Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
R7S910006CBG#AC0R7S910006CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
492
R7S910007CBA#BC0R7S910007CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
155
R7S910007CBG#AC0R7S910007CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
622
R7S910011CBA#BC0R7S910011CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,508
R7S910011CBG#AC0R7S910011CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
278
R7S910013CBA#BC0R7S910013CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
56
R7S910013CBG#AC0R7S910013CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
1,034
R7S910015CBA#BC0R7S910015CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
295
R7S910015CBG#AC0R7S910015CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
164
R7S910016CBA#BC0R7S910016CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,231
R7S910016CBG#AC0R7S910016CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
1,742
R7S910017CBA#BC0R7S910017CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,626
R7S910017CBG#AC0R7S910017CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
903
R7S910018CBA#BC0R7S910018CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
953
R7S910018CBG#AC0R7S910018CBG#AC0RenesasIC MCU 32BIT ROMLESS 320FBGAMicrocontrollers320-FBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit Single-Core
Speed:
600MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-FBGA (17×17)
Package / Case:
320-FBGA
235
N/AR7S910020CBG#AC0RenesasRZ/T1-M 450MHZ ROML 544K MDIO SLMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
1,577
N/AR7S910021CBG#AC0RenesasRZ/T1-M 450MHZ ROML 1568K MDIO SMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
1.568M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
660
N/AR7S910022CBG#AC0RenesasRZ/T1-M 450MHZ ROML 544K MDIO SLMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
1,496
N/AN/AR7S910023CBG#AC0RenesasIC MCU 32BIT ROMLESS 112LFBGAMicrocontrollers112-FBGA (6x6)N/A-40°C ~ 110°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CSI, I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
51
Program Memory Type:
ROMless
RAM Size:
1.568M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
112-FBGA (6×6)
Package / Case:
112-LFBGA
778
R7S910025CBA#BC0R7S910025CBA#BC0RenesasIC MCU 32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-R4F
Core Size:
32-Bit
Speed:
450MHz
Connectivity:
CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
209
Program Memory Type:
ROMless
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (17×17)
Package / Case:
320-FBGA
1,304

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