AX500-FGG676M

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 1,541 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FGG676M – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

The AX500-FGG676M is an Axcelerator family antifuse FPGA optimized for secure, high-performance system integration. Based on Microchip's AX architecture, it delivers a single-chip nonvolatile solution with on-chip SRAM, embedded FIFO control logic and segmentable clock resources for demanding digital designs.

This device targets applications that require deterministic timing, hardware-level design security and high-speed I/O. Key value propositions include multi-MHz internal performance, integrated memory and flexible I/O configurability in a 676-FBGA package suitable for military-grade environments.

Key Features

  • Core Capacity – Approximately 500,000 equivalent system gates with 8,064 logic elements (cells) to implement complex logic and control functions.
  • Embedded Memory – 73,728 total RAM bits of on-chip SRAM with variable-aspect 4,608‑bit RAM blocks and embedded FIFO control logic for buffering and packet handling.
  • High-Performance Timing – Family-level performance indicators include 350+ MHz system performance and 500+ MHz internal performance; deterministic, user-controllable timing and segmentable clock resources are provided.
  • Programmable I/O – 336 user I/Os with support for mixed-voltage operation and high-speed differential standards (LVDS, LVPECL) including 700 Mb/s LVDS-capable I/Os and bank-selectable I/O banks.
  • On-Chip PLLs – Embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities to support system clocking up to 1 GHz (family-level specification).
  • Security and Nonvolatile Programming – Antifuse, single-chip nonvolatile architecture with FuseLock programming technology to protect against reverse engineering and design theft.
  • Package and Mounting – 676‑FBGA (27 × 27) surface-mount package (676‑BGA case) suitable for compact board layouts.
  • Power and Temperature – Core supply range 1.425 V to 1.575 V; rated operating temperature −55 °C to 125 °C and classified as Military grade.
  • Standards and Testability – Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and unique in-system diagnostic and debug capability with Microchip Silicon Explorer II (family feature).
  • Environmental – RoHS compliant.

Typical Applications

  • Defense and Military Systems – Military-grade operating temperature and robust nonvolatile antifuse programming make this device suitable for defense electronics requiring secure, long-term operation.
  • High-Speed Data Transport – Embedded FIFOs, high-performance internal timing and 700 Mb/s-capable LVDS I/Os enable deployment in data multiplexing, backplane bridging and SERDES-adjacent subsystems.
  • Telecommunications Infrastructure – Deterministic timing, on-chip RAM and PLL frequency synthesis support packet buffering, framing and clock-domain crossing in telecom line cards and routers.
  • Secure System Control – Nonvolatile antifuse programming and FuseLock protection suit applications where design confidentiality and tamper resistance are required.

Unique Advantages

  • Nonvolatile, One-Time Programmable Security: Antifuse programming with FuseLock protects intellectual property and prevents reverse engineering.
  • Integrated Memory and FIFO Support: 73,728 bits of embedded SRAM with programmable FIFO control logic reduces external memory requirements and simplifies buffering designs.
  • High I/O Count and Flexibility: 336 user I/Os with mixed-voltage and differential-standard support allow direct interfacing to multiple system buses and high-speed links.
  • Deterministic Performance: Segmentable clocks, embedded PLLs and user-controllable timing support precision timing and reliable synchronous design.
  • Military-Grade Thermal Range: −55 °C to 125 °C rating supports deployment in harsh-environment systems.
  • Compact System Footprint: 676-FBGA package provides high pin density for complex designs while enabling space-efficient board layouts.

Why Choose AX500-FGG676M?

The AX500-FGG676M brings together antifuse nonvolatile programming, a high logic-element count and integrated SRAM into a single, military-grade FPGA package. Its blend of deterministic timing, embedded FIFO capability and flexible, high-speed I/O makes it well suited for secure, high-performance applications where long-term reliability and design protection are priorities.

Designers and system integrators will find the AX500-FGG676M appropriate for compact, rugged deployments that require reduced external BOM, stable timing behavior and hardware-level IP protection, backed by Axcelerator family architecture and Microchip's in-system diagnostic features.

Request a quote or submit a price inquiry to evaluate the AX500-FGG676M for your next secure, high-performance FPGA design.

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