AX500-2FGG484

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

Quantity 525 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8064Number of Logic Elements/Cells8064
Number of Gates500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of AX500-2FGG484 – Axcelerator Field Programmable Gate Array (FPGA) IC 317 73728 484-BGA

The AX500-2FGG484 is a commercial-grade Axcelerator FPGA from Microchip Technology built on the AX architecture and CMOS antifuse process. It delivers a single-chip, nonvolatile programmable solution with deterministic timing, embedded memory and on-chip PLLs for designs that require high internal performance and secure configuration.

With 500,000 equivalent system gates, 8,064 logic elements and 73,728 bits of embedded RAM/FIFO, this 484-ball BGA package targets system-level integration tasks such as high-performance embedded logic, communications I/O handling and secure single-chip implementations within a 0 °C to 70 °C operating window.

Key Features

  • Core Capacity and Architecture — 500,000 equivalent system gates and 8,064 logic elements based on the Axcelerator (AX) family architecture.
  • Embedded Memory — Approximately 0.074 Mbits (73,728 bits) of embedded SRAM/FIFO with programmable FIFO control logic and variable-aspect RAM block organization available in the Axcelerator family.
  • I/O and Interface Flexibility — 317 user I/Os with multi-standard, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V); family-level support for differential standards such as LVDS and LVPECL and LVDS capability up to 700 Mb/s.
  • Performance and Clocking — Family-documented system performance above 350 MHz and internal performance beyond 500 MHz, with segmentable clock resources and embedded PLLs for frequency synthesis.
  • Programmability and Security — Single-chip, nonvolatile antifuse programming with FuseLock™ programming technology to protect design IP against reverse engineering.
  • Power and Package — Core supply voltage range 1.425 V to 1.575 V; supplied in a 484-ball FPBGA surface-mount package (23 × 23 mm footprint) for compact board integration.
  • Commercial Grade and Compliance — Commercial temperature grade (0 °C to 70 °C) and RoHS-compliant.

Typical Applications

  • Embedded System Acceleration — Implement custom datapaths, protocol handling, and tight timing logic in a single nonvolatile device to reduce system complexity.
  • High-Speed I/O and Interface Bridging — Use the device’s multi-standard I/Os and LVDS-capable channels for board-level interface adaptation and high-throughput serial links.
  • Secure, One-Time Programmable Designs — Leverage antifuse programming and FuseLock technology for applications where configuration security and IP protection are required.
  • ASIC Replacement and Low-Volume Production — Deploy ASIC-like performance and deterministic timing on a programmable device for cost-effective low-to-medium volume designs.

Unique Advantages

  • Deterministic, Nonvolatile Configuration: Antifuse programming provides a one-time, nonvolatile configuration that eliminates dependence on external configuration memory.
  • High Internal Throughput: Documented family internal performance over 500 MHz supports demanding on-chip logic and data paths.
  • Flexible Mixed-Voltage I/Os: Bank-selectable, multi-standard I/O support enables direct interfacing with a wide range of external logic levels and protocols.
  • Integrated Clock and PLL Resources: Segmentable clocks and embedded PLLs enable precise timing control and frequency synthesis for complex systems.
  • Compact, Surface-Mount Packaging: 484-FPBGA (23 × 23) offers a high pin-count, compact footprint for dense board designs.

Why Choose AX500-2FGG484?

The AX500-2FGG484 combines 500k equivalent system gates, 8,064 logic elements and embedded SRAM/FIFO in a single, secure antifuse FPGA. Its AX architecture and family-level features—segmentable clocks, embedded PLLs and flexible I/O—are aimed at designs that need deterministic timing, high internal performance and on-chip memory in a commercial-grade part.

This device is well suited for engineers and teams building secure, performance-driven systems that benefit from single-chip integration, reduced external BOM and RoHS-compliant packaging. Its package, voltage range and specified operating temperature make it straightforward to integrate into standard commercial electronic assemblies.

Request a quote or submit an inquiry to receive pricing and availability for AX500-2FGG484 and to discuss volume options and lead times.

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