Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
RM46L840PGET
RM46L840PGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
197
RM46L840ZWTT
RM46L840ZWTTTexas InstrumentsIC MCU 32BIT 1.25MB FLASH 337BGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
460
RM46L850CPGET
RM46L850CPGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
150
RM46L850CZWTT
RM46L850CZWTTTexas InstrumentsIC MCU 32BIT 1.25MB FLASH 337BGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,067
RM46L850PGET
RM46L850PGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
865
RM46L850ZWTT
RM46L850ZWTTTexas InstrumentsIC MCU 32BIT 1.25MB FLASH 337BGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,372
RM46L852CPGET
RM46L852CPGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,030
RM46L852CZWTT
RM46L852CZWTTTexas InstrumentsIC MCU 32BIT 1.25MB FLASH 337BGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
24
RM46L852PGET
RM46L852PGETTexas InstrumentsIC MCU 16/32BIT 1.25MB 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
383
RM46L852ZWTT
RM46L852ZWTTTexas InstrumentsIC MCU 32BIT 1.25MB FLASH 337BGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
220MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
229
RM48L530DPGET
RM48L530DPGETTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,827
RM48L540DPGET
RM48L540DPGETTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
173
RM48L540DPGETR
RM48L540DPGETRTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
314
RM48L540PGET
RM48L540PGETTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,499
RM48L730DZWTT
RM48L730DZWTTTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
513
RM48L730ZWTT
RM48L730ZWTTTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
682
RM48L740DZWTT
RM48L740DZWTTTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,622
RM48L740ZWTT
RM48L740ZWTTTexas InstrumentsIC MCU 16/32B 2MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
323
RM48L750DPGET
RM48L750DPGETTexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,380
RM48L940DZWTT
RM48L940DZWTTTexas InstrumentsIC MCU 16/32B 3MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
304

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