AX500-2FG676I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA |
|---|---|
| Quantity | 1,647 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 336 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8064 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of AX500-2FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA
The AX500-2FG676I is an Axcelerator family FPGA built on Microchip's AX architecture and antifuse CMOS process. This nonvolatile single-chip FPGA delivers a combination of dense logic resources, embedded SRAM/FIFO capability and flexible, multi-standard I/O for designs that require high-performance programmable logic and deterministic timing.
Key use cases include systems that need extensive I/O connectivity, on-chip memory/FIFO control and high internal clock performance; the device targets industrial applications with its specified -40°C to 85°C operating range and 676-ball FBGA packaging.
Key Features
- Core Architecture AX architecture with antifuse-based, single-chip nonvolatile programming and deterministic timing behavior.
- Logic Capacity Approximately 8,064 logic elements supporting complex combinatorial and sequential logic implementations.
- Gate Equivalent 500,000 equivalent gates to support medium-to-high complexity designs.
- Embedded Memory Approximately 73,728 bits of embedded RAM with configurable block organizations and embedded FIFO control logic for data buffering and streaming tasks.
- I/O Flexibility 336 user I/Os with multi-standard support including single-ended and differential standards; LVDS-capable channels up to 700 Mb/s are supported per device family documentation.
- Clocking and PLLs Segmentable clock resources and embedded PLLs enable frequency synthesis and clock distribution suited for high-performance timing requirements.
- Power and Voltage Core supply voltage range specified at 1.425 V to 1.575 V for stable core operation.
- Package and Mounting 676-FBGA (27 × 27 mm) surface-mount package for dense board integration.
- Industrial Temperature Grade Rated for operation from -40°C to 85°C to meet industrial environment requirements.
- Security and Programming FuseLock™ programming technology provides protection against reverse engineering and design theft as part of the antifuse programming approach.
Typical Applications
- High-speed data interfaces — Uses the device's LVDS-capable I/Os and embedded FIFOs for reliable, high-throughput serial and parallel data buffering and transfer.
- Telecommunications and networking — Programmable logic and PLL-based clock synthesis support timing-critical packet processing and protocol bridging tasks.
- Industrial control — Industrial temperature rating and extensive I/O make the AX500-2FG676I suitable for motor control, sensor aggregation and deterministic control logic.
- Embedded system integration — On-chip RAM and configurable logic enable protocol translation, custom peripherals, and glue-logic consolidation to simplify system designs.
Unique Advantages
- Nonvolatile antifuse architecture: Eliminates the need for external configuration memory and ensures instant-on, single-chip programmability.
- High I/O count with multi-standard support: 336 user I/Os and bank-selectable, mixed-voltage operation simplify integration with diverse I/O standards on the same board.
- Embedded SRAM and FIFO control: Approximately 73,728 bits of on-chip RAM with FIFO support reduce external memory requirements for buffering and streaming applications.
- Deterministic timing and PLLs: Segmentable clocks and on-chip PLLs support precise timing architectures and frequency synthesis up to the device family’s documented capability.
- Industrial temperature rating: Specified for -40°C to 85°C operation to support deployment in industrial environments.
- Security features: FuseLock™ programming technology helps protect intellectual property and prevents reverse engineering.
Why Choose AX500-2FG676I?
The AX500-2FG676I positions itself as a robust, nonvolatile FPGA option for designers who need a balance of logic density, sizable on-chip memory and a large, flexible I/O set in a single-package solution. Its antifuse programming, embedded FIFO capability and segmentable clock resources make it well suited to deterministic, performance-sensitive designs in industrial and communications applications.
For teams looking to consolidate board-level functions, reduce external configuration components and leverage a secure, single-chip programmable device, the AX500-2FG676I offers a combination of performance, integration and industrial-grade operating range to support long-term deployments.
Request a quote or submit a pricing inquiry to evaluate the AX500-2FG676I for your next design.

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