Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5517EAMLU66SPC5517EAMLU66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,611
SPC5517EAVLQ66N/ASPC5517EAVLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
605
SPC5517EAVLU66SPC5517EAVLU66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,768
SPC5517EAVMG80N/ASPC5517EAVMG80NXP SemiconductorsIC MCU 32B 1.5MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,094
SPC5517EBMLQ66SPC5517EBMLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
101
SPC5517EBMLQ66RSPC5517EBMLQ66RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
121
SPC5517EBVLQ66SPC5517EBVLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
878
SPC5517EBVLQ66RSPC5517EBVLQ66RNXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
586
SPC5517GAMMG66SPC5517GAMMG66NXP SemiconductorsIC MCU 32B 1.5MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
985
SPC5517GAVMG80SPC5517GAVMG80NXP SemiconductorsIC MCU 32B 1.5MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
833
SPC5517SAMLU66SPC5517SAMLU66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
865
SPC5517SBMLQ66SPC5517SBMLQ66NXP SemiconductorsIC MCU 32BIT 1.5MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,516
SPC5534MVM80N/ASPC5534MVM80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
192
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 34x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
12
SPC5534MVM80RN/ASPC5534MVM80RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
192
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 34x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,466
SPC5534MVZ80N/ASPC5534MVZ80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
842
SPC5553MVZ132SPC5553MVZ132NXP SemiconductorsIC MCU 32BIT 1.5KB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
220
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
970
SPC5554MVR132N/ASPC5554MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
599
SPC5566MVR132SPC5566MVR132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
802
SPC5566MVR132RSPC5566MVR132RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,299
SPC5566MVR144SPC5566MVR144NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
93

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