R9A07G075M28GBG#AC0
| Part Description |
ARM® Cortex®-R52 Microprocessor IC RZ/T2M 2 Core, 32-Bit 600MHz, 800MHz 320-FBGA (17x17) |
|---|---|
| Quantity | 666 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G075 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-R52 | Device Package | 320-FBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | ||
| Package / Case | 320-LFBGA | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | Boot Security, Crypto Accelerator, JTAG, TRNG | Speed | 600MHz, 800MHz | Supplier Device Package | 320-FBGA (17×17) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G075M28GBG#AC0 – IC MPU RZ/T2M 600/800MHZ 320FBGA
The R9A07G075M28GBG#AC0 is an ARM® Cortex®-R52 based microprocessor IC from Renesas' RZ/T2M series. It provides a dual-core, 32-bit processor configuration running at 600 MHz and targets embedded applications where deterministic performance, industrial qualification, and integrated connectivity are required.
With hardware multimedia acceleration (NEON SIMD), dual Gigabit Ethernet interfaces, CANbus and USB 2.0 support, plus on-chip security features, this device addresses industrial embedded designs that demand secure, networked compute in a compact 320‑FBGA (17×17) package and an extended operating temperature range.
Key Features
- Core and Performance Dual ARM® Cortex®-R52 32‑bit cores operating at 600 MHz for real-time and embedded compute workloads.
- Multimedia Acceleration Integrated NEON™ SIMD multimedia co-processor to accelerate signal processing and compute-intensive routines.
- Network and USB Connectivity Two 10/100/1000 Mbps Ethernet interfaces and one USB 2.0 port provide high-bandwidth wired connectivity options.
- Fieldbus Support CANbus interface for industrial and vehicle-style communications and control networks.
- Security and Debug Boot security, crypto accelerator, JTAG, and a true random number generator (TRNG) for hardware-based security and development access.
- Industrial Qualification & Temperature Range Industrial qualification and an operating temperature range of −40°C to 125°C for use in demanding environments.
- Package & Mounting 320‑FBGA (17×17) supplier device package, surface-mount compatible for compact, manufacturable designs.
- Compliance RoHS compliant to support regulatory and manufacturing requirements.
Typical Applications
- Industrial Automation — Embedded control and real-time processing in automation equipment, benefiting from dual cores, CANbus support, and the extended temperature rating.
- Industrial Networking & Gateways — Dual Gigabit Ethernet interfaces enable high-throughput wired connectivity for protocol bridging and gateway functions.
- Secure Embedded Controllers — On-chip boot security, crypto accelerator and TRNG enable hardware-based security features for protected designs.
- Signal Processing & Edge Compute — NEON SIMD multimedia acceleration supports compute-intensive signal processing tasks within an embedded footprint.
Unique Advantages
- Deterministic Dual-Core Processing: Two ARM® Cortex®-R52 cores at 600 MHz deliver reliable, parallel processing for real-time embedded workloads.
- Integrated Connectivity: Built-in dual Gigabit Ethernet, USB 2.0 and CANbus reduce external components and simplify system architecture.
- Hardware Security Primitives: Boot security, crypto acceleration and TRNG provide foundational security functions without additional silicon.
- Industrial-Grade Operation: Industrial qualification and −40°C to 125°C operating range support deployments in harsh environments.
- Compact, Production-Ready Package: 320‑FBGA (17×17) surface-mount package supports compact board layouts and scalable manufacturing.
- Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements.
Why Choose R9A07G075M28GBG#AC0?
The R9A07G075M28GBG#AC0 balances embedded real-time processing, integrated connectivity and hardware security in a compact, industrially qualified package. Its dual ARM® Cortex®-R52 cores, NEON SIMD acceleration and multiple high-speed interfaces make it well suited for industrial control, networking gateways and secure edge compute applications.
Designed for engineers building robust, manufacturable products, this device consolidates interfaces and security features to reduce component count while supporting operation across a wide temperature range, helping simplify design and deployment in demanding embedded environments.
Request a quote or submit a sales inquiry today to discuss pricing, availability, and how R9A07G075M28GBG#AC0 can fit into your next embedded design.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016