Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5200CBV400BR2SPC5200CBV400BR2NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
583
SPC5200CBV400R2SPC5200CBV400R2NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
254
SPC5200CVR400SPC5200CVR400NXP SemiconductorsRISC MICROCONTROLLER, 32-BIT, POMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Core Processor:
PowerPC e300
Ethernet:
10/100Mbps (1)
Graphics Acceleration:
No
Mounting Type:
Surface Mount
Number of Cores/Bus Width:
1 Core, 32-Bit
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
272-BBGA
RAM Controllers:
DDR, SDRAM
Speed:
400MHz
Supplier Device Package:
272-PBGA (27×27)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
1,592
SPC5200CVR400BSPC5200CVR400BNXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
677
SPC5200CVR400BR2SPC5200CVR400BR2NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
1,207
SPC5200CVR400R2SPC5200CVR400R2NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
369
SPC5514EAMLQ66N/ASPC5514EAMLQ66NXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
946
SPC5514EBMLQ66SPC5514EBMLQ66NXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
943
SPC5514EBVLQ66SPC5514EBVLQ66NXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
945
SPC5514GBMLQ66SPC5514GBMLQ66NXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
928
SPC5515SAMLU66SPC5515SAMLU66NXP SemiconductorsIC MCU 32BIT 768KB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
373
SPC5515SBMLQ66SPC5515SBMLQ66NXP SemiconductorsIC MCU 32BIT 768KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
286
SPC5516EACMG48SPC5516EACMG48NXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
527
SPC5516EAMLQ48N/ASPC5516EAMLQ48NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,455
SPC5516EAMMG66SPC5516EAMMG66NXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
809
SPC5516EAVLQ66RSPC5516EAVLQ66RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
855
SPC5516EAVMG80SPC5516EAVMG80NXP SemiconductorsIC MCU 32BIT 1MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
537
SPC5516EBMLQ66SPC5516EBMLQ66NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
826
SPC5516GBMLQ66SPC5516GBMLQ66NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0, e200z1
Core Size:
32-Bit Dual-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
561
SPC5516SBMLQ66SPC5516SBMLQ66NXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z1
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
111
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
387

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