 | | SPC5200CBV400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 583 | |
 | | SPC5200CBV400R2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 254 | |
 | | SPC5200CVR400 | NXP Semiconductors | RISC MICROCONTROLLER, 32-BIT, PO | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART Core Processor: PowerPC e300 Mounting Type: Surface Mount Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 85°C (TA) RAM Controllers: DDR, SDRAM Supplier Device Package: 272-PBGA (27×27) | 1,592 | |
 | | SPC5200CVR400B | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 677 | |
 | | SPC5200CVR400BR2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 1,207 | |
 | | SPC5200CVR400R2 | NXP Semiconductors | IC MPU MPC52XX 400MHZ 272BGA | Microprocessors | 272-PBGA (27x27) | N/A | -40°C ~ 85°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, SDRAM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-PBGA (27×27) Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 369 | |
 | N/A | SPC5514EAMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 946 | |
 | | SPC5514EBMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 943 | |
 | | SPC5514EBVLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 945 | |
 | | SPC5514GBMLQ66 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 928 | |
 | | SPC5515SAMLU66 | NXP Semiconductors | IC MCU 32BIT 768KB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 373 | |
 | | SPC5515SBMLQ66 | NXP Semiconductors | IC MCU 32BIT 768KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 286 | |
 | | SPC5516EACMG48 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 527 | |
 | N/A | SPC5516EAMLQ48 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,455 | |
 | | SPC5516EAMMG66 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 809 | |
 | | SPC5516EAVLQ66R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 855 | |
 | | SPC5516EAVMG80 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208MAPBGA | Microcontrollers | 208-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (17×17) | 537 | |
 | | SPC5516EBMLQ66 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 826 | |
 | | SPC5516GBMLQ66 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 561 | |
 | | SPC5516SBMLQ66 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.25V Data Converters: A/D 40x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 387 | |