AX500-FG676

The AX500-FG676 is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology built on the AX architecture and CMOS antifuse process. It delivers high logic density and on-chip memory with a nonvolatile single-chip solution suitable for commercial embedded systems.

With 500,000 equivalent system gates, 8,064 logic elements, 336 user I/Os and embedded RAM/FIFO resources, this device targets designs requiring high internal performance, flexible I/O standards and secure programmable logic.

Key Features

• Core Capacity  500,000 equivalent system gates and approximately 8,064 logic elements (cells) provide significant logic integration for medium-to-high complexity designs.
• Performance  Datasheet-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
• Embedded Memory & FIFOs  73,728 total on-chip RAM bits (approximately 0.074 Mbits) with variable-aspect RAM blocks and programmable embedded FIFO control logic for buffering and packet handling.
• I/O Flexibility  336 user I/Os with bank-selectable operation and support for multiple voltage standards (1.5V, 1.8V, 2.5V, 3.3V) plus differential and single-ended standards; LVDS-capable I/Os with 700 Mb/s capability.
• Clocking & PLL  Segmentable clock resources and embedded PLL(s) with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz enable flexible clock architectures.
• Security & Nonvolatile Programming  Antifuse programming technology provides a nonvolatile single-chip solution and FuseLock programming protects against reverse engineering and design theft.
• Package & Power  Surface-mount 676-FBGA (27 × 27 mm) package; core voltage 1.425 V to 1.575 V; commercial-grade operation 0 °C to 70 °C; RoHS compliant.
• Design & Test Support  Deterministic timing, boundary-scan (IEEE 1149.1) support and in-system diagnostic/debug capability with Microchip Silicon Explorer II enhance bring-up and validation.

Typical Applications

• High-speed data aggregation  Use embedded FIFOs, on-chip SRAM and LVDS-capable I/Os to aggregate and buffer high-rate data streams.
• Protocol bridging and system glue  Large logic capacity and mixed-voltage I/O support allow implementation of protocol conversion, interface bridging and control logic.
• Packet buffering and processing  On-chip RAM blocks with independent, width-configurable ports and FIFO control are well suited for packet buffering and streaming applications.
• Deterministic control and timing  Segmentable clocks and PLL frequency synthesis enable reliable timing in systems that require deterministic behavior.

Unique Advantages

• Highly integrated 500k-gate device: Reduces external glue logic by consolidating complex functions into a single FPGA.
• Flexible, multi-standard I/O: Bank-selectable I/Os and support for a wide range of voltage and differential standards simplify mixed-signal system designs.
• Nonvolatile antifuse technology with FuseLock: Provides a single-chip nonvolatile solution and protection against reverse engineering for secure designs.
• Embedded memory with FIFO control: Built-in RAM blocks and programmable FIFO logic reduce the need for external memory in buffering and streaming tasks.
• Deterministic timing and in-system debug: Deterministic timing resources plus Microchip Silicon Explorer II support speed validation and fault diagnosis during development.
• Commercial-grade, RoHS-compliant packaging: Surface-mount 676-FBGA package with defined commercial operating range and RoHS compliance for standard embedded applications.

Why Choose AX500-FG676?

The AX500-FG676 positions itself as a high-density, nonvolatile FPGA offering a balanced combination of logic capacity, embedded memory and flexible I/O for commercial embedded systems. Its antifuse programming and FuseLock protection provide a secure, single-chip solution where design confidentiality and deterministic performance matter.

This device suits customers building medium-to-high complexity designs that require significant on-chip resources, programmable FIFOs, and mixed-voltage I/O support while operating within a commercial temperature range. The combination of PLL clocking, embedded SRAM and extensive I/O makes it a compelling option for system designers seeking integration and predictable timing behavior.

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