AX500-2FG676I

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 1,647 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

The AX500-2FG676I is an Axcelerator family FPGA built on Microchip's AX architecture and antifuse CMOS process. This nonvolatile single-chip FPGA delivers a combination of dense logic resources, embedded SRAM/FIFO capability and flexible, multi-standard I/O for designs that require high-performance programmable logic and deterministic timing.

Key use cases include systems that need extensive I/O connectivity, on-chip memory/FIFO control and high internal clock performance; the device targets industrial applications with its specified -40°C to 85°C operating range and 676-ball FBGA packaging.

Key Features

  • Core Architecture AX architecture with antifuse-based, single-chip nonvolatile programming and deterministic timing behavior.
  • Logic Capacity Approximately 8,064 logic elements supporting complex combinatorial and sequential logic implementations.
  • Gate Equivalent 500,000 equivalent gates to support medium-to-high complexity designs.
  • Embedded Memory Approximately 73,728 bits of embedded RAM with configurable block organizations and embedded FIFO control logic for data buffering and streaming tasks.
  • I/O Flexibility 336 user I/Os with multi-standard support including single-ended and differential standards; LVDS-capable channels up to 700 Mb/s are supported per device family documentation.
  • Clocking and PLLs Segmentable clock resources and embedded PLLs enable frequency synthesis and clock distribution suited for high-performance timing requirements.
  • Power and Voltage Core supply voltage range specified at 1.425 V to 1.575 V for stable core operation.
  • Package and Mounting 676-FBGA (27 × 27 mm) surface-mount package for dense board integration.
  • Industrial Temperature Grade Rated for operation from -40°C to 85°C to meet industrial environment requirements.
  • Security and Programming FuseLock™ programming technology provides protection against reverse engineering and design theft as part of the antifuse programming approach.

Typical Applications

  • High-speed data interfaces — Uses the device's LVDS-capable I/Os and embedded FIFOs for reliable, high-throughput serial and parallel data buffering and transfer.
  • Telecommunications and networking — Programmable logic and PLL-based clock synthesis support timing-critical packet processing and protocol bridging tasks.
  • Industrial control — Industrial temperature rating and extensive I/O make the AX500-2FG676I suitable for motor control, sensor aggregation and deterministic control logic.
  • Embedded system integration — On-chip RAM and configurable logic enable protocol translation, custom peripherals, and glue-logic consolidation to simplify system designs.

Unique Advantages

  • Nonvolatile antifuse architecture: Eliminates the need for external configuration memory and ensures instant-on, single-chip programmability.
  • High I/O count with multi-standard support: 336 user I/Os and bank-selectable, mixed-voltage operation simplify integration with diverse I/O standards on the same board.
  • Embedded SRAM and FIFO control: Approximately 73,728 bits of on-chip RAM with FIFO support reduce external memory requirements for buffering and streaming applications.
  • Deterministic timing and PLLs: Segmentable clocks and on-chip PLLs support precise timing architectures and frequency synthesis up to the device family’s documented capability.
  • Industrial temperature rating: Specified for -40°C to 85°C operation to support deployment in industrial environments.
  • Security features: FuseLock™ programming technology helps protect intellectual property and prevents reverse engineering.

Why Choose AX500-2FG676I?

The AX500-2FG676I positions itself as a robust, nonvolatile FPGA option for designers who need a balance of logic density, sizable on-chip memory and a large, flexible I/O set in a single-package solution. Its antifuse programming, embedded FIFO capability and segmentable clock resources make it well suited to deterministic, performance-sensitive designs in industrial and communications applications.

For teams looking to consolidate board-level functions, reduce external configuration components and leverage a secure, single-chip programmable device, the AX500-2FG676I offers a combination of performance, integration and industrial-grade operating range to support long-term deployments.

Request a quote or submit a pricing inquiry to evaluate the AX500-2FG676I for your next design.

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