AX500-2FG676

IC FPGA 336 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 336 73728 676-BGA

Quantity 961 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O336Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FG676 – Axcelerator Field Programmable Gate Array (FPGA) IC, 336 I/O, 73,728-bit Embedded RAM, 676-FBGA

The AX500-2FG676 is an Axcelerator family antifuse FPGA from Microchip Technology, built on the AX architecture for a nonvolatile, single-chip programmable solution. With 336 user I/Os, approximately 73.7 kbits of embedded RAM, and 8,064 logic elements, the device targets high-performance, secure embedded logic implementations across telecom, industrial control, and data processing systems. Its combination of on-chip memory, segmented clock resources and programmable I/O standards delivers integration and deterministic timing for complex digital designs.

Key Features

  • Core / Architecture AX antifuse architecture providing a single-chip, nonvolatile FPGA solution with deterministic, user-controllable timing.
  • Logic Capacity 8,064 logic elements and approximately 500,000 equivalent system gates for mid-range logic integration.
  • Embedded Memory & FIFOs 73,728 bits of embedded SRAM/FIFO across 16 core RAM blocks with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic.
  • I/O Flexibility 336 user I/Os with support for mixed-voltage operation and differential standards; family-level support for LVDS and 700 Mb/s capable I/Os, bank-selectable I/Os (8 banks), registered I/Os and programmable slew/drive settings.
  • Performance Family-level system performance greater than 350 MHz and internal performance beyond 500 MHz, with segmentable clock resources and embedded PLLs for clock synthesis and distribution.
  • Security & Programming Nonvolatile antifuse implementation with FuseLock™ programming technology to protect designs from reverse engineering and unauthorized copying.
  • Power & Supply Core voltage operating range of 1.425 V to 1.575 V for low-voltage core operation.
  • Package & Mounting 676-ball fine BGA package (676-FBGA, 27 × 27) in a surface-mount form factor suitable for dense board-level integration.
  • Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 70 °C and RoHS compliance.

Typical Applications

  • Telecom and Networking: Implement protocol offload, packet processing or custom interface bridging using large I/O counts and embedded FIFOs for data buffering.
  • Industrial Control: Use deterministic timing, segmented clocks and flexible I/Os for motor control, machine automation logic and sensor aggregation.
  • Data Acquisition & Processing: Integrate high-speed I/O and on-chip RAM/FIFO to build front-end data concentrators, preprocessors or buffering stages.
  • Secure Embedded Logic: Deploy nonvolatile antifuse programming and FuseLock protection where IP protection and one-time programmable configuration are required.

Unique Advantages

  • Nonvolatile Single-Chip Solution: Eliminates the need for external configuration memory and ensures immediate operation on power-up.
  • Deterministic Timing: Segmentable clocks, embedded PLLs and user-controllable timing simplify timing closure for real-time and latency-sensitive designs.
  • High I/O Integration: 336 user I/Os and bank-selectable mixed-voltage support reduce board-level complexity when interfacing multiple standards and devices.
  • On-Chip Memory and FIFOs: Approximately 73.7 kbits of embedded RAM and programmable FIFO control reduce external memory requirements for streaming and buffering tasks.
  • IP Protection: FuseLock programming technology provides protection against reverse engineering and design theft for secure applications.
  • Compact, Surface-Mount Packaging: 676-FBGA (27 × 27) enables high-density PCB layouts while supporting robust board-level integration.

Why Choose AX500-2FG676?

The AX500-2FG676 balances mid-range logic capacity with extensive I/O and embedded memory to address a broad set of embedded applications that require nonvolatile configuration, deterministic timing and on-chip buffering. It is well-suited for designers who need a secure, compact FPGA with flexible I/O standards and programmable memory/FIFO resources.

With commercial-grade temperature support, RoHS compliance and the Axcelerator family feature set—segmentable clocks, embedded PLLs, and FuseLock protection—this device provides a robust platform for deploying reliable, long-lived digital logic in telecom, industrial and data processing systems.

Request a quote or submit a product inquiry to check availability, lead times and volume pricing for the AX500-2FG676.

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