R9A07G074M08GBG#AC0
| Part Description |
ARM® Cortex®-R52 Microprocessor IC RZ/T2L 1 Core, 32-Bit 800MHz 196-LFBGA (12x12) |
|---|---|
| Quantity | 893 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G074 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-R52 | Device Package | 196-LFBGA (12x12) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (1) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 196-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG | Speed | 800MHz | Supplier Device Package | 196-LFBGA (12×12) | ||
| USB | USB 3.0 (2) | Voltage – I/O | 3.3V |
Overview of R9A07G074M08GBG#AC0 – RZ/T2L MPU BGA196 ETHERCAT SEC
The R9A07G074M08GBG#AC0 is an RZ/T2L series microprocessor IC from Renesas, featuring a single ARM® Cortex®-R52 32-bit core running at 800 MHz. It delivers robust connectivity and hardware security features in a compact 196-LFBGA (12×12) surface-mount package for industrial embedded applications.
Designed for systems that require high-speed interfaces and industrial-grade operation, this device integrates Gigabit Ethernet, EtherCAT support, dual USB 3.0 ports, CANbus, and a suite of cryptographic and secure boot capabilities to address secure networked device designs.
Key Features
- Processor Core ARM® Cortex®-R52 single 32-bit core running at 800 MHz, providing the processing capability specified for this part.
- Memory Interface SDRAM controller support to interface external memory for system and application data storage.
- High-Speed Networking Integrated 10/100/1000 Mbps Ethernet (1) and EtherCAT-capable functionality for high-throughput wired networking.
- Peripheral Connectivity Two USB 3.0 ports and CANbus support expand connectivity for high-speed peripherals and fieldbus interfaces.
- Security and Integrity On-chip security features including AES, RSA, ECC, SHA-1/2, TRNG, secure boot, and Secure JTAG to support encrypted communications and secure device startup.
- Industrial Qualification and Temperature Range Industrial qualification with operating temperature from −40 °C to 125 °C for deployment in demanding environments.
- Power and I/O 3.3 V I/O voltage compatibility for common industrial logic levels.
- Package and Mounting 196-LFBGA (12×12) surface-mount package for compact board designs.
Typical Applications
- Industrial Automation and Control Use the integrated Gigabit Ethernet and EtherCAT capability for deterministic wired networking in automation equipment and control nodes.
- Secure Edge Networking On-chip AES, RSA, ECC, SHA, TRNG, and secure boot support secure communications and device authentication for edge gateways and networked controllers.
- High-Speed Peripheral Hosts Dual USB 3.0 ports enable connectivity to high-bandwidth peripherals and data-acquisition devices.
- Fieldbus and Vehicle Equipment (non-automotive specified) CANbus support and industrial temperature rating make the device suitable for robust embedded systems that require fieldbus interfaces.
Unique Advantages
- High-Frequency ARM Cortex-R52 Core: 800 MHz single-core performance suitable for compute-intensive embedded tasks within the provided specification.
- Comprehensive Hardware Security: Built-in AES, RSA, ECC, SHA-1/2, TRNG, secure boot and Secure JTAG help protect firmware and communications per the listed features.
- Broad, High-Speed Connectivity: Gigabit Ethernet, EtherCAT support, dual USB 3.0, and CANbus provide multiple high-throughput interface options for system integration.
- Industrial-Grade Operation: Specified industrial qualification and −40 °C to 125 °C operating range support deployment in harsh environments.
- Compact BGA Integration: 196-LFBGA (12×12) package enables space-efficient board layouts while providing the necessary I/O density.
- Standard 3.3 V I/O: 3.3 V I/O compatibility simplifies interfacing with common industrial sensors and peripherals.
Why Choose R9A07G074M08GBG#AC0?
The R9A07G074M08GBG#AC0 combines an 800 MHz ARM® Cortex®-R52 core with a rich set of high-speed interfaces and comprehensive on-chip security features, packaged for industrial-grade operation. Its specification set targets designers building secure, connected embedded systems that require Gigabit networking, USB 3.0 connectivity, and fieldbus support within a compact surface-mount footprint.
For engineering and procurement teams, this MPU offers a balance of performance, connectivity, and security while meeting industrial temperature and qualification requirements. Detailed technical documentation for the RZ/T2L group is available to support system integration and validation.
Request a quote or submit a product inquiry to obtain pricing, availability, and lead-time details for R9A07G074M08GBG#AC0.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
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