Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
B10011S-MFPG3B10011S-MFPG3Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
687
B10011S-MFPG3YB10011S-MFPG3YMicrochip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
530
B10011S-MFPG3Y74B10011S-MFPG3Y74Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
705
N/AB164CILM3VCAZNTInfineon TechnologiesIC MCU 16BIT ROMLESS 80MQFPMicrocontrollersN/AN/A0°C ~ 70°C (TA)
Core Processor:
C166
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SPI, SSC, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
59
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
61
B3221PM3BDGUI-UB3221PM3BDGUI-UKingston TechnologyIC DRAM 32GBIT PAR 200FBGADRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-25°C ~ 85°C (TC)
Access Time:
3.5 ns
Clock Frequency:
1.866 GHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4
Write Cycle Time Word Page:
18 ns
1,765
B3221PM3BDGVIW-UB3221PM3BDGVIW-UKingston Technology32GB 200 BALL LPDDR4 4266MHDRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-40°C ~ 95°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Automotive
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4
Write Cycle Time Word Page:
18 ns
1,098
B3221XM3BDGVI-UB3221XM3BDGVI-UKingston TechnologyIC DRAM 32GBIT PAR 200FBGADRAM Memory200-FBGA (10x14.5)1.06V ~ 1.17V, 1.7V ~ 1.95V-25°C ~ 85°C (TC)
Access Time:
3.5 ns
Clock Frequency:
2.133 GHz
Grade:
Industrial
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
2G x 16
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
200-WFBGA
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR4X
Write Cycle Time Word Page:
18 ns
701
N/AB4420NSE7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
1,261
N/AB4420NSN7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
111
N/AB4420NXE7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
1,049
N/AB4420NXN7QQMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
215
B4860NSE7QUMDB4860NSE7QUMDNXP SemiconductorsQORIQ QONVERGE SOC, 6X1.2GHZ STAMicroprocessorsN/AN/AN/A
Voltage – I/O:
1 V – 2.5 V
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
RAM Controllers:
DDR3, DDR3L
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
118
N/AB4860NSN7QUMDNXP SemiconductorsIC MPU QORIQ 1.8GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
285
N/AB4860NXE7QUMDNXP SemiconductorsIC MPU QORIQ 1.8GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.8GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
859
B4860NXN7QUMDB4860NXN7QUMDNXP SemiconductorsB4860 - QORIQ QONVERGE SOC, 6X1.MicroprocessorsN/AN/AN/A
Voltage – I/O:
1 V – 2.5 V
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
RAM Controllers:
DDR3, DDR3L
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
1,973
B505CA4EMCAXPB505CA4EMCAXPInfineon TechnologiesIC MCU 8BIT 32KB OTP 44MQFPMicrocontrollersPG-MQFP-44-2N/A0°C ~ 70°C (TA)
Core Processor:
C500
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
4.25V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-MQFP-44-2
Package / Case:
44-QFP
1,200
BA12003BBA12003BRohm SemiconductorIC DARLINGTON ARRAY 7/0 16DIPDrivers, Receivers, Transceivers16-DIP--25°C ~ 75°C
Type:
Darlington Array
Number of Drivers/Receivers:
7/0
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-DIP
1,215
BA12003BF-E2BA12003BF-E2Rohm SemiconductorIC DARLINGTON ARRAY 7/0 16SOPDrivers, Receivers, Transceivers16-SOP--25°C ~ 75°C
Type:
Darlington Array
Number of Drivers/Receivers:
7/0
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
16-SOP
1,212
BA12003DF-ZE2N/ABA12003DF-ZE2Rohm SemiconductorIC DARLINGTON ARRAY 7/0 16SOPDrivers, Receivers, Transceivers16-SOP0.5V ~ 30V-40°C ~ 85°C
Type:
Darlington Array
Number of Drivers/Receivers:
7/0
Voltage – Supply:
0.5V ~ 30V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
16-SOP
760
BA12004DF-ZE2N/ABA12004DF-ZE2Rohm SemiconductorIC DARLINGTON ARRAY 7/0 16SOPDrivers, Receivers, Transceivers16-SOP0.5V ~ 30V-40°C ~ 85°C
Type:
Darlington Array
Number of Drivers/Receivers:
7/0
Voltage – Supply:
0.5V ~ 30V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
16-SOP
1,280

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