 | | SPC5673FF3MVY2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,278 | |
 | | SPC5673FK0MVR2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 545 | |
 | | SPC5673FK0MVR2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,416 | |
 | | SPC5673FK0MVY2 | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,401 | |
 | | SPC5673FK0MVY2R | NXP Semiconductors | IC MCU 32BIT 3MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 532 | |
| N/A | N/A | SPC5673KAVJM1 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 132 | |
| N/A | N/A | SPC5673KAVJM1R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 611 | |
 | | SPC5673KAVMM1 | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,267 | |
 | | SPC5673KAVMM1R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 705 | |
| N/A | N/A | SPC5673KF0VJM1R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 582 | |
 | | SPC5673KF0VMM1R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 933 | |
 | | SPC5673KFF0VMM1R | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,385 | |
 | | SPC5674FAMVR3 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 776 | |
 | | SPC5674FAMVR3R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 328 | |
| N/A | N/A | SPC5674FAMVV3 | NXP Semiconductors | NXP 32-BIT MCU, POWER ARCH CORE, | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 645 | |
| N/A | N/A | SPC5674FAMVV3R | NXP Semiconductors | NXP 32-BIT MCU, POWER ARCH CORE, | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 13 | |
 | | SPC5674FAMVY3 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 196 | |
 | | SPC5674FAMVY3R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 516FPBGA | Microcontrollers | 516-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 516-PBGA (27×27) | 1,121 | |
 | | SPC5674FF3MVR3 | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 1,303 | |
 | | SPC5674FF3MVR3R | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 416PBGA | Microcontrollers | 416-PBGA (27x27) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 416-PBGA (27×27) | 98 | |