 | | SPC5517EAMLU66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,611 | |
 | N/A | SPC5517EAVLQ66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 605 | |
 | | SPC5517EAVLU66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,768 | |
 | N/A | SPC5517EAVMG80 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,094 | |
 | | SPC5517EBMLQ66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 101 | |
 | | SPC5517EBMLQ66R | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 121 | |
 | | SPC5517EBVLQ66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 878 | |
 | | SPC5517EBVLQ66R | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 586 | |
 | | SPC5517GAMMG66 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 985 | |
 | | SPC5517GAVMG80 | NXP Semiconductors | IC MCU 32B 1.5MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 833 | |
 | | SPC5517SAMLU66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 865 | |
 | | SPC5517SBMLQ66 | NXP Semiconductors | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,516 | |
 | N/A | SPC5534MVM80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 12 | |
 | N/A | SPC5534MVM80R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 1,466 | |
 | N/A | SPC5534MVZ80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 842 | |
 | | SPC5553MVZ132 | NXP Semiconductors | IC MCU 32BIT 1.5KB FLASH 324PBGA | Microcontrollers | 324-PBGA (23x23) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-PBGA (23×23) | 970 | |
 | N/A | SPC5554MVR132 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 599 | |
 | | SPC5566MVR132 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 802 | |
 | | SPC5566MVR132R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,299 | |
 | | SPC5566MVR144 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 93 | |