BSC9132NXN7MNMB
| Part Description |
PowerPC e500 Microprocessor IC QorIQ Qonverge BSC 2 Core, 32-Bit 1.333GHz 780-FCBGA (23x23) |
|---|---|
| Quantity | 1,519 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | BSC9132 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; SC3850 – Dual | Core Processor | PowerPC e500 | Device Package | 780-FCBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 780-BFBGA, FCBGA | RAM Controllers | DDR3, DDR3L | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 1.333GHz | Supplier Device Package | 780-FCBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 1.8V, 2.5V, 3.3V |
Overview of BSC9132NXN7MNMB – IC MPU QORIQ 1.333GHZ 780FCBGA
The BSC9132NXN7MNMB from NXP Semiconductors is a QorIQ Qonverge multicore PowerPC e500 microprocessor packaged in a 780-FCBGA (23×23 mm) footprint. It combines two 32‑bit e500 cores running at 1.333 GHz with integrated DSP subsystems and a broad set of high-speed I/O to address baseband processing and embedded communications applications.
Designed for industrial environments, the device emphasizes compute integration, secure boot and cryptography, and extensive memory and interface support—making it suitable for wireless infrastructure, industrial networking, and other embedded communications systems requiring deterministic performance and system-level integration.
Key Features
- Core & Performance – Dual PowerPC e500 32‑bit cores at 1.333 GHz with hardware debug and profiling support.
- Cache and Memory – Per-core 32‑Kbyte L1 instruction and 32‑Kbyte L1 data caches plus a 512‑Kbyte L2 cache (configurable); two DDR3/DDR3L 32‑bit memory controllers with ECC.
- DSP Subsystems & Accelerators – Two SC3850 DSP core subsystems and a Multi Accelerator Platform Engine (MAPLE‑B2P) for FFTs, convolution, turbo/Viterbi, MIMO and other baseband algorithms.
- Security & Boot – Integrated security engine (ULE CAAM) supporting DES, AES, RNG, SHA, CRC and public-key operations, plus secure boot capability and hardware random number generation.
- Ethernet & Networking – Two enhanced three‑speed eTSECs supporting 10/100/1000 Mbps, TCP/IP acceleration, QoS/classification and IEEE 1588 support.
- High‑Speed Interfaces – One PCI Express interface (with 5G support) and four SerDes lanes configurable between PCIe, SGMII and CPRI; Antenna Interface Controller (AIC) supporting JESD and CPRI options.
- Peripheral I/O – High‑speed USB 2.0 (host/device, EHCI, ULPI), enhanced SD/MMC host controller (eSDHC), two eSPI, two I2C, two DUARTs, two TDM interfaces and 96 GPIOs.
- System Resources – Two DMA controllers (4‑channel Power Architecture side; up to 32 unidirectional DSP channels), eight 32‑bit timers and integrated flash controller supporting NAND/NOR.
- Package & Industrial Grade – 780‑FCBGA (23×23 mm) surface‑mount package; industrial qualification with operating temperature range from −40 °C to 105 °C.
Typical Applications
- Wireless Infrastructure & Baseband Processing – MAPLE‑B2P accelerators and SC3850 DSP subsystems enable UMTS/LTE chip‑rate and channel processing for pico and small cell baseband designs.
- Industrial Networking – Dual gigabit Ethernet controllers with IEEE 1588 and QoS/classification support robust industrial and communications networking functions.
- Secure Embedded Communications – Integrated CAAM security engine, secure boot and RNG support secure link and device authentication use cases.
- High‑Speed I/O Systems – PCIe, SerDes lanes, USB 2.0 and eSDHC interfaces make the device suitable for systems requiring high throughput and flexible peripheral connectivity.
Unique Advantages
- Highly integrated compute and DSP: Dual e500 cores plus SC3850 DSP subsystems and MAPLE accelerators reduce the need for external processors for baseband workloads.
- Comprehensive security: On‑chip CAAM, secure boot and RNG provide a hardware foundation for secure system designs and protected boot chains.
- Rich connectivity suite: Built‑in PCIe, SerDes multiplexing, dual gigabit Ethernet, USB and SD/MMC support simplifies board-level integration for communications equipment.
- Memory reliability: DDR3/DDR3L controllers with ECC and sizable L2 cache options provide data integrity and predictable memory behavior for industrial deployments.
- Industrial temperature support: Rated for −40 °C to 105 °C to meet demanding operating environments.
- System offload capabilities: TCP/IP acceleration, hardware accelerators and DMA resources help offload real-time processing and improve deterministic throughput.
Why Choose BSC9132NXN7MNMB?
The BSC9132NXN7MNMB delivers a balanced combination of PowerPC e500 general‑purpose cores, DSP subsystems and dedicated accelerators tailored for embedded communications and baseband processing. Its integrated security, extensive I/O options and memory controllers with ECC make it a practical choice for industrial and networked systems that require a compact, highly integrated processing solution.
This device is well suited to developers building wireless infrastructure, secure communications equipment or high‑performance embedded networking products that demand deterministic processing, comprehensive peripheral integration and operation across industrial temperature ranges.
Request a quote or submit an inquiry to get pricing and availability for the BSC9132NXN7MNMB. Our team can provide technical details, lead times and support for integration into your design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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