Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC564L60L3BCOQRSPC564L60L3BCOQRSTMicroelectronicsIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)3V - 3.63V-40°C – 105°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
683
SPC564L60L3BCOQYSPC564L60L3BCOQYSTMicroelectronicsIC MCU 32BIT 1MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)3V - 3.63V-40°C – 105°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
384
SPC564L60L5BCOQRSPC564L60L5BCOQRSTMicroelectronicsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)3V - 3.63V-40°C – 105°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
1,164
SPC564L60L5BCOQYSPC564L60L5BCOQYSTMicroelectronicsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)3V - 3.63V-40°C – 105°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
401
SPC564L60L5CCFQRSPC564L60L5CCFQRSTMicroelectronicsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)3V - 3.63V-40°C – 125°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
80MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
616
SPC564L60L5CCFQYSPC564L60L5CCFQYSTMicroelectronicsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)3V - 3.63V-40°C – 125°C
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
80MHz
Program Memory Size:
1MB (1M x 8)
Mounting Type:
Surface Mount
428
SPC564L64L3CBFSRN/ASPC564L64L3CBFSRSTMicroelectronicsIC MCU 32BIT 1.5MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,359
SPC564L64L3CBFSYN/ASPC564L64L3CBFSYSTMicroelectronicsIC MCU 32BIT 1.5MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,138
SPC564L70L3BCOSRSPC564L70L3BCOSRSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,978
SPC564L70L3BCOSYSPC564L70L3BCOSYSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
205
SPC564L70L3CBFSRSPC564L70L3CBFSRSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
925
SPC564L70L3CBFSYSPC564L70L3CBFSYSTMicroelectronicsIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
377
SPC564L70L5BBOSRN/ASPC564L70L5BBOSRSTMicroelectronicsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
96
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,246
SPC564L70L5BBOSYN/ASPC564L70L5BBOSYSTMicroelectronicsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
96
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
918
SPC565MZP56DN/ASPC565MZP56DNXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
426
SPC565MZP56DR2N/ASPC565MZP56DR2NXP SemiconductorsIC MCU 32BIT 1MB FLASH 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
56MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
36K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 40x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,367
N/AN/ASPC5668EAMMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208BGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Dual-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,138
N/AN/ASPC5668EF1AMMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208BGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Dual-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,481
SPC5668EF1AVMGN/ASPC5668EF1AVMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
828
SPC5668EK0MMGSPC5668EK0MMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,583

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