R9A07G084M08GBA#AC0

IC MPU RZ/N2L 300/400MHZ 121FBGA
Part Description

ARM® Cortex®-R52 Microprocessor IC RZ/N2L 1 Core, 32-Bit 300MHz, 400MHz 121-FBGA (10x10)

Quantity 720 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G084
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-R52Device Package121-FBGA (10x10)
ECCNN/AEthernet10/100/1000Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)
Package / Case121-LFBGAREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesBoot Security, Crypto Accelerator, JTAG, SCI/USB boot authentication, TRNGSpeed300MHz, 400MHzSupplier Device Package121-FBGA (10×10)
USBUSB 2.0 (1)Voltage – I/O1.8V, 3.3V

Overview of R9A07G084M08GBA#AC0 – IC MPU RZ/N2L 300/400MHZ 121FBGA

The R9A07G084M08GBA#AC0 is a single‑core ARM® Cortex®‑R52 microprocessor IC in the RZ/N2L family, supplied in a 121‑FBGA (10×10) package and qualified for industrial use. It targets embedded applications requiring a 32‑bit processor core with integrated security and common high‑speed interfaces.

On‑chip connectivity includes Gigabit Ethernet, USB 2.0 and CANbus, while security features such as boot security, crypto acceleration, JTAG, SCI/USB boot authentication and a TRNG support protected system designs. The device is RoHS compliant and rated for operation from −40 °C to 125 °C.

Key Features

  • Core  ARM® Cortex®‑R52 processor, 1 core, 32‑bit architecture.
  • Clock Speed  Specified speed: 300 MHz.
  • Co‑processing  Multimedia co‑processor support with NEON™ SIMD.
  • Interfaces  Integrated Ethernet 10/100/1000 Mbps (1), USB 2.0 (1), and CANbus for common embedded connectivity needs.
  • Security  Boot security, crypto accelerator, JTAG, SCI/USB boot authentication and TRNG for hardware‑level security functions.
  • Package & Mounting  121‑FBGA (10×10) package; surface mount device.
  • Qualification & Environment  Industrial qualification with operating temperature range −40 °C to 125 °C and RoHS compliance.
  • Graphics  No graphics acceleration.

Unique Advantages

  • Industrial temperature range: Rated from −40 °C to 125 °C to meet demanding environmental requirements.
  • Integrated security primitives: Hardware crypto, TRNG and authenticated boot options reduce the need for external security components.
  • Broad connectivity: Built‑in Gigabit Ethernet, USB 2.0 and CANbus simplify system integration for networked embedded designs.
  • Compact BGA package: 121‑FBGA (10×10) surface‑mount package enables compact board layouts.
  • Industrial qualification: Device qualification supports deployment in industrial embedded systems where component reliability matters.

Why Choose R9A07G084M08GBA#AC0?

This Renesas RZ/N2L part combines an ARM® Cortex®‑R52 32‑bit core with on‑chip connectivity and security features in a compact 121‑FBGA package, positioned for embedded and industrial designs that require robust operation across a wide temperature range. The device's integrated interfaces and security primitives help reduce component count while supporting secure, connected applications.

It is well suited for engineers and procurement teams designing industrial embedded systems that need a single‑core R‑class processor with standard networking and bus interfaces, industrial qualification, and RoHS compliance. The combination of on‑chip functions supports streamlined hardware and firmware development within the RZ/N2L family.

Request a quote or submit an inquiry to receive pricing and availability for R9A07G084M08GBA#AC0 or to discuss volume requirements and lead times.

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