 | | VA80960CA25 | Intel | IC MPU I196 25MHZ 168CPGA | Microprocessors | 168-CPGA | N/A | 0°C ~ 100°C (TC) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Through Hole Supplier Device Package: 168-CPGA | 1,663 | |
| N/A | | VA80960CF16 | Intel | IC MPU I960 16MHZ 168CPGA | Microprocessors | 168-CPGA (44.45x44.45) | N/A | -40°C ~ 110°C (TC) | Core Processor: Intel® 80960CF Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -40°C ~ 110°C (TC) Mounting Type: Through Hole Supplier Device Package: 168-CPGA (44.45×44.45) Additional Interfaces: DMA | 156 | |
 | | VA87C196KD20 | Intel | 16-BIT, UVPROM, 20MHZ | Microcontrollers | 68-PGA (29.46x29.46) | N/A | -40°C ~ 105°C (TC) | Program Memory Size: 32KB (32K x 8) Program Memory Type: EPROM Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8×8/10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TC) Mounting Type: Through Hole Supplier Device Package: 68-PGA (29.46×29.46) | 1,353 | |
 | | VSC050XKM-01 | NXP Semiconductors | VSC050SeriIControlleCMOS | Controllers | 64-LQFP (10x10) | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Voltage – Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 64-LQFP (10×10) | 190 | |
 | | VSC8211XVW | Microchip Technology | IC TRANSCEIVER 1/1 117LBGA | Drivers, Receivers, Transceivers | 117-LBGA (10x14) | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 117-LBGA (10×14) | 648 | |
 | N/A | VSC8221XHH | Microchip Technology | IC TRANSCEIVER 1/1 100TFBGA | Drivers, Receivers, Transceivers | 100-TFBGA (9x9) | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,074 | |
 | | VSC8224XHG | Microchip Technology | IC TRANSCEIVER 4/4 260PBGA | Drivers, Receivers, Transceivers | 260-PBGA | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 4/4 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 260-PBGA | 635 | |
 | | VSC8244XHG | Microchip Technology | IC TRANSCEIVER 4/4 260PBGA | Drivers, Receivers, Transceivers | 260-PBGA | 3V ~ 3.6V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 4/4 Voltage – Supply: 3V ~ 3.6V Mounting Type: Surface Mount Supplier Device Package: 260-PBGA | 1,197 | |
 | | VSC8538XHJ | Microchip Technology | IC TRANSCEIVER 1/1 444HSBGA | Drivers, Receivers, Transceivers | 444-HSBGA | 1.8V, 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 1.8V, 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 444-BGA Exposed Pad Supplier Device Package: 444-HSBGA | 475 | |
 | | VSC8601XKN | Microchip Technology | IC TRANSCEIVER FULL 1/1 64LQFP | Drivers, Receivers, Transceivers | 64-LQFP-EP (10x10) | 2.5V, 3.3V | 0°C ~ 90°C | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10×10) | 763 | |
 | | VSC8641XJF | Microchip Technology | IC TRANSCEIVER FULL 1/1 88QFN | Drivers, Receivers, Transceivers | 88-QFN (10x10) | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Package / Case: 88-VFQFN Exposed Pad Supplier Device Package: 88-QFN (10×10) | 857 | |
 | | VSC8641XKO | Microchip Technology | IC TRANSCEIVER FULL 1/1 100LQFP | Drivers, Receivers, Transceivers | 100-LQFP | 2.5V, 3.3V | – | Protocol: Gigabit Ethernet Number of Drivers/Receivers: 1/1 Voltage – Supply: 2.5V, 3.3V Mounting Type: Surface Mount Supplier Device Package: 100-LQFP | 333 | |
| N/A | | VSC8641XKO-03 | Microchip Technology | IC INTERFACE CONTROLLER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 356 | |
 | | W25N512GVBIG | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 196 | |
 | | W25N512GVBIG TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 235 | |
 | | W25N512GVBIR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,764 | |
 | | W25N512GVBIT | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,351 | |
 | | W25N512GVBIT TR | Winbond Electronics | IC FLASH 512MBIT SPI 24TFBGA | Flash Memory | 24-TFBGA (6x8) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 444 | |
 | | W25N512GVEIG | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 796 | |
 | | W25N512GVEIG TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 696 | |