Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SPC5668EK0MMGRSPC5668EK0MMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,773
SPC5668EK0VMGSPC5668EK0VMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
342
SPC5668EK0VMGRSPC5668EK0VMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 64x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
31
SPC5668GAVMGN/ASPC5668GAVMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,261
SPC5668GAVMGRN/ASPC5668GAVMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,006
SPC5668GF1AMMGSPC5668GF1AMMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)3V - 5.5V-40°C – 125°C
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Program Memory Size:
2MB (2M x 8)
Mounting Type:
Surface Mount
1,768
SPC5668GF1AMMGRSPC5668GF1AMMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
274
SPC5668GF1AVMGSPC5668GF1AVMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,234
SPC5668GF1AVMGRSPC5668GF1AVMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
379
SPC5668GK0MMGSPC5668GK0MMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,125
SPC5668GK0MMGRSPC5668GK0MMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,618
SPC5668GK0VMGSPC5668GK0VMGNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
821
SPC5668GK0VMGRSPC5668GK0VMGRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208MAPBGAMicrocontrollers208-BGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z650
Core Size:
32-Bit Single-Core
Speed:
116MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
155
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
592K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 36x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (17×17)
Package / Case:
208-BGA
1,098
N/AN/ASPC5673FAMVR2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416BBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
834
N/AN/ASPC5673FAMVR2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416BBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
180
N/AN/ASPC5673FAMVY2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 516BBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
267
N/AN/ASPC5673FAMVY2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 516BBGAMicrocontrollers516-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27×27)
Package / Case:
516-BBGA
446
SPC5673FF3MVR2SPC5673FF3MVR2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,164
SPC5673FF3MVR2RSPC5673FF3MVR2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,686
SPC5673FF3MVR3SPC5673FF3MVR3NXP SemiconductorsIC MCU 32BIT 3MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Single-Core
Speed:
264MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
DMA, POR, PWM
Number of I/O:
32
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 5.25V
Data Converters:
A/D 64x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
465

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