R9A08G045S15GBG#AC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 754 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Hash, RSA, Secure Boot, TRNG | Speed | 1.1GHz | ||
| Supplier Device Package | 361-LFBGA (13×13) | USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S15GBG#AC0 – SOC RZ/G3S 13BGA SECURE(BULK)
The R9A08G045S15GBG#AC0 from Renesas is an ARM® Cortex®-A55 microprocessor IC in the RZ/G3S family, delivering a single 64‑bit core running at 1.1 GHz in a 361‑LFBGA (13×13) package. It targets embedded applications that require integrated processing, connectivity and hardware security features.
On-chip resources include an ARM® Cortex®-M33 co‑processor, DDR4/LPDDR4 memory controllers, dual 10/100/1000 Mbps Ethernet ports, and two USB 2.0 OTG interfaces, combined with industrial qualification and an operating range of -40 °C to 85 °C for deployment in robust embedded systems.
Key Features
- Core ARM® Cortex®-A55 single 64‑bit core at 1.1 GHz for general-purpose application processing.
- Co-Processor Includes an ARM® Cortex®-M33 co‑processor for auxiliary or real‑time tasks.
- Memory Integrated memory controller support for DDR4 and LPDDR4 memory types.
- Ethernet Two 10/100/1000 Mbps Ethernet interfaces for high-speed wired network connectivity.
- USB Two USB 2.0 OTG ports for host/device peripheral connectivity.
- Security Hardware security features including AES, ARM TrustZone (ARM TZ), hashing, RSA, Secure Boot and a True Random Number Generator (TRNG).
- System Interfaces Additional DMA support to assist with data movement and peripheral throughput.
- Package & Mounting 361‑LFBGA (13×13) supplier device package with surface mount mounting type.
- Qualification & Temperature Industrial qualification and an operating temperature range of -40 °C to 85 °C for deployment in demanding environments.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Industrial Embedded Systems Designed for industrial-grade deployments where the industrial qualification and -40 °C to 85 °C operating range are required.
- Secure Embedded Controllers Hardware security features such as AES, RSA, Secure Boot and TRNG support secure device authentication and protected firmware environments.
- Networked Edge Devices Dual Gigabit Ethernet interfaces enable use in networked embedded devices and edge appliances that require wired high‑speed connectivity.
- Peripheral-Rich Embedded Designs USB 2.0 OTG and DMA support provide flexible connectivity options for embedded peripherals and data transfer tasks.
Unique Advantages
- Integrated Security Stack: Multiple on-chip security features (AES, ARM TZ, Hash, RSA, Secure Boot, TRNG) provide hardware-level primitives to build secure embedded solutions.
- Combined Application and Real-Time Processing: The ARM® Cortex®-A55 main core and ARM® Cortex®-M33 co‑processor enable partitioned processing models for application and control tasks.
- High-Speed Networking: Dual 10/100/1000 Mbps Ethernet ports support robust wired connectivity for networked applications.
- Memory Flexibility: DDR4 and LPDDR4 controller support allows designers to select memory types appropriate to performance and power targets.
- Industrial Readiness: Industrial qualification and a wide operating temperature range facilitate reliable operation in harsher environments.
- Compact BGA Package: 361‑LFBGA (13×13) surface-mount package supports high-density board designs while providing a standardized supplier package.
Why Choose R9A08G045S15GBG#AC0?
The R9A08G045S15GBG#AC0 positions itself as a compact, secure single‑core 64‑bit SoC option for embedded designs that require a balance of application processing and real‑time capability. With integrated memory controllers, dual Gigabit Ethernet, USB OTG, and a suite of hardware security functions, it addresses the needs of networked and security‑conscious embedded products.
This Renesas RZ/G3S device is well suited to engineers specifying industrially qualified components who need a single‑chip solution that simplifies system integration while providing the connectivity and security foundations for long‑lifecycle embedded deployments.
Request a quote or submit an RFQ to obtain pricing and availability for R9A08G045S15GBG#AC0. Our team can provide lead‑time and ordering information to support your design timeline.

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Headquarters: Koto City, Tokyo, Japan
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