Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
V62/12620-01XEV62/12620-01XETexas InstrumentsIC MCU 16BIT 2KB FLASH 8SOICMicrocontrollers8-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, PWM, WDT
Number of I/O:
4
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
865
V62/12622-01XEV62/12622-01XETexas InstrumentsIC MCU 16/32BIT 2MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
140MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
68
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 20x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
638
V62/12622-02YEV62/12622-02YETexas InstrumentsIC MCU 16/32BIT 2MB FLSH 337LBGAMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, POR
Number of I/O:
115
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
12
V62/12623-01XEV62/12623-01XETexas InstrumentsIC MCU 16BIT 4KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,027
V62/13624-01XEN/AV62/13624-01XETexas InstrumentsENHANCED PRODUCT 16-BIT ULTRA-LOMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
738
V62/13629-01XEN/AV62/13629-01XETexas InstrumentsENHANCED PRODUCT 16/32 BIT RISCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,444
V62/13629-02XEN/AV62/13629-02XETexas InstrumentsENHANCED PRODUCT 16/32 BIT RISCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R4F
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
144
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 1.32V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
663
V62/14608-02YEV62/14608-02YETexas InstrumentsIC MCU 16BIT 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-55°C ~ 125°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 14x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,123
V62/14644-01XEN/AV62/14644-01XETexas InstrumentsMSP430FR5739 24 MHZ ULP MICROCONMicrocontrollers40-VQFN (6x6)N/A-55°C ~ 85°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FRAM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-VQFN (6×6)
Package / Case:
40-VFQFN Exposed Pad
702
V62/15602-01XFN/AV62/15602-01XFTexas InstrumentsSITARA PROCESSOR: ARM CORTEX-A8,Microprocessors324-NFBGA (15x15)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
324-LFBGA
Supplier Device Package:
324-NFBGA (15×15)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, McASP, McSPI, MMC/SD/SDIO, UART
929
V62/15608-01XEV62/15608-01XETexas InstrumentsIC TRANSCEIVER HALF 1/1 8SONDrivers, Receivers, Transceivers8-SON (3x3)3V ~ 3.6V-55°C ~ 125°C
Type:
Transceiver
Protocol:
RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
80 mV
Data Rate:
20Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-VDFN Exposed Pad
Supplier Device Package:
8-SON (3×3)
1,217
V62/16627-01XEV62/16627-01XETexas InstrumentsIC MCU 16BIT 128KB FRAM 64VFQFNMicrocontrollers64-VQFN (9x9)N/A-55°C ~ 95°C (TA)
Core Processor:
CPUXV2
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FRAM
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
206
V62/17603-01XEV62/17603-01XETexas InstrumentsIC RECEIVER 0/4 16SOICDrivers, Receivers, Transceivers16-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Receiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
0/4
Receiver Hysteresis:
40 mV
Data Rate:
50Mbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,996
V62/18601-01XFN/AV62/18601-01XFTexas InstrumentsC2000 ENHANCED PRODUCT 32-BIT MCMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
I2C, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
204K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
194
V62/18601-01YEV62/18601-01YETexas InstrumentsIC MCU 32BIT 1MB FLASH 176LQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
I2C, SCI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
204K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.26V
Data Converters:
A/D 24×12/16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
654
V62/18606-01XFV62/18606-01XFTexas InstrumentsIC MCU 32BIT 4MB FLASH 337LFBGAMicrocontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
168
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 41x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,787
V62/18617-01XEN/AV62/18617-01XETexas InstrumentsRADIATION HARDENED 3.3V CAN TRANDrivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-55°C ~ 125°C (TJ)
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
618
V62/18617-01XE-TN/AV62/18617-01XE-TTexas InstrumentsRADIATION HARDENED 3.3V CAN TRANDrivers, Receivers, Transceivers8-SOIC3V ~ 3.6V-55°C ~ 125°C (TJ)
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
100 mV
Data Rate:
1Mbps
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
259
N/AV921YLFRenesasIC RECEIVER 0/2 144TQFPDrivers, Receivers, Transceivers144-TQFP (20x20)1.8V
Type:
Receiver
Number of Drivers/Receivers:
0/2
Voltage – Supply:
1.8V
Mounting Type:
Surface Mount
Package / Case:
144-TQFP Exposed Pad
Supplier Device Package:
144-TQFP (20×20)
1,353
VA80960CA16VA80960CA16IntelIC MPU I196 16MHZ 168CPGAMicroprocessors168-CPGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-CPGA
Supplier Device Package:
168-CPGA
987

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