| N/A | N/A | SPC5675KF0MJM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,006 | |
 | | SPC5675KF0MMM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 788 | |
 | | SPC5675KF0MMS2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 677 | |
 | | SPC5675KF0VMS2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 736 | |
| N/A | N/A | SPC5675KFAVJM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 322 | |
| N/A | N/A | SPC5675KFAVJM2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 355 | |
 | | SPC5675KFAVMM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 521 | |
 | | SPC5675KFAVMM2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 817 | |
 | | SPC5675KFAVMS2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 34 | |
 | | SPC5675KFAVMS2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 834 | |
| N/A | N/A | SPC5675KFF0MJM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 239 | |
 | | SPC5675KFF0MMM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 520 | |
 | | SPC5675KFF0MMM2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,337 | |
 | | SPC5675KFF0MMS2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 99 | |
 | | SPC5675KFF0MMS2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 142 | |
| N/A | N/A | SPC5675KFF0VJM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,292 | |
| N/A | N/A | SPC5675KFF0VJM2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 441 | |
 | | SPC5675KFF0VMM2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 56 | |
 | | SPC5675KFF0VMM2R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 22x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,458 | |
 | | SPC5675KFF0VMS2 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 473MAPBGA | Microcontrollers | 473-MAPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 5.5V Data Converters: A/D 34x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 473-MAPBGA (19×19) | 314 | |