R9A08G045S15GBG#BC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 60 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.1GHz | ||
| Supplier Device Package | 361-LFBGA (13×13) | USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S15GBG#BC0 – SOC RZ/G3S Secure 1.1 GHz ARM® Cortex®-A55
The R9A08G045S15GBG#BC0 is a Renesas SOC RZ/G3S-series microprocessor IC centered on a single ARM® Cortex®-A55 64‑bit core running at 1.1 GHz, packaged in a 361‑LFBGA (13×13) surface‑mount package. The device integrates an ARM® Cortex®‑M33 coprocessor and a comprehensive set of security engines, making it suitable for embedded designs that require secure processing and deterministic peripheral connectivity.
Qualified for industrial operation with an ambient range of −40 °C to 85 °C, the part provides on‑chip DDR4/LPDDR4 memory controllers, dual gigabit Ethernet, dual USB 2.0 OTG ports, and DMA to support connected embedded systems with hardened security features.
Key Features
- Core & Architecture Single ARM® Cortex®‑A55 64‑bit core at 1.1 GHz with an ARM® Cortex®‑M33 coprocessor for real‑time or auxiliary tasks.
- Memory Subsystem Integrated controllers for DDR4 and LPDDR4 memory to support modern embedded memory configurations.
- Connectivity Two 10/100/1000 Mbps Ethernet controllers and two USB 2.0 OTG ports plus DMA for efficient data movement and networked applications.
- Security Hardware security features including AES, ARM TrustZone (ARM TZ), hash engines, RSA, Secure Boot, and a true random number generator (TRNG) for robust platform security.
- Industrial Qualification & Thermal Range Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
- Package & Mounting 361‑LFBGA (13×13) supplier device package, designed for surface‑mount assembly.
- System Integration On‑chip DMA and integrated coprocessor support to simplify system partitioning and offload tasks from the main core.
Typical Applications
- Embedded Systems Compact embedded platforms that require a 64‑bit application processor with auxiliary real‑time processing capability.
- Industrial Embedded Applications Industrial designs needing industrial temperature operation and integrated connectivity for networked control and monitoring.
- Secure Networked Devices Devices that require hardware security primitives and secure boot combined with gigabit Ethernet and USB connectivity.
Unique Advantages
- Secure by design: Hardware AES, RSA, hash engines, ARM TrustZone and Secure Boot enable a layered security approach for firmware and data protection.
- Balanced compute model: A 64‑bit Cortex‑A55 application core paired with a Cortex‑M33 coprocessor provides flexible task partitioning between application and real‑time workloads.
- Integrated high‑speed connectivity: Dual gigabit Ethernet and dual USB 2.0 OTG ports reduce external interface components and simplify networked designs.
- Memory flexibility: Support for DDR4 and LPDDR4 memory controllers enables designers to choose memory options based on capacity and power requirements.
- Industrial readiness: Industrial qualification and −40 °C to 85 °C operating range support deployment in rugged environments and temperature‑sensitive applications.
- Compact, manufacturable package: 361‑LFBGA (13×13) surface‑mount package supports high‑density PCB implementations for space‑constrained designs.
Why Choose R9A08G045S15GBG#BC0?
The R9A08G045S15GBG#BC0 positions itself as a secure, industrially qualified embedded processor that balances application performance with integrated security and connectivity. Its single ARM® Cortex®‑A55 core at 1.1 GHz, complemented by an ARM® Cortex®‑M33 coprocessor, provides a flexible architecture for mixed application and real‑time workloads.
This part is well suited to designers and procurement teams building industrial and embedded systems that require on‑chip security engines, dual gigabit Ethernet, USB OTG, DDR4/LPDDR4 memory support, and an industrial temperature range—delivering a compact, integrated foundation for secure, networked embedded products backed by Renesas platform design intent.
Request a quote or submit a request for pricing and availability for the R9A08G045S15GBG#BC0 to evaluate its fit for your next embedded or industrial design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
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