BSC9131NXN1KHKB

IC MPU QORIQ 800MHZ 520FCBGA
Part Description

PowerPC e500 Microprocessor IC QorIQ Qonverge BSC 1 Core, 32-Bit 800MHz 520-FCBGA (21x21)

Quantity 874 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesBSC9131
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SC3850Core ProcessorPowerPC e500Device Package520-FCBGA (21x21)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case520-FBGA, FCBGARAM ControllersDDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed800MHzSupplier Device Package520-FCBGA (21×21)
USBUSB 2.0 (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of BSC9131NXN1KHKB – IC MPU QORIQ 800MHZ 520FCBGA

The BSC9131NXN1KHKB is a QorIQ Qonverge microprocessor combining a Power Architecture e500 core with StarCore DSP and MAPLE-B2F baseband acceleration. It is a highly integrated 32-bit device running at 800 MHz in a 520-FCBGA (21×21) package, qualified for industrial applications.

Designed for femtocell and small-cell wireless solutions, the device targets LTE-FDD/TDD, WCDMA (HSPA+), CDMA2K and related air interfaces and can support two concurrent standards, delivering integrated processing, memory and connectivity for baseband and control functions.

Key Features

  • Core Processing — Power Architecture e500 32-bit processor at 800 MHz with single-core configuration for control and system processing.
  • DSP and Acceleration — StarCore SC3850 DSP subsystem with 512 KB private L2 cache and MAPLE-B2F multi-accelerator baseband engine for LTE/UMTS/CDMA2K functions.
  • Memory Subsystem — DDR3/DDR3L memory controller supporting 32-bit data width (40 bits including ECC) and up to 800 MHz data rate; integrated flash controller for NOR and NAND.
  • Connectivity — Two triple-speed Gigabit Ethernet controllers (10/100/1000 Mbps), and a USB 2.0 host/device controller for peripheral and network interfacing.
  • Security — Dedicated security features including boot security, cryptography and a hardware random number generator.
  • RF and Control Interfaces — Antenna interface controller supporting JESD207/ADI RF interfaces and additional interfaces such as AIC and MaxPHY serial interfaces; PWMs and peripheral controllers included.
  • Package and Temperature — 520-FCBGA surface-mount package (21×21 mm) rated for industrial operating temperature from −40 °C to 105 °C.
  • Compliance — RoHS compliant and specified for industrial qualification.

Typical Applications

  • Femtocell Base Stations — Home and small-office cellular base stations using LTE-FDD/TDD, WCDMA (HSPA+) or CDMA2K standards, handling digital baseband and control processing.
  • Enterprise Femtocell Solutions — Integrated processing and network connectivity for enterprise small-cell deployments requiring industrial qualification and wide temperature operation.
  • Multi‑standard Wireless Equipment — Platforms that must support multiple air interfaces concurrently, leveraging the MAPLE-B2F accelerator and DSP for L1/L2 processing.

Unique Advantages

  • Highly integrated processing: Combines e500 CPU, SC3850 DSP and MAPLE-B2F accelerators to consolidate baseband and control workloads on a single device, reducing system BOM.
  • Multi‑standard baseband support: Architected for LTE-FDD/TDD, WCDMA (HSPA+), CDMA2K and TD‑SCDMA, with capability to support two concurrent standards for flexible deployments.
  • Robust memory and I/O: DDR3/DDR3L controller with ECC support and integrated flash controller plus Gigabit Ethernet and USB 2.0 for high-throughput connectivity.
  • On‑chip security: Built-in boot security, cryptography and hardware RNG for secure device provisioning and operation.
  • Industrial readiness: RoHS compliant and specified for −40 °C to 105 °C operation, suitable for deployed indoor/outdoor small‑cell environments.
  • Compact surface-mount package: 520‑FCBGA (21×21) footprint enables dense board designs for space-constrained base stations and modules.

Why Choose BSC9131NXN1KHKB?

The BSC9131NXN1KHKB positions itself as an integrated solution for wireless small‑cell and femtocell platforms that require combined CPU, DSP and hardware acceleration in a single, industrial‑qualified device. Its mix of real-time baseband acceleration, DSP resources and flexible memory and I/O makes it suitable for designs that must support multiple cellular air interfaces and concurrent operation modes.

For designers targeting femtocell and small‑cell access points, this device offers a compact, connectivity-rich building block with on‑chip security and industrial temperature capability, backed by available software and ecosystem tooling for wireless L1/L2/L3 development.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the BSC9131NXN1KHKB.

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