Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
VA80960CA25VA80960CA25IntelIC MPU I196 25MHZ 168CPGAMicroprocessors168-CPGAN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-CPGA
Supplier Device Package:
168-CPGA
1,663
N/AVA80960CF16IntelIC MPU I960 16MHZ 168CPGAMicroprocessors168-CPGA (44.45x44.45)N/A-40°C ~ 110°C (TC)
Core Processor:
Intel® 80960CF
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-40°C ~ 110°C (TC)
Mounting Type:
Through Hole
Package / Case:
168-BCPGA
Supplier Device Package:
168-CPGA (44.45×44.45)
Additional Interfaces:
DMA
156
VA87C196KD20VA87C196KD20Intel16-BIT, UVPROM, 20MHZMicrocontrollers68-PGA (29.46x29.46)N/A-40°C ~ 105°C (TC)
Core Processor:
MCS 96
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
Serial Port
Peripherals:
PWM, WDT
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
EPROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TC)
Mounting Type:
Through Hole
Supplier Device Package:
68-PGA (29.46×29.46)
Package / Case:
68-BPGA
1,353
VSC050XKM-01VSC050XKM-01NXP SemiconductorsVSC050SeriIControlleCMOSControllers64-LQFP (10x10)3V ~ 3.6V-40°C ~ 85°C (TA)
Function:
Controller
Interface:
Serial
Voltage – Supply:
3V ~ 3.6V
Current – Supply:
50mA
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
64-LQFP
Supplier Device Package:
64-LQFP (10×10)
190
VSC8211XVWVSC8211XVWMicrochip TechnologyIC TRANSCEIVER 1/1 117LBGADrivers, Receivers, Transceivers117-LBGA (10x14)3V ~ 3.6V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Package / Case:
117-LBGA
Supplier Device Package:
117-LBGA (10×14)
648
VSC8221XHHN/AVSC8221XHHMicrochip TechnologyIC TRANSCEIVER 1/1 100TFBGADrivers, Receivers, Transceivers100-TFBGA (9x9)3V ~ 3.6V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Package / Case:
100-TFBGA
Supplier Device Package:
100-TFBGA (9×9)
1,074
VSC8224XHGVSC8224XHGMicrochip TechnologyIC TRANSCEIVER 4/4 260PBGADrivers, Receivers, Transceivers260-PBGA3V ~ 3.6V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
4/4
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Package / Case:
260-BGA
Supplier Device Package:
260-PBGA
635
VSC8244XHGVSC8244XHGMicrochip TechnologyIC TRANSCEIVER 4/4 260PBGADrivers, Receivers, Transceivers260-PBGA3V ~ 3.6V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
4/4
Voltage – Supply:
3V ~ 3.6V
Mounting Type:
Surface Mount
Package / Case:
260-BGA
Supplier Device Package:
260-PBGA
1,197
VSC8538XHJVSC8538XHJMicrochip TechnologyIC TRANSCEIVER 1/1 444HSBGADrivers, Receivers, Transceivers444-HSBGA1.8V, 2.5V, 3.3V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Voltage – Supply:
1.8V, 2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
444-BGA Exposed Pad
Supplier Device Package:
444-HSBGA
475
VSC8601XKNVSC8601XKNMicrochip TechnologyIC TRANSCEIVER FULL 1/1 64LQFPDrivers, Receivers, Transceivers64-LQFP-EP (10x10)2.5V, 3.3V0°C ~ 90°C
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full
Voltage – Supply:
2.5V, 3.3V
Operating Temperature:
0°C ~ 90°C
Mounting Type:
Surface Mount
Package / Case:
64-LQFP Exposed Pad
Supplier Device Package:
64-LQFP-EP (10×10)
763
VSC8641XJFVSC8641XJFMicrochip TechnologyIC TRANSCEIVER FULL 1/1 88QFNDrivers, Receivers, Transceivers88-QFN (10x10)2.5V, 3.3V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full
Voltage – Supply:
2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
88-VFQFN Exposed Pad
Supplier Device Package:
88-QFN (10×10)
857
VSC8641XKOVSC8641XKOMicrochip TechnologyIC TRANSCEIVER FULL 1/1 100LQFPDrivers, Receivers, Transceivers100-LQFP2.5V, 3.3V
Type:
Transceiver
Protocol:
Gigabit Ethernet
Number of Drivers/Receivers:
1/1
Duplex:
Full
Voltage – Supply:
2.5V, 3.3V
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP
333
N/AVSC8641XKO-03Microchip TechnologyIC INTERFACE CONTROLLERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

356
W25N512GVBIGW25N512GVBIGWinbond ElectronicsIC FLASH 512MBIT SPI 24TFBGAFlash Memory24-TFBGA (6x8)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
7 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
24-TBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
196
W25N512GVBIG TRW25N512GVBIG TRWinbond ElectronicsIC FLASH 512MBIT SPI 24TFBGAFlash Memory24-TFBGA (6x8)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
6 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
24-TBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
235
W25N512GVBIRW25N512GVBIRWinbond ElectronicsIC FLASH 512MBIT SPI 24TFBGAFlash Memory24-TFBGA (6x8)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
6 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
24-TBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
1,764
W25N512GVBITW25N512GVBITWinbond ElectronicsIC FLASH 512MBIT SPI 24TFBGAFlash Memory24-TFBGA (6x8)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
7 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
24-TBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
1,351
W25N512GVBIT TRW25N512GVBIT TRWinbond ElectronicsIC FLASH 512MBIT SPI 24TFBGAFlash Memory24-TFBGA (6x8)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
6 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
24-TBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
444
W25N512GVEIGW25N512GVEIGWinbond ElectronicsIC FLASH 512MBIT SPI/QUAD 8WSONFlash Memory8-WSON (8x6)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
8-WDFN Exposed Pad
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
796
W25N512GVEIG TRW25N512GVEIG TRWinbond ElectronicsIC FLASH 512MBIT SPI/QUAD 8WSONFlash Memory8-WSON (8x6)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
6 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
SPI - Quad I/O
Memory Organization:
64M x 8
Memory Size:
512 Mbit
Memory Type:
Non-Volatile
Packaging:
8-WDFN Exposed Pad
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
700 μs
696

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