Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AX500-FGG484IAX500-FGG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
317
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,493
AX500-FGG484MAX500-FGG484MMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
500000
Number of I/O:
317
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,799
AX500-FGG676AX500-FGG676Microchip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
336
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
406
AX500-FGG676IAX500-FGG676IMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
336
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
485
AX500-FGG676MAX500-FGG676MMicrochip TechnologyIC FPGA 336 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
500000
Number of I/O:
336
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
1,063
AX500-PQ208AX500-PQ208Microchip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
180
AX500-PQ208IAX500-PQ208IMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
619
AX500-PQ208MAX500-PQ208MMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
578
AX500-PQG208AX500-PQG208Microchip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
762
AX500-PQG208IAX500-PQG208IMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
215
AX500-PQG208MAX500-PQG208MMicrochip TechnologyIC FPGA 115 I/O 208QFPFPGAs208-PQFP (28x28)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
500000
Number of I/O:
115
Number of LABs/CLBs:
8064
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
73728
986
AX8052F100-2-TA05AX8052F100-2-TA05onsemiIC MCU 8BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (5x5)1.8V - 3.6V-40°C – 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
20 MIPS
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
540
AX8052F100-2-TW30AX8052F100-2-TW30onsemiIC MCU 8BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (5x5)1.8V - 3.6V-40°C – 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
20 MIPS
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
136
AX8052F100-3-TA05N/AAX8052F100-3-TA05onsemiMCU 8BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
20 MIPS
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
121
N/AN/AAX8052F100-3-TW30onsemiMCU 8BIT 64KB FLASH 28QFNMicrocontrollers28-QFN (5x5)1.8V - 3.6V-40°C – 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
20 MIPS
Program Memory Size:
64KB (64K x 8)
Mounting Type:
Surface Mount
10
N/AN/AAX8052F100-3-WD1onsemiIC MCU 8BIT 64KB FLASH WAFERMicrocontrollersWaferN/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
20 MIPS
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, Crypto – AES, DMA, POR, PWM, TRNG, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Wafer
Package / Case:
Die
1,569
N/AAY80609007293AAIntelIC MPU Z670 1.5GHZ 518BGAMicroprocessors518-PBGA (13.8x13.8)N/A90°C (TJ)
Core Processor:
Intel Atom® Processor Z670
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Voltage – I/O:
1.1125V, 1.5V
Operating Temperature:
90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
518-BGA
Supplier Device Package:
518-PBGA (13.8×13.8)
Grade:
Commercial
1,782
B10011S-MFPG1N/AB10011S-MFPG1Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
835
B10011S-MFPG1YB10011S-MFPG1YMicrochip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
767
B10011S-MFPG1Y74B10011S-MFPG1Y74Microchip TechnologyIC TRANSCEIVER 1/1 16SODrivers, Receivers, Transceivers16-SO4.75V ~ 5.25V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Data Rate:
250kbps
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SO
1,326

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