 | | V62/12620-01XE | Texas Instruments | IC MCU 16BIT 2KB FLASH 8SOIC | Microcontrollers | 8-SOIC | N/A | -40°C ~ 125°C (TA) | Connectivity: I2C, SPI, USI Peripherals: Brown-out Detect/Reset, DMA, PWM, WDT Program Memory Size: 2KB (2K x 8 + 256B) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 4x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 8-SOIC Package / Case: 8-SOIC (0.154″”, 3.90mm Width) | 865 | |
 | | V62/12622-01XE | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 20x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 638 | |
 | | V62/12622-02YE | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 337LBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.35V ~ 1.65V Data Converters: A/D 24x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 12 | |
 | | V62/12623-01XE | Texas Instruments | IC MCU 16BIT 4KB FLASH 14TSSOP | Microcontrollers | 14-TSSOP | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, SPI, USI Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173″”, 4.40mm Width) | 1,027 | |
 | N/A | V62/13624-01XE | Texas Instruments | ENHANCED PRODUCT 16-BIT ULTRA-LO | Microcontrollers | 32-VQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 8KB (8K x 8 + 256B) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-VQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 738 | |
 | N/A | V62/13629-01XE | Texas Instruments | ENHANCED PRODUCT 16/32 BIT RISC | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,444 | |
 | N/A | V62/13629-02XE | Texas Instruments | ENHANCED PRODUCT 16/32 BIT RISC | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 1.32V Data Converters: A/D 24x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 663 | |
 | | V62/14608-02YE | Texas Instruments | IC MCU 16BIT 256KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -55°C ~ 125°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 14x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,123 | |
 | N/A | V62/14644-01XE | Texas Instruments | MSP430FR5739 24 MHZ ULP MICROCON | Microcontrollers | 40-VQFN (6x6) | N/A | -55°C ~ 85°C (TA) | Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Program Memory Size: 16KB (16K x 8) Voltage – Supply (Vcc/Vdd): 2V ~ 3.6V Data Converters: A/D 14x10b Operating Temperature: -55°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 40-VQFN (6×6) Package / Case: 40-VFQFN Exposed Pad | 702 | |
 | N/A | V62/15602-01XF | Texas Instruments | SITARA PROCESSOR: ARM CORTEX-A8, | Microprocessors | 324-NFBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100/1000Mbps (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 324-NFBGA (15×15) Additional Interfaces: CANbus, DMA, GPIO, I2C, McASP, McSPI, MMC/SD/SDIO, UART | 929 | |
 | | V62/15608-01XE | Texas Instruments | IC TRANSCEIVER HALF 1/1 8SON | Drivers, Receivers, Transceivers | 8-SON (3x3) | 3V ~ 3.6V | -55°C ~ 125°C | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 80 mV Voltage – Supply: 3V ~ 3.6V Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-SON (3×3) | 1,217 | |
 | | V62/16627-01XE | Texas Instruments | IC MCU 16BIT 128KB FRAM 64VFQFN | Microcontrollers | 64-VQFN (9x9) | N/A | -55°C ~ 95°C (TA) | Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -55°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-VQFN (9×9) Package / Case: 64-VFQFN Exposed Pad | 206 | |
 | | V62/17603-01XE | Texas Instruments | IC RECEIVER 0/4 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 4.75V ~ 5.25V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Receiver Hysteresis: 40 mV Voltage – Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,996 | |
 | N/A | V62/18601-01XF | Texas Instruments | C2000 ENHANCED PRODUCT 32-BIT MC | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Connectivity: I2C, SCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24×12/16b; D/A 3x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 194 | |
 | | V62/18601-01YE | Texas Instruments | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-HLQFP (24x24) | N/A | -55°C ~ 125°C (TA) | Connectivity: I2C, SCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (512K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 24×12/16b; D/A 3x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-HLQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 654 | |
 | | V62/18606-01XF | Texas Instruments | IC MCU 32BIT 4MB FLASH 337LFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 41x12b Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,787 | |
 | N/A | V62/18617-01XE | Texas Instruments | RADIATION HARDENED 3.3V CAN TRAN | Drivers, Receivers, Transceivers | 8-SOIC | 3V ~ 3.6V | -55°C ~ 125°C (TJ) | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 100 mV Voltage – Supply: 3V ~ 3.6V Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOIC | 618 | |
 | N/A | V62/18617-01XE-T | Texas Instruments | RADIATION HARDENED 3.3V CAN TRAN | Drivers, Receivers, Transceivers | 8-SOIC | 3V ~ 3.6V | -55°C ~ 125°C (TJ) | Number of Drivers/Receivers: 1/1 Receiver Hysteresis: 100 mV Voltage – Supply: 3V ~ 3.6V Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 8-SOIC | 259 | |
| N/A | | V921YLF | Renesas | IC RECEIVER 0/2 144TQFP | Drivers, Receivers, Transceivers | 144-TQFP (20x20) | 1.8V | – | Number of Drivers/Receivers: 0/2 Mounting Type: Surface Mount Package / Case: 144-TQFP Exposed Pad Supplier Device Package: 144-TQFP (20×20) | 1,353 | |
 | | VA80960CA16 | Intel | IC MPU I196 16MHZ 168CPGA | Microprocessors | 168-CPGA | N/A | 0°C ~ 100°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Through Hole Supplier Device Package: 168-CPGA | 987 | |