R9A09G057H44GBG#BC0
| Part Description |
Microprocessor, ARM® Cortex®-A53 1.8 GHz |
|---|---|
| Quantity | 1,482 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A09G057 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A53 | Device Package | 841-FBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DP, HDMI, LCD | ECCN | 5A002A | Ethernet | GbE (1) | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 2 Core, 64-Bit | Operating Temperature | -40 °C – 125 °C | Package / Case | 841-FBGA | ||
| Qualification | Industrial | RAM Controllers | LPDDR4 | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.8 GHz | USB | USB 3.1 (1) | ||
| Voltage – I/O | 1.8 V – 3.3 V |
Overview of R9A09G057H44GBG#BC0 – Microprocessor, ARM® Cortex®-A53 1.8 GHz
The R9A09G057H44GBG#BC0 is a microprocessor IC from Renesas designed for embedded applications. It is based on an ARM® Cortex®-A53 architecture and operates up to 1.8 GHz.
Built for industrial use, the device combines a dual-core 64-bit processor with NEON™ SIMD multimedia acceleration, LPDDR4 memory support, multiple display interfaces, Gigabit Ethernet and USB 3.1 connectivity, plus hardware security primitives and an 841-FBGA surface-mount package rated for −40°C to 125°C operation.
Key Features
- Core and Performance Dual-core ARM® Cortex®-A53 64-bit processor running up to 1.8 GHz with NEON™ SIMD for multimedia acceleration.
- Memory LPDDR4 memory controller support for modern embedded memory requirements.
- Display Interfaces Integrated DisplayPort (DP), HDMI and LCD controllers to support multiple video output options.
- Connectivity Single Gigabit Ethernet (GbE) port and one USB 3.1 port for high-speed wired connectivity.
- Security Hardware cryptography including AES, ARC4, RSA, SHA-224, SHA-256 and a true random number generator (TRNG).
- Package and Mounting 841-FBGA package (15×15 mm) for surface-mount assembly.
- Operating Range Industrial qualification with an operating temperature range of −40°C to 125°C.
Typical Applications
- Embedded Systems Suitable for embedded designs that require a 64-bit dual-core processor and industrial-grade operation.
- Human‑Machine Interfaces (HMIs) Use the integrated DP/HDMI/LCD display controllers and multimedia acceleration for graphical user interfaces and display-driven applications.
- Industrial Networking Leverage GbE and USB 3.1 connectivity for networking, data transfer and peripheral interfacing in industrial deployments.
Unique Advantages
- Balanced compute and multimedia: Dual-core 1.8 GHz ARM® Cortex®-A53 with NEON™ SIMD supports both control and multimedia workloads in one device.
- Integrated display support: On-chip DP, HDMI and LCD controllers reduce external component count for video-capable systems.
- Built-in high-speed I/O: GbE and USB 3.1 provide native high-bandwidth interfaces without additional controllers.
- Comprehensive security primitives: AES, ARC4, RSA, SHA-224, SHA-256 and TRNG enable hardware-level cryptographic functions.
- Industrial thermal profile: Rated for −40°C to 125°C to meet demanding environmental requirements.
- Compact BGA footprint: 841-FBGA (15×15 mm) allows dense PCB layouts and surface-mount assembly.
Why Choose R9A09G057H44GBG#BC0?
R9A09G057H44GBG#BC0 delivers a combination of dual-core 64-bit processing performance, multimedia acceleration, broad display and I/O integration, and hardware security features in an industrially qualified package. These attributes make it well suited for embedded systems that require a compact, integrated processor with robust connectivity and security.
The device’s LPDDR4 support, 841-FBGA surface-mount package and −40°C to 125°C operating range provide a compact, production-ready building block for industrial applications where temperature tolerance and integrated functionality reduce system complexity.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016
