R9A07G084M08GBG#AC0
| Part Description |
ARM® Cortex®-R52 Microprocessor IC RZ/N2L 1 Core, 32-Bit 300MHz, 400MHz 225-LFBGA (13x13) |
|---|---|
| Quantity | 803 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G084 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-R52 | Device Package | 225-LFBGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | ||
| Package / Case | 225-LFBGA | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNG | Speed | 300MHz, 400MHz | Supplier Device Package | 225-LFBGA (13×13) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G084M08GBG#AC0 – IC MPU RZ 300MHz 225-LFBGA
The R9A07G084M08GBG#AC0 is a Renesas ARM® Cortex®-R52 microprocessor IC configured as a single 32-bit core operating at 300 MHz. Designed for embedded and industrial applications, this device combines a compact 225-LFBGA (13×13) package with integrated connectivity and hardware security features.
Its combination of a Cortex-R52 core, multimedia/NEON SIMD co-processor capability, and industrial-grade operating range makes it suitable for embedded systems that require deterministic compute density, wired networking, and onboard cryptographic support.
Key Features
- Core & Architecture ARM® Cortex®-R52 single core, 32-bit processor operating at 300 MHz.
- Co-processor Support Multimedia and NEON™ SIMD co-processor capability for accelerating vector and multimedia workloads.
- Connectivity Integrated Ethernet 10/100/1000 Mbps (1), USB 2.0 (1) and CANbus interfaces for wired networking and peripheral connectivity.
- Security & Boot On-chip security features including Boot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, and a True Random Number Generator (TRNG).
- Package & Mounting 225-LFBGA package (13×13) with surface-mount mounting type for dense PCB integration.
- Qualification & Temperature Industrial qualification with an operating temperature range of -40 °C to 125 °C.
- Compliance RoHS compliant.
Typical Applications
- Industrial control and automation Suitable for embedded controllers and modules that require industrial qualification and wide temperature operation.
- Networked embedded systems Use where integrated Gigabit Ethernet, USB 2.0 and CANbus connectivity are required for data and device interfacing.
- Secure edge devices Ideal for devices needing onboard cryptographic acceleration, secure boot and a TRNG for secure key generation.
- Embedded multimedia processing Applicable for systems leveraging the NEON™ SIMD/multimedia co-processor for accelerated data processing tasks.
Unique Advantages
- Integrated wired connectivity: Gigabit Ethernet, USB 2.0 and CANbus reduce external interface components and simplify board-level design.
- Hardware security suite: Built-in crypto accelerator, TRNG and boot authentication provide a hardware foundation for secure device deployment.
- Industrial-grade durability: Qualified for industrial use and rated for -40 °C to 125 °C operation to meet harsh-environment requirements.
- Compact, high-density package: 225-LFBGA (13×13) surface-mount package supports space-constrained embedded designs.
- Single-core deterministic compute: ARM® Cortex®-R52 single 32-bit core at 300 MHz for predictable processing in embedded applications.
- Standards-compliant manufacturing: RoHS compliance for environmentally conscious designs.
Why Choose R9A07G084M08GBG#AC0?
The R9A07G084M08GBG#AC0 positions itself as a compact, industrial-grade microprocessor solution combining a 300 MHz ARM® Cortex®-R52 core with integrated connectivity and a comprehensive hardware security feature set. Its package density, industrial temperature rating, and embedded interfaces make it suitable for engineers designing robust, connected embedded systems.
This Renesas part is well suited for customers who need a single-core 32-bit MPU with onboard cryptographic capabilities and standard wired interfaces, offering long-term value through industrial qualification and component-level integration that reduces bill-of-materials and PCB complexity.
Request a quote or submit an inquiry to receive pricing and availability for the R9A07G084M08GBG#AC0. Our team can provide technical details and support to help evaluate this device for your embedded designs.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016