AX500-2PQ208I

IC FPGA 115 I/O 208QFP
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 115 73728 208-BFQFP

Quantity 428 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case208-BFQFPNumber of I/O115Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2PQ208I – Axcelerator FPGA, 115 I/O, 73,728-bit RAM, 208-BFQFP

The AX500-2PQ208I is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX architecture and antifuse CMOS process. This single‑chip, nonvolatile FPGA combines deterministic timing, embedded SRAM/FIFO control logic and flexible multi‑standard I/Os for system-level designs that require performance and design security.

Targeted at industrial applications, the device offers 500,000 equivalent system gates, 8,064 logic elements and approximately 0.074 Mbits of embedded memory, delivering a compact, surface‑mount solution in a 208‑pin BFQFP package for mid-density FPGA requirements.

Key Features

  • Core & Performance  500,000 equivalent system gates and 8,064 logic elements provide the programmable resources for mid-density designs. Datasheet family characteristics indicate system performance above 350 MHz and internal performance above 500 MHz.
  • Memory & FIFO  Approximately 73,728 bits of embedded SRAM with programmable FIFO control logic for buffering and data‑stream management in high‑throughput designs.
  • I/O Flexibility  115 user I/Os on this variant with support for multi‑standard, bank‑selectable I/O operation. Family features include LVDS capable I/Os (up to 700 Mb/s) and a wide range of single‑ended and differential I/O standards.
  • Power & Voltage  Core voltage specified at approximately 1.5 V with an operating supply window of 1.425 V to 1.575 V, enabling low‑power core operation consistent with the Axcelerator family.
  • Package & Mounting  208‑BFQFP (supplier device package 208‑PQFP, 28 × 28) surface‑mount package suitable for streamlined PCB assembly and board‑level integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 85 °C, meeting industrial temperature requirements for deployed systems.
  • Security & Reliability  Antifuse, single‑chip nonvolatile implementation and FuseLock™ programming technology (family feature) for enhanced design security and protection against reverse engineering.
  • Manufacturing Technology  Built on advanced 0.15 μm CMOS antifuse process with seven metal layers (family characteristic) to support higher routing density and performance.
  • Standards & Testability  Boundary‑scan testing compliant with IEEE 1149.1 (JTAG) and unique in‑system diagnostic/debug capability (family feature) to simplify development and manufacturing test.

Typical Applications

  • Industrial Control  Implement real‑time control logic, motor control interfaces and deterministic timing blocks using the device’s logic elements, embedded memory and PLL resources.
  • High‑Speed Data Interfaces  Use LVDS‑capable I/Os and embedded FIFO control to manage high‑throughput serial links and board‑to‑board data channels.
  • Communication and Networking Subsystems  Leverage the device’s programmable I/O standards and embedded memory for protocol bridging, packet buffering and timing‑sensitive datapaths.
  • Secure, Nonvolatile Implementations  Deploy a single‑chip nonvolatile solution where design security and in‑field robustness are required, using antifuse programming and FuseLock protection.

Unique Advantages

  • Deterministic, Nonvolatile Platform: Antifuse-based, single‑chip nonvolatile architecture ensures fixed, repeatable timing and inherent configuration protection across power cycles.
  • Mid‑Density Integration: 8,064 logic elements and 500,000 gates pack significant programmable logic into a compact footprint, reducing the need for external glue logic.
  • Embedded Memory with FIFO Support: On‑chip SRAM blocks and programmable FIFO control simplify buffering and dataflow management without external memory components.
  • Flexible I/O Options: Multi‑standard, bank‑selectable I/Os and LVDS capability support mixed‑voltage interfaces and high‑speed links on the same device.
  • Industrial Rating and Surface‑Mount Packaging: Industrial temperature rating (−40 °C to 85 °C) and 208‑pin BFQFP surface‑mount package ease deployment in ruggedized and space‑constrained boards.
  • Proven Process Technology: Manufactured on a 0.15 μm CMOS antifuse process with seven metal layers to deliver reliable routing density and performance.

Why Choose AX500-2PQ208I?

The AX500-2PQ208I positions itself as a robust, mid‑density Axcelerator FPGA offering a balance of programmable logic capacity, embedded memory and flexible I/O in an industrial‑rated, surface‑mount package. Its antifuse nonvolatile architecture and FuseLock programming support designs that prioritize security, deterministic timing and long‑term configuration stability.

This variant is well suited for engineers building industrial control systems, high‑speed data interfaces and secure embedded subsystems who need a compact FPGA with on‑chip SRAM/FIFO support, LVDS capable I/Os and proven manufacturing technology from Microchip.

Request a quote or submit a purchase inquiry for AX500-2PQ208I today referencing the exact part number to begin procurement or volume planning.

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