG) for secure system design.
  • Package & Mounting  361‑LFBGA (13×13) package, surface-mount construction suitable for compact board designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
  • Graphics  No graphics acceleration; suited to compute, control, and communications-focused embedded applications.
  • System Support  DMA and additional interfaces on-chip to facilitate efficient data movement and peripheral integration.
  • Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

  • Industrial Automation  Control and communication nodes that require industrial temperature operation, secure boot, and wired networking.
  • Embedded Networking Equipment  Gateways, protocol bridges or edge appliances leveraging dual Gigabit Ethernet and USB OTG connectivity.
  • Secure IoT Edge Devices  Secure data collection and processing at the edge using on-chip security primitives like AES, RSA, TrustZone, and TRNG.
  • Control and Monitoring Systems  Single-core 64‑bit processing with an M33 coprocessor for mixed application and real-time control tasks.

Unique Advantages

  • Hardware Security Building Blocks: AES, ARM TrustZone, Hash, RSA, Secure Boot and TRNG enable secure system architectures and protected boot chains.
  • Industrial Temperature Qualification: Rated for −40 °C to 85 °C to support deployments in harsh or temperature-variable environments.
  • Integrated High-Speed Connectivity: Dual Gigabit Ethernet and dual USB 2.0 OTG reduce external interface components and simplify board design.
  • Flexible Memory Support: DDR4 and LPDDR4 controller support allows designers to choose memory types that match bandwidth and power targets.
  • Compact Surface-Mount Package: 361‑LFBGA (13×13) package provides a small footprint for space-constrained embedded systems.
  • Renesas RZ/G3S Series: Part of the RZ/G3S family from Renesas, suitable for embedded applications requiring integrated processing and security.

Why Choose R9A08G045S17GBG#BC0?

This Renesas RZ/G3S SoC combines a single ARM® Cortex®-A55 64‑bit core and an ARM® Cortex®-M33 coprocessor with integrated memory controllers and robust hardware security features, offering a balanced platform for secure, connected embedded designs. Its industrial qualification and extended temperature range make it well suited to control, networking, and edge-processing applications where reliability and security are required.

Designed for engineers and procurement teams building industrial or embedded systems, the R9A08G045S17GBG#BC0 provides compact packaging, standard high-speed interfaces, and security primitives that simplify system architecture and help reduce BOM complexity while leveraging Renesas as the manufacturer.

Request a quote or submit your project requirements to receive pricing and availability details for the R9A08G045S17GBG#BC0. Our team will provide a tailored procurement response based on your application needs.

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