R9A08G045S11GBG#AC0
| Part Description |
ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13) |
|---|---|
| Quantity | 984 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A08G045 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M33 | Core Processor | ARM® Cortex®-A55 | Device Package | 361-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 361-LFBGA | RAM Controllers | DDR4, LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.1GHz | Supplier Device Package | 361-LFBGA (13×13) | ||
| USB | USB 2.0 OTG (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A08G045S11GBG#AC0 – SOC RZ/G3S 13BGA NON-SECURE 1+1C
The R9A08G045S11GBG#AC0 is an embedded microprocessor from Renesas' R9A08G045 series featuring an ARM® Cortex®-A55 application core running at 1.1 GHz paired with an ARM® Cortex®-M33 coprocessor. Designed and qualified for industrial use, this SoC integrates memory controllers, wired connectivity and security primitives to support compact, connected embedded systems.
Key Features
- Core Architecture ARM® Cortex®-A55 64-bit application core at 1.1 GHz with an ARM® Cortex®-M33 coprocessor to separate real-time/control tasks from application processing.
- Memory Support Integrated controllers for DDR4 and LPDDR4 memory to support system-level performance and flexible memory configurations.
- Networking & USB Dual 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 OTG ports provide high-bandwidth wired connectivity options for networked and peripheral-rich applications.
- Security On-chip security features including AES, ARM TrustZone, hash functions, RSA, secure boot and a true random number generator (TRNG) to support device and data protection.
- System Interfaces Integrated DMA and other system interfaces for efficient data movement and peripheral coordination.
- Package & Temperature 361-LFBGA (13×13 mm) surface-mount package optimized for compact board designs and industrial operating temperature range of −40 °C to 85 °C.
- Qualification & Compliance Industrial qualification and RoHS compliance for deployment in industrial embedded systems.
Typical Applications
- Industrial Control Use the A55 core and M33 coprocessor for control logic, protocol handling and secure communications in industrial automation equipment.
- Edge Networking Appliances Dual Gigabit Ethernet and USB OTG ports enable gateway, router or appliance designs that require wired connectivity and peripheral support.
- Secure Embedded Systems Built-in AES, RSA, secure boot, TRNG and TrustZone make the device suitable for embedded systems requiring hardware-backed security.
Unique Advantages
- Single high-performance application core plus coprocessor: Combines a 1.1 GHz ARM® Cortex®-A55 with an ARM® Cortex®-M33 to partition application and real-time workloads.
- Broad memory compatibility: DDR4 and LPDDR4 controllers allow designers to choose memory types that match performance and power targets.
- Integrated wired connectivity: Two Gigabit Ethernet interfaces and dual USB 2.0 OTG ports reduce external components for networked embedded devices.
- Comprehensive on-chip security: AES, ARM TrustZone, hash, RSA, secure boot and TRNG support secure device identity, boot integrity and cryptographic operations.
- Industrial-grade readiness: Qualified for industrial use and specified for −40 °C to 85 °C operation to meet challenging environmental requirements.
- Compact SMD packaging: 361-LFBGA (13×13 mm) surface-mount package supports space-constrained PCB designs.
Why Choose R9A08G045S11GBG#AC0?
The R9A08G045S11GBG#AC0 positions itself as a compact, industrially qualified SoC that balances application-class processing with real-time control capabilities via its Cortex-A55 and Cortex-M33 pairing. Its integrated memory controllers, dual Gigabit Ethernet and USB OTG ports, together with hardware security primitives, deliver a highly integrated building block for embedded and industrial designs.
Backed by Renesas' RZ/G3S series, this device is suited for developers seeking a single-chip solution for connected, secure embedded applications that require industrial temperature operation and compact packaging.
Request a quote or contact sales to get pricing and availability for R9A08G045S11GBG#AC0.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
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