BSC9132NSN7MNMB

IC MPU QORIQ 1.333GHZ 780FCBGA
Part Description

PowerPC e500 Microprocessor IC QorIQ Qonverge BSC 2 Core, 32-Bit 1.333GHz 780-FCBGA (23x23)

Quantity 584 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesBSC9132
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SC3850 – DualCore ProcessorPowerPC e500Device Package780-FCBGA (23x23)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case780-BFBGA, FCBGARAM ControllersDDR3, DDR3LREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.333GHzSupplier Device Package780-FCBGA (23×23)
USBUSB 2.0 (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of BSC9132NSN7MNMB – IC MPU QORIQ 1.333GHZ 780FCBGA

The BSC9132NSN7MNMB is a QorIQ Qonverge multicore microprocessor featuring two PowerPC e500 32-bit cores running at 1.333 GHz in a 780-FCBGA (23 × 23 mm) package. Designed for embedded communications and baseband processing, it combines general-purpose e500 cores with DSP subsystems and a suite of high-speed I/O to address wireless infrastructure and networking applications.

This device delivers a balance of compute, hardware acceleration and integrated connectivity—making it suitable for designs that require dual-core application processing, DSP-assisted signal processing, robust memory interfaces and on-chip security.

Key Features

  • Core Architecture Two high-performance 32-bit PowerPC e500 cores at 1.333 GHz, with IEEE double-precision floating-point support and enhanced debug/profiling units.
  • Cache and Memory 32-Kbyte L1 instruction and 32-Kbyte L1 data caches per core and a 512-Kbyte L2 cache configurable as SRAM or stashing memory; two DDR3/DDR3L SDRAM controllers with 32-bit data paths and ECC support.
  • DSP Subsystems Two SC3850 DSP core subsystems for signal processing acceleration, along with the MAPLE-B2P multi-accelerator platform for FFT, convolution, turbo/Viterbi and other baseband algorithms.
  • Integrated Security On-chip ULE CAAM security engine providing DES/AES/PKE/SHA/RNG/CRC and secure boot capability for authenticated system start-up and cryptographic processing.
  • High-Speed Connectivity Two enhanced three-speed Ethernet controllers (10/100/1000 Mbps), one USB 2.0 controller (Host/Device), one PCI Express interface (5G capable), four SerDes lanes, and shared SGMII/CPRI options.
  • Peripheral and I/O Integrated Flash controller (NAND/NOR), enhanced SD/MMC host controller, two TDM interfaces, Antenna Interface Controller (AIC) with JESD and custom RF ports, USIM, eSPI, dual UARTs, I2C and up to 96 GPIOs.
  • System Reliability L2 cache with ECC and DDR ECC support, programmable interrupt controllers, multiple DMA controllers and enhanced debug/profiling units for development and field reliability.
  • Package and Temperature 780-ball FCBGA package (23 mm × 23 mm) with surface-mount mounting type and an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Small-cell and Pico Base Stations On-chip MAPLE-B2P accelerators and DSP subsystems enable baseband channel processing, MIMO and chip-rate operations for wireless access points and small-cell infrastructure.
  • Wireless Infrastructure Dual e500 cores with high-speed SerDes, PCIe and Ethernet interfaces support control-plane and data-plane processing in network equipment.
  • Secure Communications Integrated CAAM security engine and secure boot are suited for secure network elements, encryption offload and authenticated firmware environments.
  • Network Appliances Multi-protocol Ethernet, USB, SD/MMC and integrated flash controller support deployment in gateway, router and edge processing applications.

Unique Advantages

  • Highly Integrated Processing and DSP: Combines dual e500 application cores with dual SC3850 DSP subsystems and MAPLE-B2P accelerators to consolidate baseband and control processing on a single device.
  • Comprehensive Connectivity: Multiple high-speed interfaces (Ethernet, PCIe, SerDes, USB, SD/MMC, AIC) reduce board-level complexity and enable versatile system architectures.
  • Built-in Security and Secure Boot: On-chip cryptography and RNG alongside secure boot support system integrity and trusted platform deployment without external security silicon.
  • Memory Robustness: DDR3/DDR3L controllers with ECC and L2 cache with ECC improve data integrity for critical communications workloads.
  • Deployment-Ready Package and Thermal Range: 780-FCBGA (23 × 23 mm) surface-mount package with 0 °C to 105 °C operating temperature for embedded and communications equipment environments.

Why Choose BSC9132NSN7MNMB?

The BSC9132NSN7MNMB positions itself as a compact, integrated multicore solution for embedded communications and baseband processing. Its combination of dual e500 cores, dedicated DSP subsystems, hardware accelerators and wide-ranging high-speed I/O lets designers consolidate functionality and streamline BOM for wireless infrastructure and network appliance designs.

This device is a fit for customers needing scalable compute, on-chip security and robust memory/error checking in a single package—supporting development efficiency and long-term deployment in embedded communications systems backed by documented platform features.

Request a quote or submit a procurement inquiry to begin configuring the BSC9132NSN7MNMB for your design and receive assistance with availability and ordering.

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