AX500-FG676I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA |
|---|---|
| Quantity | 527 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 336 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC, 336 I/Os, ~0.074 Mbits RAM, 676-FBGA (27×27)
The AX500-FG676I is an Axcelerator antifuse FPGA from Microchip Technology, delivering high-density programmable logic and on-chip nonvolatile configuration. Built on the AX architecture and a 0.15 μm CMOS antifuse process, this device addresses designs that require deterministic timing, multi-standard I/O flexibility, and embedded memory/FIFO capabilities.
Targeted at applications demanding robust I/O bandwidth, embedded buffering and secure single-chip programmability, the AX500-FG676I combines performance-focused silicon with industrial temperature rating and RoHS compliance.
Key Features
- Core & Architecture 500,000 equivalent system gates and 8,064 logic elements provide a high-density logic fabric for complex functions; antifuse-based, nonvolatile single-chip configuration reduces the need for external bitstream storage.
- Embedded Memory & FIFOs Approximately 0.074 Mbits of on-chip RAM (73,728 total bits) with embedded FIFO control logic and 16 core RAM blocks for width-configurable read/write ports.
- I/O Flexibility 336 user I/Os with support for multi-standard operation and high-speed differential signaling (LVDS-capable I/Os up to 700 Mb/s as specified for the Axcelerator family); bank-selectable, mixed-voltage I/O operation is supported by the device family.
- Clocking & Performance Segmentable clock resources and integrated PLLs provide deterministic, user-controllable timing; family-level performance targets include 350+ MHz system and 500+ MHz internal performance.
- Power & Supply Core supply range of 1.425 V to 1.575 V (nominal 1.5 V core voltage) for low-power operation consistent with the Axcelerator family.
- Package & Mounting 676-ball fine BGA (676-FBGA, 27×27) surface-mount package for compact board integration and footprint-compatible packaging.
- Environmental & Reliability Industrial operating temperature range of −40 °C to +85 °C and RoHS-compliant construction for regulated-environment designs.
- Security & Diagnostics Antifuse, FuseLock™ programming technology offers protection against reverse engineering; in-system diagnostic and debug capabilities are available within the Axcelerator device family.
Typical Applications
- High-speed serial interfaces Use the device’s LVDS-capable I/Os and wide I/O count for protocol bridging, SERDES front-ends, and interface aggregation where deterministic timing is required.
- Embedded buffering and packet processing Leverage embedded RAM and programmable FIFO control logic for packet buffering, temporary data storage, and stream-width conversion in communication systems.
- Industrial control and automation Industrial temperature rating and robust I/O flexibility make the device suitable for motor control, sensor aggregation, and custom control logic in industrial equipment.
Unique Advantages
- High-density programmable logic: 500,000 equivalent system gates and 8,064 logic elements enable consolidation of complex functions onto a single device, reducing component count.
- Nonvolatile single-chip solution: Antifuse technology removes the need for external configuration memory, simplifying system design and improving boot determinism.
- Built-in embedded memory and FIFO control: On-chip RAM and FIFO logic reduce external memory requirements and streamline high-throughput data paths.
- Flexible, high-speed I/O: 336 I/Os with multi-standard and differential capability support diverse signaling requirements across mixed-voltage domains.
- Industrial temperature and RoHS compliance: Designed to operate from −40 °C to +85 °C and meet RoHS environmental requirements for regulated deployments.
- Security and diagnostics: FuseLock programming and family diagnostic features support protection against reverse engineering and in-system debug.
Why Choose AX500-FG676I?
The AX500-FG676I positions itself as a robust, high-density Axcelerator FPGA option for engineers who need deterministic performance, flexible high-speed I/O, and embedded memory/FIFO resources in a single, nonvolatile device. Its industrial temperature rating and RoHS compliance make it appropriate for demanding embedded and communication applications.
For designs seeking to reduce BOM complexity while maintaining secure, high-performance programmable logic, the AX500-FG676I offers a compact 676-FBGA footprint and the architectural features of the Axcelerator family, including integrated PLLs, segmentable clocks and in-system diagnostic capabilities.
Request a quote or submit an inquiry to learn about availability, ordering options, and integration support for the AX500-FG676I.

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