AX500-FGG484M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA |
|---|---|
| Quantity | 136 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-FGG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA
The AX500-FGG484M is an Axcelerator FPGA from Microchip Technology that implements the AX architecture on a CMOS antifuse process. It delivers a single-chip, nonvolatile FPGA solution with embedded SRAM/FIFO control logic, segmentable clocks and integrated PLLs for system-level timing flexibility.
Engineered for demanding environments, this military-grade device supports a wide operating range (−55°C to 125°C) and a core supply of 1.425 V to 1.575 V, making it suitable for secure, high-reliability embedded designs that require on-chip nonvolatile configuration and robust I/O performance.
Key Features
- Core Architecture & Performance AX architecture using CMOS antifuse process with seven metal layers; datasheet reports system performance of 350+ MHz and internal performance of 500+ MHz.
- Logic Capacity Contains 8064 logic elements and approximately 500,000 equivalent system gates for mid-range FPGA implementations.
- Embedded Memory 73,728 total RAM bits (approximately 0.074 Mbits) organized as variable-aspect RAM blocks with embedded FIFO control logic.
- I/O and Interfaces 317 user I/Os with support for multi-standard operation including LVDS-capable I/Os (700 Mb/s capable) and mixed-voltage I/O operation per family features.
- Clocking and PLLs Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
- Packaging & Mounting 484-ball fine-pitch BGA (484-FPBGA, 23×23 footprint) in a surface-mount package for high-density board designs.
- Power Core supply voltage 1.425 V to 1.575 V for low-voltage operation.
- Temperature & Grade Military grade device with operating temperature range −55°C to 125°C.
- Security & Reliability Single-chip nonvolatile programming and FuseLock™ programming technology to protect design IP against reverse engineering.
- Compliance RoHS-compliant for environmental requirements.
Typical Applications
- Military & Aerospace Systems High-reliability, military-grade logic and nonvolatile configuration for avionics, mission systems, and rugged embedded controllers operating across −55°C to 125°C.
- High-Speed Communications LVDS-capable I/Os and integrated PLLs enable high-speed serial links and timing-critical data paths in communications and backplane interfaces.
- Secure Embedded Processing FuseLock™ programming and antifuse nonvolatile configuration suit secure systems that require design protection and persistent logic functionality.
- Signal Processing and Data Acquisition On-chip RAM/FIFO blocks and 500+ MHz internal performance support buffering, streaming, and deterministic timing for signal-processing pipelines.
Unique Advantages
- Nonvolatile, Single-Chip Solution: Provides persistent configuration without external configuration memories, simplifying system startup and reducing BOM.
- Design Security Built-In: FuseLock™ and antifuse technology protect intellectual property and help guard against reverse engineering.
- Deterministic Timing and Integrated PLLs: Segmentable clocks and on-chip PLLs enable precise, user-controllable timing and frequency synthesis up to 1 GHz.
- Mid-Range Capacity with Embedded Memory: 8064 logic elements and approximately 0.074 Mbits of embedded RAM/FIFO enable complex logic and buffering in a compact device.
- Rugged Operating Range: Military-grade temperature rating (−55°C to 125°C) and RoHS compliance for demanding environments and regulatory requirements.
- High-Density BGA Packaging: 484-ball FPBGA (23×23) surface-mount package supports dense board integration and reliable board-level mounting.
Why Choose AX500-FGG484M?
The AX500-FGG484M blends antifuse nonvolatile technology, secure programming, and mid-range logic capacity to address designs that require both performance and IP protection. With integrated PLLs, segmentable clocks and embedded FIFO-capable memory, it supports deterministic timing and high-bandwidth data paths while reducing external component count.
This device is well suited to customers building military or other high-reliability embedded systems who need a compact, secure FPGA with verified temperature, power and I/O characteristics. Microchip’s Axcelerator family features underpin consistent design choices across projects that require persistent configuration and robust system-level capabilities.
Request a quote or submit an inquiry to receive pricing and availability details for the AX500-FGG484M and discuss how it can meet your design requirements.

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