AX500-FG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA |
|---|---|
| Quantity | 36 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-FG484I – Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA
The AX500-FG484I is an Axcelerator-series antifuse FPGA built on Microchip's AX architecture, delivering a nonvolatile, single-chip programmable logic solution. It provides deterministic timing, segmentable clocking and embedded SRAM/FIFO control logic for designs that require secure, high-performance programmable logic.
With 500,000 equivalent system gates and support for on-chip PLLs and high-speed I/Os, the device targets industrial embedded designs that need integration of logic, memory and high-speed interfacing within a 484-ball FPBGA package.
Key Features
- Core Capacity Approximately 500,000 equivalent system gates implemented as 8,064 logic elements, enabling mid-range FPGA integration for control and datapath functions.
- Embedded Memory Approximately 0.074 Mbits of embedded SRAM (73,728 bits) with variable-aspect RAM blocks and programmable FIFO control logic for buffering and packet staging.
- I/O and Interfaces 317 user I/Os with support for multi-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and differential standards such as LVDS; I/Os are bank-selectable and include programmable slew and drive strength.
- Clocking and PLLs Segmentable clock resources and embedded PLLs providing frequency synthesis and deterministic, user-controllable timing for synchronized system designs.
- Performance and Signaling Series-level performance capabilities include 350+ MHz system performance and 500+ MHz internal performance, and support for 700 Mb/s LVDS-capable I/Os.
- Nonvolatile Antifuse Technology Single-chip, nonvolatile programming with FuseLock programming technology for protection against reverse engineering.
- Package and Thermal 484-FPBGA (23 × 23) surface-mount package; industrial temperature grade with operating range −40°C to 85°C.
- Power Core supply range specified at 1.425 V to 1.575 V to support the device’s low-voltage core operation.
- Compliance RoHS-compliant manufacturing.
Typical Applications
- Secure Embedded Controllers Nonvolatile antifuse programming and FuseLock technology make the device suitable for designs requiring hardware-level IP protection and in-field programmability without volatile configuration storage.
- Protocol Bridging and Packet Buffering On-chip SRAM and programmable FIFOs enable efficient data buffering and width conversion for protocol gateways and bridge functions.
- High-Speed Serial Interfaces LVDS-capable I/Os and high internal performance support SERDES-adjacent interfaces and other high-speed signaling tasks up to listed LVDS rates.
- Industrial Control Systems Industrial temperature grade and a robust I/O feature set make the device suitable for factory automation, motor control front-ends and embedded supervisory logic.
Unique Advantages
- Nonvolatile, Single-Chip Solution: Antifuse-based programming removes the need for external configuration memory and enables immediate, permanent configuration at power-up.
- Deterministic Timing: Segmentable clocks and embedded PLLs provide predictable timing behavior important for real-time and synchronous systems.
- Integrated Memory and FIFO Support: Embedded SRAM blocks with configurable widths and FIFO control reduce external memory dependence and simplify data-path design.
- Flexible I/O Standards: Bank-selectable, mixed-voltage I/Os and programmable drive/slew settings support interfacing to a wide range of logic families and signaling levels.
- Industrial Temperature Rating: Rated for −40°C to 85°C operation to meet common industrial environmental requirements.
- Design Security: FuseLock programming technology helps protect design IP from reverse engineering.
Why Choose AX500-FG484I?
The AX500-FG484I balances mid-range logic capacity with embedded memory and high-speed I/O capabilities in a nonvolatile antifuse FPGA. Its AX architecture features segmentable clocks, PLLs and programmable FIFOs that help simplify system-level integration while delivering deterministic timing and on-chip data buffering.
This device is well suited to customers building industrial embedded systems, protocol bridges, secure controllers and high-speed I/O applications that benefit from a single-chip, nonvolatile programmable solution with RoHS compliance and an industrial temperature range.
Request a quote or submit an inquiry to receive pricing and availability for the AX500-FG484I and to discuss how it fits your project requirements.

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