AX500-FG676I

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 527 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC, 336 I/Os, ~0.074 Mbits RAM, 676-FBGA (27×27)

The AX500-FG676I is an Axcelerator antifuse FPGA from Microchip Technology, delivering high-density programmable logic and on-chip nonvolatile configuration. Built on the AX architecture and a 0.15 μm CMOS antifuse process, this device addresses designs that require deterministic timing, multi-standard I/O flexibility, and embedded memory/FIFO capabilities.

Targeted at applications demanding robust I/O bandwidth, embedded buffering and secure single-chip programmability, the AX500-FG676I combines performance-focused silicon with industrial temperature rating and RoHS compliance.

Key Features

  • Core & Architecture  500,000 equivalent system gates and 8,064 logic elements provide a high-density logic fabric for complex functions; antifuse-based, nonvolatile single-chip configuration reduces the need for external bitstream storage.
  • Embedded Memory & FIFOs  Approximately 0.074 Mbits of on-chip RAM (73,728 total bits) with embedded FIFO control logic and 16 core RAM blocks for width-configurable read/write ports.
  • I/O Flexibility  336 user I/Os with support for multi-standard operation and high-speed differential signaling (LVDS-capable I/Os up to 700 Mb/s as specified for the Axcelerator family); bank-selectable, mixed-voltage I/O operation is supported by the device family.
  • Clocking & Performance  Segmentable clock resources and integrated PLLs provide deterministic, user-controllable timing; family-level performance targets include 350+ MHz system and 500+ MHz internal performance.
  • Power & Supply  Core supply range of 1.425 V to 1.575 V (nominal 1.5 V core voltage) for low-power operation consistent with the Axcelerator family.
  • Package & Mounting  676-ball fine BGA (676-FBGA, 27×27) surface-mount package for compact board integration and footprint-compatible packaging.
  • Environmental & Reliability  Industrial operating temperature range of −40 °C to +85 °C and RoHS-compliant construction for regulated-environment designs.
  • Security & Diagnostics  Antifuse, FuseLock™ programming technology offers protection against reverse engineering; in-system diagnostic and debug capabilities are available within the Axcelerator device family.

Typical Applications

  • High-speed serial interfaces  Use the device’s LVDS-capable I/Os and wide I/O count for protocol bridging, SERDES front-ends, and interface aggregation where deterministic timing is required.
  • Embedded buffering and packet processing  Leverage embedded RAM and programmable FIFO control logic for packet buffering, temporary data storage, and stream-width conversion in communication systems.
  • Industrial control and automation  Industrial temperature rating and robust I/O flexibility make the device suitable for motor control, sensor aggregation, and custom control logic in industrial equipment.

Unique Advantages

  • High-density programmable logic: 500,000 equivalent system gates and 8,064 logic elements enable consolidation of complex functions onto a single device, reducing component count.
  • Nonvolatile single-chip solution: Antifuse technology removes the need for external configuration memory, simplifying system design and improving boot determinism.
  • Built-in embedded memory and FIFO control: On-chip RAM and FIFO logic reduce external memory requirements and streamline high-throughput data paths.
  • Flexible, high-speed I/O: 336 I/Os with multi-standard and differential capability support diverse signaling requirements across mixed-voltage domains.
  • Industrial temperature and RoHS compliance: Designed to operate from −40 °C to +85 °C and meet RoHS environmental requirements for regulated deployments.
  • Security and diagnostics: FuseLock programming and family diagnostic features support protection against reverse engineering and in-system debug.

Why Choose AX500-FG676I?

The AX500-FG676I positions itself as a robust, high-density Axcelerator FPGA option for engineers who need deterministic performance, flexible high-speed I/O, and embedded memory/FIFO resources in a single, nonvolatile device. Its industrial temperature rating and RoHS compliance make it appropriate for demanding embedded and communication applications.

For designs seeking to reduce BOM complexity while maintaining secure, high-performance programmable logic, the AX500-FG676I offers a compact 676-FBGA footprint and the architectural features of the Axcelerator family, including integrated PLLs, segmentable clocks and in-system diagnostic capabilities.

Request a quote or submit an inquiry to learn about availability, ordering options, and integration support for the AX500-FG676I.

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