AX500-2FGG676

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 1,305 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FGG676 – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

The AX500-2FGG676 is an Axcelerator antifuse FPGA based on Microchip's AX architecture, delivering a single-chip, nonvolatile solution for high-performance, deterministic logic designs. It combines on-chip programmable logic, embedded SRAM/FIFO control, segmentable clocks and integrated PLLs to address system-level tasks that require high throughput and predictable timing.

This device targets applications that need a balance of logic capacity, embedded memory and high-speed I/O capability while operating in commercial temperature environments.

Key Features

  • Core Capacity — 500,000 equivalent system gates and 8,064 logic elements provide substantial programmable logic for mid-range FPGA designs.
  • Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) with variable-aspect 4,608-bit RAM blocks and configurable read/write ports; includes embedded FIFO control logic.
  • I/O and Interface Flexibility — 336 user I/Os with support for multi-standard, bank-selectable I/Os; family-level support includes differential LVDS capable at 700 Mb/s and programmable slew rate/drive strength.
  • High Performance and Timing — Family datasheet specifies 350+ MHz system performance and 500+ MHz internal performance, segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis up to 1 GHz.
  • Power — Core voltage supply specified at 1.425 V to 1.575 V (1.5 V nominal) for low-power core operation.
  • Package and Mounting — 676-FBGA (27×27) package / 676-BGA, surface-mount device, RoHS compliant.
  • Security and Testability — Single-chip nonvolatile antifuse programming with FuseLock™ protection and IEEE 1149.1 (JTAG) boundary-scan support for board-level test and IP protection.
  • Commercial Grade — Operating temperature range 0 °C to 70 °C suitable for commercial applications.

Typical Applications

  • High-speed data transport and buffering — Embedded FIFOs and high-performance internal logic enable low-latency data paths and buffering between subsystems.
  • Interface bridging and protocol adaptation — Multi-standard I/Os and LVDS-capable channels support protocol conversion and aggregation between mixed-voltage interfaces.
  • Deterministic control and timing-sensitive logic — Segmentable clocks, PLLs and user-controllable timing make the device suitable for designs that require predictable timing behavior.

Unique Advantages

  • Highly integrated FPGA: Combines substantial logic capacity with embedded SRAM and FIFO control to reduce external components and simplify board design.
  • Deterministic performance: Segmentable clock resources and controllable timing features help ensure repeatable, predictable system timing.
  • High-speed I/O capability: 336 I/Os and LVDS-capable channels support robust, high-throughput interface implementations.
  • Nonvolatile security: Antifuse programming and FuseLock technology protect bitstream and design IP on-chip without external configuration memory.
  • Test and diagnostics: IEEE 1149.1 JTAG boundary-scan and in-system diagnostic capabilities assist in board-level test and debug.
  • Standards-driven I/O flexibility: Family-level support for multiple single-ended and differential standards plus programmable I/O attributes enables mixed-voltage systems.

Why Choose AX500-2FGG676?

The AX500-2FGG676 positions itself as a mid-capacity, high-performance Axcelerator FPGA that combines 500k equivalent gates, 8,064 logic elements and embedded SRAM to address demanding logic, buffering and interface tasks while maintaining deterministic timing. Its antifuse, single-chip nonvolatile nature and FuseLock protection are aimed at designs where on-chip security and reliability are priorities.

This part is well suited for designers seeking a commercial-grade FPGA with strong on-chip memory and high-speed I/O capabilities, packaged in a 676-FBGA surface-mount form factor and supported by family-level features such as PLLs, segmentable clocks and embedded FIFO control.

Request a quote or submit a product inquiry to obtain pricing and availability for AX500-2FGG676 and to discuss how it fits your next design.

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