Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5673FF3MVY2SPC5673FF3MVY2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,278
SPC5673FK0MVR2SPC5673FK0MVR2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
545
SPC5673FK0MVR2RSPC5673FK0MVR2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,416
SPC5673FK0MVY2SPC5673FK0MVY2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,401
SPC5673FK0MVY2RSPC5673FK0MVY2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
532
N/AN/ASPC5673KAVJM1NXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
132
N/AN/ASPC5673KAVJM1RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
611
SPC5673KAVMM1SPC5673KAVMM1NXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,267
SPC5673KAVMM1RSPC5673KAVMM1RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
705
N/AN/ASPC5673KF0VJM1RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
582
SPC5673KF0VMM1RSPC5673KF0VMM1RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
933
SPC5673KFF0VMM1RSPC5673KFF0VMM1RNXP SemiconductorsIC MCU 32BIT 1MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,385
SPC5674FAMVR3SPC5674FAMVR3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
776
SPC5674FAMVR3RSPC5674FAMVR3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
328
N/AN/ASPC5674FAMVV3NXP SemiconductorsNXP 32-BIT MCU, POWER ARCH CORE,Microcontrollers516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
645
N/AN/ASPC5674FAMVV3RNXP SemiconductorsNXP 32-BIT MCU, POWER ARCH CORE,Microcontrollers516-PBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
13
SPC5674FAMVY3SPC5674FAMVY3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
196
SPC5674FAMVY3RSPC5674FAMVY3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,121
SPC5674FF3MVR3SPC5674FF3MVR3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,303
SPC5674FF3MVR3RSPC5674FF3MVR3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
98

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up