R9A08G045S15GBG#BC0

SOC RZ/G3S 13BGA SECURE(FULL)
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 60 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.1GHz
Supplier Device Package361-LFBGA (13×13)USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S15GBG#BC0 – SOC RZ/G3S Secure 1.1 GHz ARM® Cortex®-A55

The R9A08G045S15GBG#BC0 is a Renesas SOC RZ/G3S-series microprocessor IC centered on a single ARM® Cortex®-A55 64‑bit core running at 1.1 GHz, packaged in a 361‑LFBGA (13×13) surface‑mount package. The device integrates an ARM® Cortex®‑M33 coprocessor and a comprehensive set of security engines, making it suitable for embedded designs that require secure processing and deterministic peripheral connectivity.

Qualified for industrial operation with an ambient range of −40 °C to 85 °C, the part provides on‑chip DDR4/LPDDR4 memory controllers, dual gigabit Ethernet, dual USB 2.0 OTG ports, and DMA to support connected embedded systems with hardened security features.

Key Features

  • Core & Architecture  Single ARM® Cortex®‑A55 64‑bit core at 1.1 GHz with an ARM® Cortex®‑M33 coprocessor for real‑time or auxiliary tasks.
  • Memory Subsystem  Integrated controllers for DDR4 and LPDDR4 memory to support modern embedded memory configurations.
  • Connectivity  Two 10/100/1000 Mbps Ethernet controllers and two USB 2.0 OTG ports plus DMA for efficient data movement and networked applications.
  • Security  Hardware security features including AES, ARM TrustZone (ARM TZ), hash engines, RSA, Secure Boot, and a true random number generator (TRNG) for robust platform security.
  • Industrial Qualification & Thermal Range  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
  • Package & Mounting  361‑LFBGA (13×13) supplier device package, designed for surface‑mount assembly.
  • System Integration  On‑chip DMA and integrated coprocessor support to simplify system partitioning and offload tasks from the main core.

Typical Applications

  • Embedded Systems  Compact embedded platforms that require a 64‑bit application processor with auxiliary real‑time processing capability.
  • Industrial Embedded Applications  Industrial designs needing industrial temperature operation and integrated connectivity for networked control and monitoring.
  • Secure Networked Devices  Devices that require hardware security primitives and secure boot combined with gigabit Ethernet and USB connectivity.

Unique Advantages

  • Secure by design: Hardware AES, RSA, hash engines, ARM TrustZone and Secure Boot enable a layered security approach for firmware and data protection.
  • Balanced compute model: A 64‑bit Cortex‑A55 application core paired with a Cortex‑M33 coprocessor provides flexible task partitioning between application and real‑time workloads.
  • Integrated high‑speed connectivity: Dual gigabit Ethernet and dual USB 2.0 OTG ports reduce external interface components and simplify networked designs.
  • Memory flexibility: Support for DDR4 and LPDDR4 memory controllers enables designers to choose memory options based on capacity and power requirements.
  • Industrial readiness: Industrial qualification and −40 °C to 85 °C operating range support deployment in rugged environments and temperature‑sensitive applications.
  • Compact, manufacturable package: 361‑LFBGA (13×13) surface‑mount package supports high‑density PCB implementations for space‑constrained designs.

Why Choose R9A08G045S15GBG#BC0?

The R9A08G045S15GBG#BC0 positions itself as a secure, industrially qualified embedded processor that balances application performance with integrated security and connectivity. Its single ARM® Cortex®‑A55 core at 1.1 GHz, complemented by an ARM® Cortex®‑M33 coprocessor, provides a flexible architecture for mixed application and real‑time workloads.

This part is well suited to designers and procurement teams building industrial and embedded systems that require on‑chip security engines, dual gigabit Ethernet, USB OTG, DDR4/LPDDR4 memory support, and an industrial temperature range—delivering a compact, integrated foundation for secure, networked embedded products backed by Renesas platform design intent.

Request a quote or submit a request for pricing and availability for the R9A08G045S15GBG#BC0 to evaluate its fit for your next embedded or industrial design.

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