R9A07G074M01GBG#AC0
| Part Description |
ARM® Cortex®-R52 Microprocessor IC RZ/T2L 1 Core, 32-Bit 800MHz 196-LFBGA (12x12) |
|---|---|
| Quantity | 618 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G074 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-R52 | Device Package | 196-LFBGA (12x12) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (1) | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 196-LFBGA | ||
| RAM Controllers | SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | AES, Boot Security, Cryptography, ECC, RSA, Secure JTAG, SHA-1/2, TRNG | Speed | 800MHz | Supplier Device Package | 196-LFBGA (12×12) | ||
| USB | USB 3.0 (2) | Voltage – I/O | 3.3V |
Overview of R9A07G074M01GBG#AC0 – RZ/T2L MPU BGA196 1‑Core 800 MHz
The R9A07G074M01GBG#AC0 is an RZ/T2L series microprocessor IC based on an ARM® Cortex®‑R52 core. It delivers a single 32‑bit core running at 800 MHz in a 196‑LFBGA (12×12) package targeted at industrial embedded applications.
Designed for industrial environments, the device combines processing performance with high‑speed interfaces and a comprehensive hardware security feature set to support secure, connected embedded systems across extended temperature ranges.
Key Features
- Core — ARM® Cortex®‑R52 single 32‑bit core operating at 800 MHz for real‑time embedded processing.
- Memory Interfaces — Integrated SDRAM controllers to support external memory expansion and system memory needs.
- High‑Speed Connectivity — One 10/100/1000 Mbps Ethernet interface and two USB 3.0 ports for high‑bandwidth networking and peripheral connectivity.
- Fieldbus Interface — CANbus support for industrial control and vehicle‑network integration.
- Security — Built‑in AES, RSA, SHA‑1/2, TRNG, cryptography engines, boot security and Secure JTAG to support device and data protection.
- System Reliability — ECC support for memory integrity and error correction.
- Power and I/O — 3.3 V I/O voltage compatibility for common industrial interfaces.
- Package & Mounting — 196‑LFBGA (12×12) supplier device package, surface‑mount mounting type for compact board designs.
- Operating Range — Industrial qualification with an operating temperature range of −40 °C to 125 °C.
- Compliance — RoHS‑compliant for environmentally conscious designs.
Typical Applications
- Industrial Embedded Control — Single‑core real‑time processing for machine control and programmable logic where industrial qualification and extended temperature operation are required.
- Industrial Networking & Gateways — High‑speed Ethernet and CANbus support for protocol bridging, edge gateways, and communication nodes.
- Secure Embedded Systems — Devices requiring hardware cryptography, secure boot and TRNG for protected firmware and data handling.
- Ruggedized Electronics — Designs operating across −40 °C to 125 °C that require a surface‑mount 196‑LFBGA package for compact, robust assemblies.
Unique Advantages
- Single‑Core Deterministic Performance: 800 MHz ARM® Cortex®‑R52 core provides predictable 32‑bit processing for real‑time tasks.
- Integrated High‑Speed I/O: Built‑in Gigabit Ethernet and dual USB 3.0 ports reduce the need for external bridge chips and simplify board design.
- Comprehensive Hardware Security: AES, RSA, SHA‑1/2, TRNG, Secure JTAG and boot security enable robust device and data protection at the silicon level.
- Industrial‑Grade Operation: Rated for −40 °C to 125 °C and listed as Industrial qualification for dependable operation in demanding environments.
- Memory Integrity: ECC support enhances system reliability for applications where data integrity is critical.
- Compact, Surface‑Mount Package: 196‑LFBGA (12×12) form factor supports space‑constrained PCB layouts while maintaining solder‑mount reliability.
Why Choose R9A07G074M01GBG#AC0?
The R9A07G074M01GBG#AC0 combines an ARM® Cortex®‑R52 800 MHz core with a rich set of high‑speed interfaces and hardware security features in an industrial‑qualified package. Its feature set is tailored for embedded designs that require a balance of processing performance, connectivity and on‑chip security.
This part is well suited to engineering teams developing industrial and embedded systems that must operate across wide temperature ranges, support Gigabit Ethernet, USB 3.0 and CANbus, and implement hardware‑based cryptographic protections while maintaining compact surface‑mount board layouts.
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