Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AS4C8M16SA-7TCNAS4C8M16SA-7TCNAlliance Memory, Inc.IC DRAM 128MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 16
Memory Size:
128 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
14 ns
581
AS4C8M16SA-7TCNTRAS4C8M16SA-7TCNTRAlliance Memory, Inc.IC DRAM 128MBIT PAR 54TSOP IIMemory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 16
Memory Size:
128 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
14 ns
1,170
AS4C8M16SB-6TINAS4C8M16SB-6TINAlliance Memory, Inc.IC DRAM 128MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
8M x 16
Memory Size:
128 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
27
AS4C8M16SB-6TINTRAS4C8M16SB-6TINTRAlliance Memory, Inc.IC DRAM 128MBIT LVTTL 54TSOP IIMemory54-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
8M x 16
Memory Size:
128 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
12 ns
722
AS4C8M32MSB-6BINAS4C8M32MSB-6BINAlliance Memory, Inc.IC DRAM 256MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
125
AS4C8M32MSB-6BINTRAS4C8M32MSB-6BINTRAlliance Memory, Inc.IC DRAM 256MBIT PARALLEL 90FBGAMemory90-FBGA (8x13)1.7V ~ 1.95V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-VFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
15 ns
542
AS4C8M32S-6TINAS4C8M32S-6TINAlliance Memory, Inc.IC DRAM 256MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
91
AS4C8M32S-6TINTRAS4C8M32S-6TINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5.5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
563
AS4C8M32S-7TCNAS4C8M32S-7TCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.5 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
190
AS4C8M32S-7TCNTRAS4C8M32S-7TCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 86TSOP IIMemory86-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.5 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
86-TFSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
828
AS4C8M32SA-6BINAS4C8M32SA-6BINAlliance Memory, Inc.IC DRAM 256MBIT PAR 90TFBGAMemory90-TFBGA (8x13)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
2 ns
1,061
AS4C8M32SA-6BINTRAS4C8M32SA-6BINTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 90TFBGAMemory90-TFBGA (8x13)3V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
5 ns
Clock Frequency:
166 MHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
2 ns
748
AS4C8M32SA-7BCNAS4C8M32SA-7BCNAlliance Memory, Inc.IC DRAM 256MBIT PAR 90TFBGAMemory90-TFBGA (8x13)3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
2 ns
792
AS4C8M32SA-7BCNTRAS4C8M32SA-7BCNTRAlliance Memory, Inc.IC DRAM 256MBIT PAR 90TFBGAMemory90-TFBGA (8x13)3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
5.4 ns
Clock Frequency:
143 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
8M x 32
Memory Size:
256 Mbit
Memory Type:
Volatile
Packaging:
90-TFBGA
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
2 ns
1,719
AS83C196EA
AS83C196EAIntel16-BIT, MROM, 8096 CPU, 40MHZMicrocontrollers160-QFPN/A-40°C ~ 125°C (TA)
Core Processor:
83C196EA
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
SSIO
Peripherals:
PWM, WDT
Number of I/O:
83
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
ROM
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP
Package / Case:
160-QFP
655
N/AN/AAS87C196ENF8IntelMICROCONTROLLER, 16 BIT, MCS96 CMicrocontrollersN/AN/AN/A
Core Size:
16-Bit
Mounting Type:
Surface Mount
882
ASFC32G31T3-51BINASFC32G31T3-51BINAlliance Memory, Inc.IC FLASH 256GBIT EMMC 153FBGAMemory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
1,108
ASFC32G31T3-51BINTRASFC32G31T3-51BINTRAlliance Memory, Inc.IC FLASH 256GBIT EMMC 153FBGAMemory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
eMMC_5.1
Memory Organization:
32G x 8
Memory Size:
256 Gbit
Memory Type:
Non-Volatile
Packaging:
153-TFBGA
Qualification:
N/A
Technology:
FLASH - NAND (TLC)
Write Cycle Time Word Page:
N/A
673
ASFC4G31M-51BINASFC4G31M-51BINAlliance Memory, Inc.IC FLASH 32GBIT MMC 153FBGAMemory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND
Write Cycle Time Word Page:
N/A
1,677
ASFC4G31M-51BINTRASFC4G31M-51BINTRAlliance Memory, Inc.IC FLASH 32GBIT EMMC 153FBGAMemory153-FBGA (11.5x13)2.7V ~ 3.6V-40°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
200 MHz
Grade:
Industrial
Memory Format:
FLASH
Memory Interface:
MMC
Memory Organization:
4G x 8
Memory Size:
32 Gbit
Memory Type:
Non-Volatile
Packaging:
153-VFBGA
Qualification:
N/A
Technology:
FLASH - NAND (SLC)
Write Cycle Time Word Page:
N/A
343

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