R9A08G045S11GBG#AC0

SOC RZ/G3S 13BGA NON-SECURE 1+1C
Part Description

ARM® Cortex®-A55 Microprocessor IC RZ/G3S 1 Core, 64-Bit 1.1GHz 361-LFBGA (13x13)

Quantity 984 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A08G045
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M33Core ProcessorARM® Cortex®-A55Device Package361-LFBGA (13x13)
ECCNN/AEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case361-LFBGARAM ControllersDDR4, LPDDR4REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.1GHzSupplier Device Package361-LFBGA (13×13)
USBUSB 2.0 OTG (2)Voltage – I/O1.8V, 3.3V

Overview of R9A08G045S11GBG#AC0 – SOC RZ/G3S 13BGA NON-SECURE 1+1C

The R9A08G045S11GBG#AC0 is an embedded microprocessor from Renesas' R9A08G045 series featuring an ARM® Cortex®-A55 application core running at 1.1 GHz paired with an ARM® Cortex®-M33 coprocessor. Designed and qualified for industrial use, this SoC integrates memory controllers, wired connectivity and security primitives to support compact, connected embedded systems.

Key Features

  • Core Architecture  ARM® Cortex®-A55 64-bit application core at 1.1 GHz with an ARM® Cortex®-M33 coprocessor to separate real-time/control tasks from application processing.
  • Memory Support  Integrated controllers for DDR4 and LPDDR4 memory to support system-level performance and flexible memory configurations.
  • Networking & USB  Dual 10/100/1000 Mbps Ethernet interfaces and two USB 2.0 OTG ports provide high-bandwidth wired connectivity options for networked and peripheral-rich applications.
  • Security  On-chip security features including AES, ARM TrustZone, hash functions, RSA, secure boot and a true random number generator (TRNG) to support device and data protection.
  • System Interfaces  Integrated DMA and other system interfaces for efficient data movement and peripheral coordination.
  • Package & Temperature  361-LFBGA (13×13 mm) surface-mount package optimized for compact board designs and industrial operating temperature range of −40 °C to 85 °C.
  • Qualification & Compliance  Industrial qualification and RoHS compliance for deployment in industrial embedded systems.

Typical Applications

  • Industrial Control  Use the A55 core and M33 coprocessor for control logic, protocol handling and secure communications in industrial automation equipment.
  • Edge Networking Appliances  Dual Gigabit Ethernet and USB OTG ports enable gateway, router or appliance designs that require wired connectivity and peripheral support.
  • Secure Embedded Systems  Built-in AES, RSA, secure boot, TRNG and TrustZone make the device suitable for embedded systems requiring hardware-backed security.

Unique Advantages

  • Single high-performance application core plus coprocessor: Combines a 1.1 GHz ARM® Cortex®-A55 with an ARM® Cortex®-M33 to partition application and real-time workloads.
  • Broad memory compatibility: DDR4 and LPDDR4 controllers allow designers to choose memory types that match performance and power targets.
  • Integrated wired connectivity: Two Gigabit Ethernet interfaces and dual USB 2.0 OTG ports reduce external components for networked embedded devices.
  • Comprehensive on-chip security: AES, ARM TrustZone, hash, RSA, secure boot and TRNG support secure device identity, boot integrity and cryptographic operations.
  • Industrial-grade readiness: Qualified for industrial use and specified for −40 °C to 85 °C operation to meet challenging environmental requirements.
  • Compact SMD packaging: 361-LFBGA (13×13 mm) surface-mount package supports space-constrained PCB designs.

Why Choose R9A08G045S11GBG#AC0?

The R9A08G045S11GBG#AC0 positions itself as a compact, industrially qualified SoC that balances application-class processing with real-time control capabilities via its Cortex-A55 and Cortex-M33 pairing. Its integrated memory controllers, dual Gigabit Ethernet and USB OTG ports, together with hardware security primitives, deliver a highly integrated building block for embedded and industrial designs.

Backed by Renesas' RZ/G3S series, this device is suited for developers seeking a single-chip solution for connected, secure embedded applications that require industrial temperature operation and compact packaging.

Request a quote or contact sales to get pricing and availability for R9A08G045S11GBG#AC0.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2002


    Headquarters: Koto City, Tokyo, Japan


    Employees: 21,000+


    Revenue: $10 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up