Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5674FF3MVV3SPC5674FF3MVV3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
359
SPC5674FF3MVV3RSPC5674FF3MVV3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,541
SPC5674FF3MVY3SPC5674FF3MVY3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 516PBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
648
SPC5674FF3MVY3RSPC5674FF3MVY3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516PBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
204
SPC5674FF3MVZ2SPC5674FF3MVZ2NXP SemiconductorsIC MCU 32BIT 4MB FLASH 324PBGAMicrocontrollers324-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
22
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 48x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-PBGA (23×23)
Package / Case:
324-BBGA
713
SPC5674FK0MVR3SPC5674FK0MVR3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
585
SPC5674FK0MVY3SPC5674FK0MVY3NXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
1,006
SPC5674FK0MVY3RSPC5674FK0MVY3RNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516FPBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
997
N/AN/ASPC5674KAVJM2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,035
N/AN/ASPC5674KAVJM2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,546
SPC5674KAVMM2SPC5674KAVMM2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
141
SPC5674KAVMM2RSPC5674KAVMM2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
839
SPC5674KAVMS2SPC5674KAVMS2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
687
SPC5674KAVMS2RSPC5674KAVMS2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
131
SPC5674KF0VMS2SPC5674KF0VMS2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
694
SPC5674KF0VMS2RSPC5674KF0VMS2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
171
SPC5674KFF0MMS2SPC5674KFF0MMS2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
134
SPC5674KFF0MMS2RSPC5674KFF0MMS2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
1,887
SPC5674KFF0VMS2SPC5674KFF0VMS2NXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
697
SPC5674KFF0VMS2RSPC5674KFF0VMS2RNXP SemiconductorsIC MCU 32B 1.5MB FLASH 473MAPBGAMicrocontrollers473-MAPBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
473-MAPBGA (19×19)
Package / Case:
473-LFBGA
1,023

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