Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
BSC9131NLN1HHHBBSC9131NLN1HHHBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
478
BSC9131NSE1KHKBBSC9131NSE1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
392
BSC9131NSN1KHKBBSC9131NSN1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
388
BSC9131NXE1KHKBBSC9131NXE1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
503
N/ABSC9131NXE7KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
1,018
BSC9131NXN1KHKBBSC9131NXN1KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
491
N/ABSC9131NXN7KHKBNXP SemiconductorsIC MPU QORIQ 800MHZ 520FCBGAMicroprocessors520-FCBGA (21x21)N/A-40°C ~ 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
520-FBGA, FCBGA
Supplier Device Package:
520-FCBGA (21×21)
824
N/ABSC9132NSE7KNKBNXP SemiconductorsIC MPU 1GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
134
N/ABSC9132NSE7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
1,239
N/ABSC9132NSN7KNKBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
516
N/ABSC9132NSN7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
189
N/ABSC9132NXE7KNKBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
521
N/ABSC9132NXE7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Boot Security, Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
426
N/ABSC9132NXN7KNKBNXP SemiconductorsBSC9132 - QORIQ QONVERGE SOC, 2XMicroprocessorsN/AN/AN/A
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Graphics Acceleration:
No
439
N/ABSC9132NXN7MNMBNXP SemiconductorsIC MPU QORIQ 1.333GHZ 780FCBGAMicroprocessors780-FCBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SC3850 – Dual
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA, FCBGA
Supplier Device Package:
780-FCBGA (23×23)
1,256
BU2050F-E2BU2050F-E2Rohm SemiconductorIC DRIVER 8/0 14SOPDrivers, Receivers, Transceivers14-SOP4.5V ~ 5.5V-40°C ~ 85°C
Type:
Driver
Number of Drivers/Receivers:
8/0
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
14-SOP
1,245
BU2090BU2090Rohm SemiconductorIC DRIVER 1/0 16DIPDrivers, Receivers, Transceivers16-DIP2.7V ~ 5.5V-25°C ~ 75°C
Type:
Driver
Number of Drivers/Receivers:
1/0
Voltage – Supply:
2.7V ~ 5.5V
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-DIP
67
BU2090F-E2BU2090F-E2Rohm SemiconductorIC DRIVER 1/0 16SOPDrivers, Receivers, Transceivers16-SOP2.7V ~ 5.5V-25°C ~ 75°C
Type:
Driver
Number of Drivers/Receivers:
1/0
Voltage – Supply:
2.7V ~ 5.5V
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
16-SOP
1,586
BU2090FS-E2BU2090FS-E2Rohm SemiconductorIC DRIVER 1/0 16SSOPDrivers, Receivers, Transceivers16-SSOP-A2.7V ~ 5.5V-25°C ~ 75°C
Type:
Driver
Number of Drivers/Receivers:
1/0
Voltage – Supply:
2.7V ~ 5.5V
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Surface Mount
Package / Case:
16-LSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
16-SSOP-A
114
BU2092F-E2BU2092F-E2Rohm SemiconductorIC DRIVER 12/0 18SOPDrivers, Receivers, Transceivers18-SOP2.7V ~ 5.5V-25°C ~ 75°C
Type:
Driver
Number of Drivers/Receivers:
12/0
Voltage – Supply:
2.7V ~ 5.5V
Operating Temperature:
-25°C ~ 75°C
Mounting Type:
Surface Mount
Package / Case:
18-SOIC (0.213″”, 5.40mm Width)
Supplier Device Package:
18-SOP
987

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