AX500-FGG484M

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 136 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FGG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

The AX500-FGG484M is an Axcelerator FPGA from Microchip Technology that implements the AX architecture on a CMOS antifuse process. It delivers a single-chip, nonvolatile FPGA solution with embedded SRAM/FIFO control logic, segmentable clocks and integrated PLLs for system-level timing flexibility.

Engineered for demanding environments, this military-grade device supports a wide operating range (−55°C to 125°C) and a core supply of 1.425 V to 1.575 V, making it suitable for secure, high-reliability embedded designs that require on-chip nonvolatile configuration and robust I/O performance.

Key Features

  • Core Architecture & Performance  AX architecture using CMOS antifuse process with seven metal layers; datasheet reports system performance of 350+ MHz and internal performance of 500+ MHz.
  • Logic Capacity  Contains 8064 logic elements and approximately 500,000 equivalent system gates for mid-range FPGA implementations.
  • Embedded Memory  73,728 total RAM bits (approximately 0.074 Mbits) organized as variable-aspect RAM blocks with embedded FIFO control logic.
  • I/O and Interfaces  317 user I/Os with support for multi-standard operation including LVDS-capable I/Os (700 Mb/s capable) and mixed-voltage I/O operation per family features.
  • Clocking and PLLs  Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
  • Packaging & Mounting  484-ball fine-pitch BGA (484-FPBGA, 23×23 footprint) in a surface-mount package for high-density board designs.
  • Power  Core supply voltage 1.425 V to 1.575 V for low-voltage operation.
  • Temperature & Grade  Military grade device with operating temperature range −55°C to 125°C.
  • Security & Reliability  Single-chip nonvolatile programming and FuseLock™ programming technology to protect design IP against reverse engineering.
  • Compliance  RoHS-compliant for environmental requirements.

Typical Applications

  • Military & Aerospace Systems  High-reliability, military-grade logic and nonvolatile configuration for avionics, mission systems, and rugged embedded controllers operating across −55°C to 125°C.
  • High-Speed Communications  LVDS-capable I/Os and integrated PLLs enable high-speed serial links and timing-critical data paths in communications and backplane interfaces.
  • Secure Embedded Processing  FuseLock™ programming and antifuse nonvolatile configuration suit secure systems that require design protection and persistent logic functionality.
  • Signal Processing and Data Acquisition  On-chip RAM/FIFO blocks and 500+ MHz internal performance support buffering, streaming, and deterministic timing for signal-processing pipelines.

Unique Advantages

  • Nonvolatile, Single-Chip Solution: Provides persistent configuration without external configuration memories, simplifying system startup and reducing BOM.
  • Design Security Built-In: FuseLock™ and antifuse technology protect intellectual property and help guard against reverse engineering.
  • Deterministic Timing and Integrated PLLs: Segmentable clocks and on-chip PLLs enable precise, user-controllable timing and frequency synthesis up to 1 GHz.
  • Mid-Range Capacity with Embedded Memory: 8064 logic elements and approximately 0.074 Mbits of embedded RAM/FIFO enable complex logic and buffering in a compact device.
  • Rugged Operating Range: Military-grade temperature rating (−55°C to 125°C) and RoHS compliance for demanding environments and regulatory requirements.
  • High-Density BGA Packaging: 484-ball FPBGA (23×23) surface-mount package supports dense board integration and reliable board-level mounting.

Why Choose AX500-FGG484M?

The AX500-FGG484M blends antifuse nonvolatile technology, secure programming, and mid-range logic capacity to address designs that require both performance and IP protection. With integrated PLLs, segmentable clocks and embedded FIFO-capable memory, it supports deterministic timing and high-bandwidth data paths while reducing external component count.

This device is well suited to customers building military or other high-reliability embedded systems who need a compact, secure FPGA with verified temperature, power and I/O characteristics. Microchip’s Axcelerator family features underpin consistent design choices across projects that require persistent configuration and robust system-level capabilities.

Request a quote or submit an inquiry to receive pricing and availability details for the AX500-FGG484M and discuss how it can meet your design requirements.

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