AX500-2FGG676
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA |
|---|---|
| Quantity | 1,305 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 336 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-2FGG676 – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA
The AX500-2FGG676 is an Axcelerator antifuse FPGA based on Microchip's AX architecture, delivering a single-chip, nonvolatile solution for high-performance, deterministic logic designs. It combines on-chip programmable logic, embedded SRAM/FIFO control, segmentable clocks and integrated PLLs to address system-level tasks that require high throughput and predictable timing.
This device targets applications that need a balance of logic capacity, embedded memory and high-speed I/O capability while operating in commercial temperature environments.
Key Features
- Core Capacity — 500,000 equivalent system gates and 8,064 logic elements provide substantial programmable logic for mid-range FPGA designs.
- Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) with variable-aspect 4,608-bit RAM blocks and configurable read/write ports; includes embedded FIFO control logic.
- I/O and Interface Flexibility — 336 user I/Os with support for multi-standard, bank-selectable I/Os; family-level support includes differential LVDS capable at 700 Mb/s and programmable slew rate/drive strength.
- High Performance and Timing — Family datasheet specifies 350+ MHz system performance and 500+ MHz internal performance, segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis up to 1 GHz.
- Power — Core voltage supply specified at 1.425 V to 1.575 V (1.5 V nominal) for low-power core operation.
- Package and Mounting — 676-FBGA (27×27) package / 676-BGA, surface-mount device, RoHS compliant.
- Security and Testability — Single-chip nonvolatile antifuse programming with FuseLock™ protection and IEEE 1149.1 (JTAG) boundary-scan support for board-level test and IP protection.
- Commercial Grade — Operating temperature range 0 °C to 70 °C suitable for commercial applications.
Typical Applications
- High-speed data transport and buffering — Embedded FIFOs and high-performance internal logic enable low-latency data paths and buffering between subsystems.
- Interface bridging and protocol adaptation — Multi-standard I/Os and LVDS-capable channels support protocol conversion and aggregation between mixed-voltage interfaces.
- Deterministic control and timing-sensitive logic — Segmentable clocks, PLLs and user-controllable timing make the device suitable for designs that require predictable timing behavior.
Unique Advantages
- Highly integrated FPGA: Combines substantial logic capacity with embedded SRAM and FIFO control to reduce external components and simplify board design.
- Deterministic performance: Segmentable clock resources and controllable timing features help ensure repeatable, predictable system timing.
- High-speed I/O capability: 336 I/Os and LVDS-capable channels support robust, high-throughput interface implementations.
- Nonvolatile security: Antifuse programming and FuseLock technology protect bitstream and design IP on-chip without external configuration memory.
- Test and diagnostics: IEEE 1149.1 JTAG boundary-scan and in-system diagnostic capabilities assist in board-level test and debug.
- Standards-driven I/O flexibility: Family-level support for multiple single-ended and differential standards plus programmable I/O attributes enables mixed-voltage systems.
Why Choose AX500-2FGG676?
The AX500-2FGG676 positions itself as a mid-capacity, high-performance Axcelerator FPGA that combines 500k equivalent gates, 8,064 logic elements and embedded SRAM to address demanding logic, buffering and interface tasks while maintaining deterministic timing. Its antifuse, single-chip nonvolatile nature and FuseLock protection are aimed at designs where on-chip security and reliability are priorities.
This part is well suited for designers seeking a commercial-grade FPGA with strong on-chip memory and high-speed I/O capabilities, packaged in a 676-FBGA surface-mount form factor and supported by family-level features such as PLLs, segmentable clocks and embedded FIFO control.
Request a quote or submit a product inquiry to obtain pricing and availability for AX500-2FGG676 and to discuss how it fits your next design.

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