Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/ASPC5566MVR144RNXP SemiconductorsNXP 32-BIT MCU, POWER ARCH CORE,Microcontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,044
SPC5566MZP112RSPC5566MZP112RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
248
SPC5566MZP132SPC5566MZP132NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,022
SPC5566MZP132RSPC5566MZP132RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,641
SPC5566MZP144SPC5566MZP144NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
613
SPC5566MZP144RSPC5566MZP144RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
144MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,526
SPC5566MZP80SPC5566MZP80NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,411
SPC5566MZP80RSPC5566MZP80RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,107
SPC5567MVR132N/ASPC5567MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
238
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,217
SPC5567MVZ132SPC5567MVZ132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
238
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
135
SPC5601DF1MLL4SPC5601DF1MLL4NXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
333
SPC5601DF1VLH4SPC5601DF1VLH4NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
446
SPC5601DF1VLH4RN/ASPC5601DF1VLH4RNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
233
SPC5601DF1VLL4N/ASPC5601DF1VLL4NXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
501
SPC5601DF1VLL4RN/ASPC5601DF1VLL4RNXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
756
SPC5601PEF0MLH6SPC5601PEF0MLH6NXP SemiconductorsIC MCU 32BIT 192KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
916
SPC5601PEF0MLL6SPC5601PEF0MLL6NXP SemiconductorsIC MCU 32BIT 192KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
531
SPC5601PEF0VLH6RN/ASPC5601PEF0VLH6RNXP SemiconductorsIC MCU 32BIT 192KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
717
SPC5602BACLQ4N/ASPC5602BACLQ4NXP SemiconductorsIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
123
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
463
SPC5602BAMLL4N/ASPC5602BAMLL4NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 28x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
268

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