R9A08G045S15GBG#AC0

SOC RZ/G3S 13BGA SECURE(BULK)
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 754 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Hash, RSA, Secure Boot, TRNGSpeed1.1GHz
Supplier Device Package361-LFBGA (13×13)USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S15GBG#AC0 – SOC RZ/G3S 13BGA SECURE(BULK)

The R9A08G045S15GBG#AC0 from Renesas is an ARM® Cortex®-A55 microprocessor IC in the RZ/G3S family, delivering a single 64‑bit core running at 1.1 GHz in a 361‑LFBGA (13×13) package. It targets embedded applications that require integrated processing, connectivity and hardware security features.

On-chip resources include an ARM® Cortex®-M33 co‑processor, DDR4/LPDDR4 memory controllers, dual 10/100/1000 Mbps Ethernet ports, and two USB 2.0 OTG interfaces, combined with industrial qualification and an operating range of -40 °C to 85 °C for deployment in robust embedded systems.

Key Features

  • Core  ARM® Cortex®-A55 single 64‑bit core at 1.1 GHz for general-purpose application processing.
  • Co-Processor  Includes an ARM® Cortex®-M33 co‑processor for auxiliary or real‑time tasks.
  • Memory  Integrated memory controller support for DDR4 and LPDDR4 memory types.
  • Ethernet  Two 10/100/1000 Mbps Ethernet interfaces for high-speed wired network connectivity.
  • USB  Two USB 2.0 OTG ports for host/device peripheral connectivity.
  • Security  Hardware security features including AES, ARM TrustZone (ARM TZ), hashing, RSA, Secure Boot and a True Random Number Generator (TRNG).
  • System Interfaces  Additional DMA support to assist with data movement and peripheral throughput.
  • Package & Mounting  361‑LFBGA (13×13) supplier device package with surface mount mounting type.
  • Qualification & Temperature  Industrial qualification and an operating temperature range of -40 °C to 85 °C for deployment in demanding environments.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Industrial Embedded Systems  Designed for industrial-grade deployments where the industrial qualification and -40 °C to 85 °C operating range are required.
  • Secure Embedded Controllers  Hardware security features such as AES, RSA, Secure Boot and TRNG support secure device authentication and protected firmware environments.
  • Networked Edge Devices  Dual Gigabit Ethernet interfaces enable use in networked embedded devices and edge appliances that require wired high‑speed connectivity.
  • Peripheral-Rich Embedded Designs  USB 2.0 OTG and DMA support provide flexible connectivity options for embedded peripherals and data transfer tasks.

Unique Advantages

  • Integrated Security Stack: Multiple on-chip security features (AES, ARM TZ, Hash, RSA, Secure Boot, TRNG) provide hardware-level primitives to build secure embedded solutions.
  • Combined Application and Real-Time Processing: The ARM® Cortex®-A55 main core and ARM® Cortex®-M33 co‑processor enable partitioned processing models for application and control tasks.
  • High-Speed Networking: Dual 10/100/1000 Mbps Ethernet ports support robust wired connectivity for networked applications.
  • Memory Flexibility: DDR4 and LPDDR4 controller support allows designers to select memory types appropriate to performance and power targets.
  • Industrial Readiness: Industrial qualification and a wide operating temperature range facilitate reliable operation in harsher environments.
  • Compact BGA Package: 361‑LFBGA (13×13) surface-mount package supports high-density board designs while providing a standardized supplier package.

Why Choose R9A08G045S15GBG#AC0?

The R9A08G045S15GBG#AC0 positions itself as a compact, secure single‑core 64‑bit SoC option for embedded designs that require a balance of application processing and real‑time capability. With integrated memory controllers, dual Gigabit Ethernet, USB OTG, and a suite of hardware security functions, it addresses the needs of networked and security‑conscious embedded products.

This Renesas RZ/G3S device is well suited to engineers specifying industrially qualified components who need a single‑chip solution that simplifies system integration while providing the connectivity and security foundations for long‑lifecycle embedded deployments.

Request a quote or submit an RFQ to obtain pricing and availability for R9A08G045S15GBG#AC0. Our team can provide lead‑time and ordering information to support your design timeline.

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