AX500-FG484
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA |
|---|---|
| Quantity | 852 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-FG484 – Axcelerator FPGA – 500,000 equivalent system gates, 484‑BGA
The AX500-FG484 is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology built on the AX architecture and CMOS antifuse process. This single-chip, nonvolatile solution combines high internal performance, embedded SRAM/FIFO control logic and flexible multi-standard I/Os for designs that require deterministic timing, on-chip buffering and high-speed interfaces.
Designed for commercial applications, the device delivers a balance of logic density, embedded memory and high-speed I/O capability in a 484‑ball BGA surface-mount package, with a 1.425 V to 1.575 V core supply and 0 °C to 70 °C operating range.
Key Features
- Logic Capacity — 500,000 equivalent system gates with 8,064 logic elements, enabling substantial on-chip logic integration for complex designs.
- Embedded Memory — 73,728 total RAM bits (approximately 0.074 Mbits) with embedded FIFO control logic for efficient data buffering and packet handling.
- High-Performance Architecture — System-level capabilities include segmentable clocks and high internal-performance figures cited in the family datasheet (350+ MHz system performance, 500+ MHz internal performance).
- Flexible Multi‑Standard I/Os — 317 user I/Os with support for mixed-voltage operation and bank-selectable I/O standards (1.5 V, 1.8 V, 2.5 V, 3.3 V) and differential standards such as LVDS; datasheet indicates LVDS-capable I/Os up to 700 Mb/s.
- Clocking and PLLs — Embedded phase-locked loop support (14–200 MHz input range) with frequency synthesis capabilities reported up to 1 GHz for advanced clock management.
- Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ programming technology to protect designs against reverse engineering.
- Package and Mounting — Surface-mount 484‑BGA (supplier package: 484‑FPBGA, 23×23) for compact PCB integration.
- Power and Temperature — Core supply range of 1.425 V to 1.575 V; commercial-grade operating range of 0 °C to 70 °C.
- Standards and Tools — Includes boundary-scan (IEEE 1149.1/JTAG) and in-system diagnostic/debug capability noted in the family datasheet.
- RoHS Compliant — Meets RoHS requirements for environmental compliance.
Typical Applications
- High‑Speed Data Interfaces — LVDS-capable I/Os and embedded FIFO logic support high-throughput serial channels and lane buffering.
- Protocol Bridging and Packet Handling — Embedded SRAM/FIFO and extensive internal routing are suitable for protocol conversion, packet buffering and data re-timing tasks.
- Clock‑Critical Systems — Segmentable clocks and on-chip PLLs enable complex clock-domain management and deterministic timing control.
- Custom Logic Acceleration — Dense logic capacity and on-chip memory make the device suitable for accelerating application-specific datapaths and control logic.
Unique Advantages
- High-density integration: 500,000 equivalent system gates and 8,064 logic elements reduce the need for multiple devices and simplify board-level BOM.
- On-chip buffering: Approximately 0.074 Mbits of embedded RAM with FIFO control logic supports efficient data flow management without external memory.
- Deterministic timing and clock synthesis: Segmentable clocks plus embedded PLLs provide precise, controllable timing for multi-domain systems.
- Flexible I/O standards: Bank-selectable I/Os and multi-voltage operation enable straightforward interfacing to a wide range of peripherals and transceivers.
- Nonvolatile security: Antifuse-based, single-chip programming and FuseLock™ protect intellectual property and prevent reverse engineering.
- Commercial readiness: Surface-mount 484‑BGA packaging and RoHS compliance simplify manufacturing integration for commercial applications.
Why Choose AX500-FG484?
The AX500-FG484 positions itself as a compact, high-capacity Axcelerator FPGA option for commercial designs that demand significant on-chip logic, embedded memory and high-speed interface flexibility. Its antifuse, nonvolatile architecture combined with PLL-based clocking and FIFO-capable embedded RAM delivers a deterministic, secure platform for designers implementing complex datapaths and timing-critical subsystems.
Choose this device when you need a single-chip solution that consolidates logic, buffering and multi-standard I/O support in a 484‑BGA surface-mount package, while operating within a commercial temperature range and RoHS-compliant manufacturing requirements.
Request a quote or submit a sales inquiry to get pricing, availability and technical information for the AX500-FG484.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D