AX500-FG676M

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 581 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FG676M – Axcelerator Field Programmable Gate Array (FPGA) IC, 336 I/O, 73,728-bit RAM, 676‑BGA

The AX500-FG676M is an Axcelerator family antifuse FPGA offering a nonvolatile, single‑chip solution built on Microchip's AX architecture. It combines high system and internal performance with on‑chip embedded SRAM/FIFO control and flexible I/O support to address secure, high‑performance digital designs.

This device targets system‑level applications that require deterministic timing, design security and extended temperature operation. Key capabilities include segmentable clock resources, on‑chip PLLs and chip‑wide routing that enable complex logic integration and high‑speed interfaces.

Key Features

  • Core Capacity & Logic: Approximately 500,000 equivalent system gates and 8,064 logic elements provide substantial logic density for complex designs.
  • Embedded Memory & FIFOs: Approximately 73,728 total RAM bits with embedded FIFO control logic and variable-aspect 4,608‑bit RAM blocks for width and depth configurability.
  • High Performance: Family-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance, supporting demanding timing requirements.
  • Clocking & PLLs: Segmentable clock resources with embedded PLLs (14–200 MHz input range) and frequency synthesis capabilities up to 1 GHz enable flexible clock management.
  • Flexible I/O Standards: 336 user I/Os with bank‑selectable, mixed‑voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single‑ended and differential standards including LVDS and LVPECL; 700 Mb/s LVDS capable I/Os.
  • Nonvolatile, Secure Programming: Antifuse programming technology with FuseLock™ protection to guard against reverse engineering and design theft.
  • Package & Mounting: 676‑BGA (676‑FBGA, 27 × 27) package, surface‑mount construction for high‑density PCB integration.
  • Power & Temperature: Core supply range 1.425 V to 1.575 V and qualified for military grade operating temperatures from −55 °C to 125 °C.
  • Standards & Testability: Boundary‑scan testing compliant with IEEE 1149.1 (JTAG) and unique in‑system diagnostic and debug capability via Microchip Silicon Explorer II.
  • Environmental Compliance: RoHS‑compliant.

Typical Applications

  • Defense and Aerospace Systems: Military grade temperature range and antifuse nonvolatile programming make the AX500‑FG676M suitable for mission‑critical avionics and defense logic functions.
  • High‑Performance Signal Processing: High internal and system performance, combined with large logic capacity and embedded FIFOs, supports digital signal processing and data‑path acceleration.
  • Secure, Custom Logic Implementations: FuseLock and antifuse programming protect intellectual property for secure control, encryption, or proprietary state machines.
  • High‑Speed Interface Control: LVDS‑capable I/Os and bank‑selectable mixed‑voltage support enable implementation of high‑speed serial interfaces and multi‑standard bridging.

Unique Advantages

  • Nonvolatile Single‑Chip Solution: Antifuse technology eliminates the need for external configuration memory and supports immediate post‑power functionality.
  • Design Security: FuseLock programming protects against reverse engineering and unauthorized reads of the programmed design.
  • High Logic Density: 8,064 logic elements and roughly 500,000 equivalent gates allow consolidation of complex functions into a single device to reduce system BOM.
  • Integrated Memory and FIFO Control: On‑chip SRAM and programmable FIFO logic simplify data buffering and interface staging without external memory.
  • Flexible I/O and Clocking: Bank‑selectable mixed‑voltage I/Os, differential standard support and embedded PLLs enable versatile interface and clocking architectures.
  • Mil‑Grade Reliability: Specified operating range from −55 °C to 125 °C and military grade classification for robust performance in harsh environments.

Why Choose AX500-FG676M?

The AX500‑FG676M combines antifuse nonvolatile programming, strong design security and high logic and memory capacity in a single FPGA package. Its balance of performance (system and internal), embedded SRAM/FIFO capability and flexible I/O makes it well suited for projects that require deterministic timing, secure programming and robust operation across a wide temperature range.

Choose this device when you need a compact, secure FPGA solution that consolidates complex logic and high‑speed interfaces while delivering longevity and design protection across the Axcelerator family.

Request a quote or submit a purchase inquiry today to learn more about deploying the AX500‑FG676M in your next high‑performance, secure design.

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