AX500-FG484

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 852 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-FG484 – Axcelerator FPGA – 500,000 equivalent system gates, 484‑BGA

The AX500-FG484 is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology built on the AX architecture and CMOS antifuse process. This single-chip, nonvolatile solution combines high internal performance, embedded SRAM/FIFO control logic and flexible multi-standard I/Os for designs that require deterministic timing, on-chip buffering and high-speed interfaces.

Designed for commercial applications, the device delivers a balance of logic density, embedded memory and high-speed I/O capability in a 484‑ball BGA surface-mount package, with a 1.425 V to 1.575 V core supply and 0 °C to 70 °C operating range.

Key Features

  • Logic Capacity — 500,000 equivalent system gates with 8,064 logic elements, enabling substantial on-chip logic integration for complex designs.
  • Embedded Memory — 73,728 total RAM bits (approximately 0.074 Mbits) with embedded FIFO control logic for efficient data buffering and packet handling.
  • High-Performance Architecture — System-level capabilities include segmentable clocks and high internal-performance figures cited in the family datasheet (350+ MHz system performance, 500+ MHz internal performance).
  • Flexible Multi‑Standard I/Os — 317 user I/Os with support for mixed-voltage operation and bank-selectable I/O standards (1.5 V, 1.8 V, 2.5 V, 3.3 V) and differential standards such as LVDS; datasheet indicates LVDS-capable I/Os up to 700 Mb/s.
  • Clocking and PLLs — Embedded phase-locked loop support (14–200 MHz input range) with frequency synthesis capabilities reported up to 1 GHz for advanced clock management.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ programming technology to protect designs against reverse engineering.
  • Package and Mounting — Surface-mount 484‑BGA (supplier package: 484‑FPBGA, 23×23) for compact PCB integration.
  • Power and Temperature — Core supply range of 1.425 V to 1.575 V; commercial-grade operating range of 0 °C to 70 °C.
  • Standards and Tools — Includes boundary-scan (IEEE 1149.1/JTAG) and in-system diagnostic/debug capability noted in the family datasheet.
  • RoHS Compliant — Meets RoHS requirements for environmental compliance.

Typical Applications

  • High‑Speed Data Interfaces — LVDS-capable I/Os and embedded FIFO logic support high-throughput serial channels and lane buffering.
  • Protocol Bridging and Packet Handling — Embedded SRAM/FIFO and extensive internal routing are suitable for protocol conversion, packet buffering and data re-timing tasks.
  • Clock‑Critical Systems — Segmentable clocks and on-chip PLLs enable complex clock-domain management and deterministic timing control.
  • Custom Logic Acceleration — Dense logic capacity and on-chip memory make the device suitable for accelerating application-specific datapaths and control logic.

Unique Advantages

  • High-density integration: 500,000 equivalent system gates and 8,064 logic elements reduce the need for multiple devices and simplify board-level BOM.
  • On-chip buffering: Approximately 0.074 Mbits of embedded RAM with FIFO control logic supports efficient data flow management without external memory.
  • Deterministic timing and clock synthesis: Segmentable clocks plus embedded PLLs provide precise, controllable timing for multi-domain systems.
  • Flexible I/O standards: Bank-selectable I/Os and multi-voltage operation enable straightforward interfacing to a wide range of peripherals and transceivers.
  • Nonvolatile security: Antifuse-based, single-chip programming and FuseLock™ protect intellectual property and prevent reverse engineering.
  • Commercial readiness: Surface-mount 484‑BGA packaging and RoHS compliance simplify manufacturing integration for commercial applications.

Why Choose AX500-FG484?

The AX500-FG484 positions itself as a compact, high-capacity Axcelerator FPGA option for commercial designs that demand significant on-chip logic, embedded memory and high-speed interface flexibility. Its antifuse, nonvolatile architecture combined with PLL-based clocking and FIFO-capable embedded RAM delivers a deterministic, secure platform for designers implementing complex datapaths and timing-critical subsystems.

Choose this device when you need a single-chip solution that consolidates logic, buffering and multi-standard I/O support in a 484‑BGA surface-mount package, while operating within a commercial temperature range and RoHS-compliant manufacturing requirements.

Request a quote or submit a sales inquiry to get pricing, availability and technical information for the AX500-FG484.

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