R9A07G074M04GBG#AC0
| Part Description |
ARM® Cortex®-R52 Microprocessor IC RZ/T2L 1 Core, 32-Bit 800MHz 196-LFBGA (12x12) |
|---|---|
| Quantity | 22 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G074 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-R52 | Device Package | 196-LFBGA (12x12) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (1) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 196-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG | Speed | 800MHz | Supplier Device Package | 196-LFBGA (12×12) | ||
| USB | USB 3.0 (2) | Voltage – I/O | 3.3V |
Overview of R9A07G074M04GBG#AC0 – ARM Cortex‑R52 800 MHz MPU, 196‑LFBGA
The R9A07G074M04GBG#AC0 is a Renesas RZ/T2L microprocessor IC featuring a single ARM® Cortex®-R52 32‑bit core running at 800 MHz. It targets embedded and industrial applications that require real‑time processing, high‑speed connectivity, and on‑chip security features.
This device integrates a range of interfaces including 10/100/1000 Mbps Ethernet, two USB 3.0 ports and CANbus, an SDRAM memory controller, plus industrial qualification and an extended operating temperature range for deployment in demanding environments.
Key Features
- Core Single ARM® Cortex®-R52 32‑bit core operating at 800 MHz for real‑time embedded processing.
- Memory SDRAM memory controller(s) for external memory interfacing.
- High‑speed Interfaces Integrated 10/100/1000 Mbps Ethernet (1), two USB 3.0 ports and CANbus for networked and peripheral connectivity.
- Security Comprehensive security feature set including AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA‑1/2 and TRNG.
- Power & I/O Standard 3.3 V I/O voltage for compatibility with common industrial peripherals.
- Package & Mounting 196‑LFBGA (12×12) surface‑mount package for compact, high‑density PCB layouts.
- Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 125 °C for use in harsh environments.
Typical Applications
- Industrial Automation & Control — Networked control nodes leveraging Gigabit Ethernet and CANbus for deterministic connectivity in industrial environments.
- Networked Embedded Systems — USB 3.0 and GigE interfaces support high‑bandwidth peripherals and data transfer in embedded appliances.
- Secure Embedded Appliances — On‑chip cryptography, secure boot and TRNG provide a foundation for secure device designs.
- Harsh‑Environment Electronics — Industrial qualification and −40 °C to 125 °C operation for equipment deployed in temperature‑extreme conditions.
Unique Advantages
- Deterministic ARM® Cortex®‑R52 performance: Single 32‑bit core at 800 MHz delivers focused real‑time processing capability.
- Rich high‑speed connectivity: Built‑in Gigabit Ethernet, dual USB 3.0 and CANbus reduce external interface components.
- Extensive security feature set: AES, RSA, SHA‑1/2, ECC, Secure JTAG, TRNG and boot security help protect system integrity and data.
- Industrial‑grade reliability: Industrial qualification and wide operating temperature range support deployment in demanding applications.
- Compact surface‑mount package: 196‑LFBGA (12×12) enables space‑efficient board designs.
- Standard 3.3 V I/O: Simplifies integration with a broad range of industrial sensors and peripherals.
Why Choose R9A07G074M04GBG#AC0?
The R9A07G074M04GBG#AC0 combines an ARM® Cortex®‑R52 single core at 800 MHz with a comprehensive set of I/O and security features, making it well suited for embedded and industrial designs that demand real‑time processing, secure operation, and robust connectivity. Its industrial qualification and extended temperature range support deployment in harsh operating conditions.
Designed and manufactured by Renesas, this RZ/T2L device provides a compact 196‑LFBGA footprint and standard 3.3 V I/O for straightforward integration into space‑constrained, high‑reliability systems.
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Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
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